Table Of Contents - Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz Design Manuallines

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Contents
1. Introduction .................................................................................................................................. 7
1.1. Document Scope............................................................................................................. 7
1.2. References ...................................................................................................................... 7
1.3. Definition of Terms .......................................................................................................... 8
2. Importance of Thermal Management........................................................................................... 9
3. FC-PGA2 Processor Packaging Technology............................................................................. 11
4. Thermal Specifications............................................................................................................... 13
4.1. Processor Case Temperature ....................................................................................... 13
5. Designing for Thermal Performance.......................................................................................... 15
5.1. Airflow Management...................................................................................................... 15
5.2. Recommended Fan Performance and Limitations........................................................ 16
5.3. Bypass........................................................................................................................... 16
5.4. Heatsink Solutions and Keep-in Areas .......................................................................... 16
5.5. Thermal Interface Management .................................................................................... 16
5.5.1.
5.5.2.
5.5.3.
5.6. Fans............................................................................................................................... 17
5.6.1.
5.6.2.
5.6.3.
5.6.4.
6. Alternative Cooling Solutions ..................................................................................................... 21
6.1. Ducting .......................................................................................................................... 21
6.1.1.
6.2. System Components ..................................................................................................... 21
6.2.1.
6.2.2.
7. Thermal Metrology for FC-PGA2 Packaged Processors ........................................................... 23
7.1. Thermal Resistance ...................................................................................................... 23
7.2. Thermal Solution Performance ..................................................................................... 24
7.3. Local-ambient Temperature Measurement Guidelines ................................................. 25
7.3.1.
7.3.2.
7.4. Processor Measurements for Thermal Specifications .................................................. 26
7.4.1.
7.4.2.
7.4.3.
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Intel Pentium
Bond Line Thickness ................................................................................... 17
Interface Material Area ................................................................................ 17
Interface Material Performance................................................................... 17
Placement ................................................................................................... 18
Fan Direction ............................................................................................... 18
Size and Quantity ........................................................................................ 18
Venting ........................................................................................................ 18
5.6.4.1. Placement....................................................................................... 18
5.6.4.2. Area and Size ................................................................................. 18
5.6.4.3. Vent Shape ..................................................................................... 19
Ducting Placement ...................................................................................... 21
Placement ................................................................................................... 21
Power ........................................................................................................ 21
Local-ambient Temperature Measurement for a Passive Heatsink ............ 25
Local-ambient Temperature Measurement for an Active Heatsink............. 26
Processor Case Temperature Measurements ............................................ 27
7.4.1.1. Heatsink Preparation ...................................................................... 30
About the High Power Application ............................................................... 31
Executing the High Power Application Software ......................................... 31
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III Processor in the FC-PGA2 Package Thermal Design Guidelines
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