Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775 Tray Design Manual page 5

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Intel Core 2 Duo E6400, E4300, and Intel
Figures
1 Package IHS Load Areas ........................................................................................... 11
2 Processor Case Temperature Measurement Location ..................................................... 15
3 Example Thermal Profile ........................................................................................... 16
4 Processor Thermal Characterization Parameter Relationships ......................................... 22
5 Locations for Measuring Local Ambient Temperature, Active Heatsink.............................. 24
6 Locations for Measuring Local Ambient Temperature, Passive Heatsink ............................ 25
7 Concept for Clocks under Thermal Monitor Control........................................................ 28
8 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 29
9 T for Digital Thermal Sensor ............................................................................. 32
CONTROL
10 Thermal Characterization Parameters for Various Operating Conditions ........................... 34
11 PICMG 1.3 Copper Heatsink....................................................................................... 35
12 PICMG 1.3 Heatsink Performance ............................................................................... 36
13 Intel® QST Overview ............................................................................................... 39
14 PID Controller Fundamentals ..................................................................................... 40
15 Intel® QST Platform Requirements............................................................................. 41
16 Example Acoustic Fan Speed Control Implementation.................................................... 42
17 Digital Thermal Sensor and Thermistor ...................................................................... 43
18 Board Deflection Definition ........................................................................................ 46
19 Example: Defining Heatsink Preload Meeting Board Deflection Limit ................................ 48
20 PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling
Components, Primary Side ........................................................................................ 54
21 PICMG 1.3 Motherboard Keep-out, Secondary Side ....................................................... 55
Tables
1 Referenced Documents ............................................................................................... 9
2 Terms Used............................................................................................................... 9
3 Thermal Characterization Parameter at various T
4 Board Deflection Configuration Definitions ................................................................... 45
5 Intel Reference Component PICMG 1.3 Thermal Solution Providers ................................. 56
October 2007
Order Number: 315279 - 003US
® ®
Pentium Dual-Core E2160 Processor
LA
® TM
Intel Core 2 Duo E6400, E4300, and Intel
's..................................................... 33
® ®
Pentium Dual-Core E2160 Processor
TDG
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