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measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at
each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above
measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) may be
used to make the hot checks, leakage current mu3st not exceed 1/
2 milliamp. In case a measurement is outsideof the limits
specified, there is a possibility of a shock hazard, and the
equipment should be repaired and rechecked before it is returned
to the customer.
2. PREVENTION OF ELECTRO STATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical
ES devices are integrated circuits and some field-effect transistorsand semiconductor "chip"
components. The following techniques should be used to help reduce the incidence of
component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and
wear a commercially available discharging ESD wrist strap,
whichshould be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,
place the assembly on a conductive surface such as alminum foil,
to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder removal device. Some solder
removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
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