Maintenance/Expansion; Hot Swap/Hot Expansion; Eternus Dx60 S5; Table 112 Hot Swap And Hot Expansion Availability For Components (Eternus Dx60 S5) - Fujitsu ETERNUS DX S5 Series Design Manual

7.

Maintenance/Expansion

Hot Swap/Hot Expansion

"Hot swap" refers to the replacement of components or updating of the firmware while the system is running.
"Hot expansion" refers to the addition of components while the system is running.

ETERNUS DX60 S5

The table below shows whether hot swap or hot expansion for components of the ETERNUS DX60 S5 is possible.
Table 112 Hot Swap and Hot Expansion Availability for Components (ETERNUS DX60 S5)
Component
Controller enclosure (CE)
Controller module (CM)
System memory
BBU
BUD
Controller firmware
SFP+
iSCSI port
SAS port
Power supply unit (PSU)
Disk (HDD)
SSD
Operation panel (PANEL)
Disk firmware
Drive enclosure (DE)
Power supply unit (PSU)
Disk (HDD)
SSD
Operation panel (PANEL)
I/O module (IOM)
Disk firmware
¡: Allowed / ´: Not allowed (cold swap is possible) / —: Not applicable
*1: Mid Plane. This is a board that is located between the front (drive side) and rear (controller (CM) or I/O module (IOM) side) of the
ETERNUS DX.
*2: When a multipath configuration is used, switch to the host paths of the CM that will not have maintenance performed to continue
operation.
*3: An I/O suspension may be required depending on the firmware changes.
*4: Operation can be continued during a failure. The status of the ETERNUS DX can be monitored via ETERNUS Web GUI or ETERNUS CLI.
Hot swap Hot expansion
´ —
¡ (*2) —
¡ (*2) —
—
¡ (*2)
¡ (*2) —
¡ (*2) (*3) —
¡ (*2) ¡
—
¡
—
¡
¡ —
¡ ¡
¡ ¡
´ (*4)
—
¡ (*3) —
¡ ¡
—
¡
¡ ¡
¡ ¡
´ (*4)
—
—
¡
—
¡ (*3)
301
Remarks
Replace the controller enclosure (CE)
when the MP (*1) fails.
—
—
—
—
—
—
—
—
—
—
—
—
—
Replace the drive enclosure (DE)
when the MP (*1) fails.
—
—
—
—
—
—
Design Guide