Note For Printed Wiring Board And Schematic Diagrams - Sony MZ-N10 Notes: installing & operating OpenMG Service Manual

MZ-N10
Ver 1.2 2003.02

6-2. Note for Printed Wiring Board and Schematic Diagrams

Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• MAIN board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been
included in this diagrams.
* Replacement of IC501,IC801 on MAIN board requires a
special tool.
surface
• Lead Layouts
Lead layout of conventional IC CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1 / W or less unless otherwise
4
specified.
• % : indicates tolerance.
• : internal component.
f
• C : panel designation.
Note: Note:
The components identified by Les composants identifiés par
mark 0 or dotted line with mark une marque 0 sont critiques
0 are critical for safety.
pour la sécurité.
Replace only with part number Ne les remplacer que par une
specified. pièce portant le numéro spécifié.
• A : B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 6 V and fed with regulated dc power
supply from TP1976(+),TP1953(-) on MAIN board.
+side :TP1976(CN952 q;pin)
-side :TP1953(CN952 1pin)
• Voltages and waveforms are dc with respect to ground in
playback mode(servo on).
no mark : PLAYBACK(SERVO ON)
∗ : Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: PLAYBACK
c : DIGITAL IN
F
: ANALOG IN
f
: RECORD
N
: USB
* Replacement of IC501,IC801 on MAIN board requires a
special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
When IC851 is damaged, replace the MAIN board.
38
• Waveforms
1 4
IC801 2 (OSCO) IC501 rd (TE)(SL501)
(at the point of R806)
910mVp-p
44.3ns 1.6Vp-p
500mV/DIV, 20ns/DIV 500mV/DIV, 1ms/DIV
2 5
IC801 <z,/ (UOSCO) IC501 rs (FE)(SL502)
(USB VBUS=5V)
(at the point of R823)
240mVp-p
20.8ns
3.2Vp-p
1V/DIV, 10ns/DIV 500mV/DIV, 1ms/DIV
3 6
IC501 9 (RFO)(TP1529) IC601 qk (CLK)
2.4Vp-p
5.67 µ s
1.3Vp-p
500mV/DIV, 200ns/DIV 1V/DIV, 2 µ s/DIV
38
7 0
IC901 yd (CLK) IC301 8 (BCLK)(REC)
2.4Vp-p
2.5Vp-p
5.67 µ s 354ns
1V/DIV, 2 µ s/DIV 1V/DIV, 100ns/DIV
8 qa
IC862 8 (OSCOUT) IC301 q; (LRCK)(REC)
1.1Vp-p
30.5 µ s
22.7 µ s
2.5Vp-p
500mV/DIV, 10 µ s/DIV 1V/DIV, 10 µ s/DIV
9
IC301 9 (MCLK)
88.6ns
2.6Vp-p
1V/DIV, 40ns/DIV