Note For Printed Wiring Board And Schematic Diagrams - Sony Walkman MZ-N910 Service Manual

MZ-N910

6-2. Note for Printed Wiring Board and Schematic Diagrams

Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• MAIN board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been
included in this diagrams.
* Replacement of IC501,IC801 on MAIN board requires a
special tool.
surface
• Lead Layouts
Lead layout of conventional IC CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• % : indicates tolerance.
• : internal component.
f
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• Total current is measured with MD installed.
• Power voltage is dc 3.0V and fed with regulated dc power
supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground in
playback mode(servo on).
no mark : PLAYBACK(SERVO ON)
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: PLAYBACK
c : DIGITAL IN
F
: ANALOG IN
f
: RECORD
• Abbreviation
3CED : Spanish, Swedish, Portuguese and Finnish model
4CED : French, German, Dutch model
* Replacement of IC501,IC801 on MAIN board requires a
special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
When IC851 is damaged, replace the MAIN board.
38
• Waveforms
1 4
IC501 9 (RFO)(AP1517) IC601 4 (CLK)
2.4Vp-p
5.67 µ s
1.4Vp-p
1V/DIV, 2 µ s/DIV
500mV/DIV, 200ns/DIV
2 5
IC501 rd (TE)(SL501) IC801 2 (OSCO)
(at the point of R806)
560mVp-p
44.3ns 2Vp-p
500mV/DIV, 1ms/DIV 500mV/DIV, 20ns/DIV
3 6
IC501 rs (FE)(SL502) IC801 <z,/ (UOSCO)
(USB mode)
(at the point of R823)
300mVp-p
20.8ns
3.2Vp-p
200mV/DIV, 1ms/DIV 1V/DIV, 10ns/DIV
38
7 0
IC901 yd (CLK) IC301 q; (LRCK)
2.4Vp-p
(REC mode)
22.7 µ s
2.4Vp-p
5.67 µ s
1V/DIV, 2 µ s/DIV 1V/DIV, 10 µ s/DIV
8
IC301 9 (MCLK)
88.6ns
2.5Vp-p
1V/DIV, 40ns/DIV
9
IC301 8 (BCLK)
(REC mode)
2.5Vp-p
354ns
1V/DIV, 100ns/DIV