IBM DS3500 Installation, User's, And Maintenance Manual page 188

EXP3500 storage enclosure (continued)
Overview 1-3
EXP3500 storage enclosure,
overview 1-3
EXP3512 storage enclosure parts
listing 7-1
EXP3524 storage enclosure parts
listing 7-3
F
fault LED
battery 4-9
dc power supply 4-8
drive 5-12
ESM 4-14
power supply 4-7
FCC Class A notice C-4
features and operating specifications 1-4
fiber optic cable, handling 3-5
Fibre Channel
connections 3-37
host loop configurations 3-38
LC-SC cable adapter, using 3-12
field replaceable units (FRUs) 7-1
filler panels 5-12
firmware levels, determining 1-14
firmware updates 4-6
front controls and indicators
drive 1-9
G
gaseous contamination C-3
Germany Class A statement C-5
getting help B-2
H
hardware fault LEDs 4-7
hardware service and support telephone
numbers B-2
health check process 4-1
heat dissipation 1-20
heat output 1-20
heat output specifications 1-4
help
getting B-1
help, World Wide Web B-2
host adapter, connecting to
controller 3-34
host bus adapter, connecting to
controller 3-28, 3-39, 3-45
host port adapter
about 1-11
additional host connectors 4-9
installing 5-9
LEDs 4-9
requirements 5-3
host-agent management method 3-26
hot-swap
controllers 5-1
drive bays 1-8, 4-8, 5-12
drive LEDs described 5-12
hardware 5-12
power supplies 5-1, 5-21, 5-26
X-2
System Storage DS3500 and EXP3500: Installation, User's, and Maintenance Guide
hot-swap components
drive 1-9
hot-swap drives
installing 5-15
removing 5-13
replacing 5-15, 5-16
working with 5-12
humidity specifications 1-4
I
IBM Taiwan product service B-3
identification numbers A-1
important notices 1-3, C-2
in-band management method 3-26
Industry Canada Class A emission
compliance statement C-4
information center B-2
information record, storage subsystem
and controller A-2
installation
into a rack 2-1
preparation 2-3
installing
additional ESM 5-37
installing and replacing devices
battery 5-31
components 5-1
controllers 5-5
DIMM 5-33
filler panels 5-12
host port adapters 5-9
hot-swap drives 5-12
memory cache DIMM 5-33
midplane assembly 5-38
power supplies 5-21, 5-26
Introduction 1-1
inventory checklist 2-1, 2-5
J
Japan Electronics and Information
Technology Industries Association
statement C-6
JEITA statement C-6
L
LC-LC Fibre Channel cable 3-9
connecting to an SFP module 3-9
latches and lever 3-14
removing 3-11
LC-SC Fibre Channel cable adapter
connecting to a device 3-13
protective caps 3-13
removing an LC-LC Fibre Channel
cable 3-14
using 3-12
LEDs
ac power supply 4-7
cache battery 4-20
controller 4-9
DC power supply 4-8
diagnostic 4-12
drive 5-12
during power-on 4-7
LEDs (continued)
front bezel 4-8
overtemperature 4-8
system error 4-8
system locator 4-8
loop configurations
overview 3-38
redundant 3-38
M
memory, cache
cache active LED 4-20
size of 4-20
midplane assembly
installing 5-38
Models and optional devices 1-5
multiple drives, replacing 5-17
N
New Zealand Class A statement C-4
noise emissions 1-4
notes 1-3
notes, important C-2
notices C-1
electronic emission C-4
FCC, Class A C-4
notices and statements 1-3
numbers, enclosure ID 1-11
numeric display 4-12
O
operating specifications 1-4
Optional devices, models and 1-5
out-of-band management method 3-27
overheating, power supplies 4-18
Overview of EXP3500 storage
enclosure 1-3
overview of the product 1-8
Overview, DS3500 storage
subsystem 1-2
P
part numbers, power cords 7-5
particulate contamination C-3
parts listing 7-1
People's Republic of China Class A
electronic emission statement C-7
planned shutdown, powering off 4-14
power cord use by country 7-5
power cords 7-5
power cords and receptacles 1-19
power outage, overheated power
supplies 4-18
power recovery 1-19
power requirement specifications 1-4
power supply
recovering from shutdown 4-18
replacing 5-21
specifications 1-4