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GENERAL INFORMATION
1.
Shielded cables on all external I/O ports.
2. Cable
shields
connected
to earth
ground
via metal
shell
connectors bonded to a conductive module front panel.
3. Conductive chassis rails connected to earth ground.
This
provides the path for connecting shields to earth ground.
4. Front panel screws properly tightened.
For minimum RF emissions, it is essential that the conditions above
be implemented; failure to do so could compromise the FCC compliance
of the equipment containing the modules.
1.4 GENERAL DESCRIPTION
The MVME135/136 is a high performance MC68020 microprocessor-based
module implemented on a VME double-high, single-wide form-factor.
The MVME135/136 incorporates an MC68020, a 32-bit address and data
microprocessor, a high level multiprocessor CSR, and 1Mb or 4Mb of
fast DRAM.
Other main features provided include a Demand Paged
Memory Management Unit (PMMU), a Floating Point Coprocessor (FPCP),
and interfaces to the VMEbus and the VSBbus.
The MVME135/136 is designed for those applications which require
fast on-board RAM and a secondary bus (VSBbus). The features of the
MVME135/136 include high performance and an elegant architecture.
The MVME135/136 is especially suited to applications requiring
multiple
processors
where
the
efficiency
of
inter-processor
communication is important.
The 135bug resident debug package (refer to Motorola publication
MVME135BUG)
is the firmware package designed for use with the
MVME135/136 modul e.
135bug provides a powerful system debuggi ng
tool for VMEmodule systems.
This firmware features a one line
assembler/disassembler, provisions for upload/download, and disk
bootstrap commands. 135bug is available as an EPROM-based resident
package whi ch is plugged into IC sockets U54 and U56 on the
MVME135/136.
1.5 MVME135j136 CONFIGURATIONS
There are five module configurations available in the MVME135/136
series of 32-bit microcomputers. These configurations are listed in
the following table.
1-5
I
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