Lenovo HX3510-G Installation And Service Manual page 226

• Mixing microprocessors of different stepping levels within the same server model is supported.
• When mixing microprocessors with different stepping levels within the same server model, you do not
have to install the microprocessor with lowest stepping level and features in microprocessor socket 1.
• Both microprocessor voltage regulator modules are integrated on the system board.
• Read the documentation that comes with the microprocessor to determine whether you have to update
the server firmware. To download the latest level of server firmware and other code updates for your
server, go to http://www.lenovo.com/support.
• The microprocessor speeds are automatically set for this server; therefore, you do not have to set any
microprocessor frequency-selection jumpers or switches.
• If the thermal-grease protective cover (for example, a plastic cap or tape liner) is removed from the heat
sink, do not touch the thermal grease on the bottom of the heat sink or set down the heat sink. For more
information about applying or working with thermal grease, see "Thermal grease" on page 221.
Note: Removing the heat sink from the microprocessor destroys the even distribution of the thermal
grease and requires replacing the thermal grease.
• To order an additional optional microprocessor, contact your sales representative or reseller.
Installation tool has two settings for installing two different sizes of microprocessors. The settings
that are marked on the tool are "L" for smaller low core microprocessors, and "H" for larger high core
microprocessors.
Installation tool
Microprocessor
Figure 175. Microprocessor installation tools
To replace a microprocessor and heat sink, complete the following steps:
Step 1. Read the safety information that begins on "Safety" on page v and "Removing and replacing
guidelines" on page 101.
Step 2. Turn off the server and peripheral devices and disconnect the power cords and all external cables.
Attention: When you handle static-sensitive devices, take precautions to avoid damage from static
electricity. For details about handling these devices, see "Handling static-sensitive devices" on
page 103.
Step 3. Remove the top cover (see "Removing the top cover" on page 116).
Step 4. Remove the air baffle (see "Removing the air baffle" on page 119).
Step 5. If you are replacing microprocessor 1, remove the memory modules from DIMM connectors 6 and
7. If you are replacing microprocessor 2, remove the memory modules from DIMM connectors 18
and 19. See "Removing a memory module" on page 128 for instructions.
214
HX3510-G, HX5510, HX5510-C, HX7510 Installation and Service Guide