Models 830/Sb2 With Fc 9074 - Cards (Concurrent) - IBM iSeries 270 Service Manual

Sb2 and sb3 hardware
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In the United States, IBM has a process for the collection of this battery. For information,
call 1-800-426-4333. Have the IBM part number for the battery unit available when you call.
(RSFTC225)
4. Install the battery pack by reversing the removal procedure. After exchanging an item, go to Verify the
repair.
5. After you install the new battery, use HSM to perform a battery test to ensure correct operation.
This ends the procedure.

Models 830/SB2 with FC 9074 - Cards (concurrent)

For use by authorized service providers.
Use this procedure to remove or replace cards concurrently in the Models 830/SB2 with FC 9074.
Concurrent/dedicated guidelines for Model 830/SB2 with FC 9074
In some cases you do not need to power down the system to change PCI cards. Use the following
guidelines to determine if you should use dedicated or concurrent remove and replace procedures. If you
use concurrent maintenance on a partitioned system, follow the procedures from the partition that owns
the resource. If the resource is not owned, follow the procedure from the primary partition.
For cards in the Models 830/SB2 CEC/system unit:
No card positions in the (top) CEC/system unit permit concurrent maintenance. You must power down the
system to exchange a card. See Models 830/SB2 with FC 9074 - Cards (dedicated).
For Models 830/SB2 base I/O tower (FC 9074) IXS cards:
The IXS cards require dedicated maintenance. See Models 830/SB2 with FC 9074 - Cards (dedicated)
For Models 830/SB2 base I/O tower cards (FC 9074) - except IXS cards:
v Card positions C01 through C07 and C09 through C15 permit concurrent maintenance using HSM. You
can power down the individual card slot, but you can not power down the tower.
v If the resource is the load source IOA or the load source IOP, or any other storage IOA/IOP with critical
DASD attached for the system, primary, or secondary partition, follow the on-screen instructions when
you use HSM to power down the IOP or IOA. Instructions to use functions 68 and 69 on the control
panel will be included.
v If the resource is the console IOA or the console IOP for the system or primary partition, you cannot
power down the domain.
v If the resource is the console IOA or the console IOP for a secondary partition, then power down the
secondary partition and follow the procedure from the primary partition.
v All other card positions require dedicated maintenance. See Models 830/SB2 with FC 9074 - Cards
(dedicated).
CAUTION:
The circuit card contains lead solder. To avoid the release of lead (Pb) into the environment, do not
burn. Discard the circuit card as instructed by local regulations. (RSFTC234)
Attention: If removing the cover while powered on, errors may occur due to electromagnetic interference.
Attention: All cards are sensitive to electrostatic discharge (see Work with electrostatic discharge-sensitive
parts).
To remove or replace cards (concurrently):
1. From the Hardware Service Manager display, select Packaging hardware resources.
52
Hardware (Remove and Replace; Part Locations and Listings)

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