Model 825 - Cards (Concurrent) - IBM iSeries 270 Service Manual

Use this procedure to remove or replace the air moving device (AMD) - B01; B02 (concurrently) on a
Model 825.
Two AMDs (excluding the AMDs mounted on the power supplies), and two power supplies must be
installed to perform this procedure.
Attention: The replacement fan must be reconnected within 30 seconds of removal of the failed unit, or
system failure or shutdown may result.
To remove or replace the AMDs:
1. Remove the front cover, see Model 825 - Covers.
2. Perform the following:
v To remove the bottom AMD.
a. Pull on the top knob to release the AMD.
b. Pull the AMD out.
v To remove the top AMD.
a. Remove the plate that holds in the AMD (located on the top right corner).
b. Pull on the top knob to release the AMD.
c. Pull out the AMD.
3. Reverse this procedure to install the AMDs.
This ends the procedure.

Model 825 - Cards (concurrent)

For use by authorized service providers.
Use this procedure to remove or replace cards (concurrently) in the Model 825.
Concurrent/dedicated guidelines for Model 825:
In some cases you do not need to power down the system to change PCI cards. Use the following
guidelines to determine if you should use dedicated or concurrent remove and replace procedures. If you
use concurrent maintenance on a partitioned system, follow the procedures from the partition that owns
the resource. If the resource is not owned, follow the procedure from the primary partition.
For all Model 825 cards:
v Card positions C01 through C07 and C10 through C12 permit concurrent maintenance using HSM. You
can power down the individual card slot.
v If the resource is the load source IOA or the load source IOP, or any other storage IOA/IOP with critical
DASD attached for the system, primary, or secondary partition, follow the on-screen instructions when
you use HSM to power down the IOP or IOA. Instructions to use functions 68 and 69 on the control
panel will be included.
v If the resource is the console IOA or the console IOP for the system or primary partition, you cannot
power down the domain.
v If the resource is the console IOA or the console IOP for a secondary partition, then power down the
secondary partition and follow the procedure from the primary partition.
v All other card positions require dedicated maintenance. See Model 825 - Cards (dedicated).
CAUTION:
The circuit card contains lead solder. To avoid the release of lead (Pb) into the environment, do not
burn. Discard the circuit card as instructed by local regulations. (RSFTC234)
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Hardware (Remove and Replace; Part Locations and Listings)