Sony DVP-S300 Training Manual page 8

IC Removal - Hot Air method
This method requires the following:
•
Hot Air Controller
•
Desoldering Tips
•
Flux Pen
•
Tweezers
In the following steps you will use the Hot Air Controller to heat up all the
pins while you lift the IC off the board with tweezers.
1. Apply flux from a pen to remove the oxide layer from the IC pins dur-
ing heating. Removing the oxide establishes a uniform temperature
on all the IC pins for removal and prevents an IC leg from still being
attached to the land when lifting the IC. These low residue pens are
made by Kester and distributed by companies such as
www.mcmelectronics.com and www.newark.com.
5
2. If you cannot find a hot air tip that will cover the IC, attach a single
1/8" (0.125") diameter tip that will heat all the pins if you move the tip
around the IC pins.
3. Start at 0 air flow and maximum heat so the tip will warm up fast.
4. After warm up increase the air flow slightly (to #1 of 10) and position
the hot air tip over the pins of the IC. Do not touch the IC with the tip.
Count the nearby components and make sure they do not move away
by controlling the airflow. Insert tweezers at the corner of the IC.
5. Gently lift the IC with the tweezers.
6. Remove the solder on the lands using a solder wick looped about the
soldering iron for better control.
IC Removal - Hot Air method using butane torch
The hot air controller is effective, but expensive. The butane torch is
similar in performance and inexpensive (about $100). In Weller's PyroPen,
hot air comes from a controlled flame.