Sony DVP-S300 Training Manual page 11

1. Whichever iron you use, clean the tip by dipping it into a cleaner or
tinner. Kester and Multicore manufacture these. A dirty tip will cause
you to mis-solder some IC leads as you drag the solder across the IC
pins.
2. Tin one land on the board, then position the IC over the lands.
3. With the IC in place solder the lead to the tined land.
4. Check the IC position and solder another lead to hold the IC in place.
Apply flux from a pen to all the IC leads to stop solder bridges.
5.
Using the magnifying glass, place the iron's tip furthest away from you
6.
on the IC pins and apply enough solder for 10 lands. Using the flat
part of the iron, drag the solder blob down the pins in a side by side
motion (zigzag pattern) allowing the solder blob to touch (heat) each
IC lead and land. Only a small amount of solder resides at each land.
At first it looks at though the lead was not soldered.
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