Modern Soldering Techniques; Ic Removal - Which Method - Sony DVP-S300 Training Manual

Modern Soldering Techniques

This section is an excerpt from the Sony videotape (p/n T-MODSOL-9) by
the same name. This document only shows how to remove and install
multi-pin ICs used on many Sony
lead large-scale integrated circuits (LSI) requires modern methods. After
replacing the IC, checking each pin for solder bridges is essential to pre-
vent IC damage.

IC Removal - Which method?

Choose one of three methods for removing the ICs based upon the den-
sity of parts about the defective IC.
Cutting the IC's leads in a high-density board is the best method for IC
removal. If there are many small parts about the defective IC the hot air
and Chip Quick removal methods may desolder local components. If you
choose the chip quick method, keep solder to a minimum on the IC pins.
Use the CUT OUT IC removal method when there
are many parts surrounding the IC
IC Removal - Cut Out method
This method requires a minimum of tools to cut the legs off the IC and
clean the board:
•
Knife
•
cutters
•
dental pick
•
soldering iron
•
solder wick
®
products. The removal of these fine
3
Use a sharp knife blade each time you remove an IC because the knife
was not originally intended to cut metal. Break off the old blade segments
of knife before cutting to expose a new sharp blade.
1. You must place the new blade at the legs where they meet the IC
body. Angle the blade into the body slightly to avoid slipping off the IC
legs.
Blade
2. Along the IC legs, hold the knife at a shallow 20 - 30 degree angle.
3. Place your finger above the blade for control as you press down and
rock the blade down.
20-30 degrees
IC
IC