Lincoln Electric POWERWAVE 655/R Service Manual page 140

G3501-1 REMOVED MFG OPERATION AND W/C TABLE
ENGINEERING CONTROLLED CHANGE DETAIL:
No
MANUFACTURER:
NOTES:
N.H. ELECTRONIC MODULES TO BE ASSEMBLED, SOLDERED, AND SEALED TO
PC BOARD PER E3875.
N.A. CAUTION: THIS DEVICE IS SUBJECT TO DAMAGE BY STATIC
ELECTRICITY. SEE E2454 BEFORE HANDLING.
N.J. THESE SURFACES MUST BE MAINTAINED CO-PLANAR WITHIN .010"
THROUGH ENTIRE SOLDERING AND SEALING PROCESS (4 PLACES).
N.B. PC BOARD AND MODULE MOUNTING HOLES TO BE FREE OF ENCAPSULANT MATERIAL
FOR A CENTERED 0.50" MIN. DIA. AND 0.55" MAX. DIA. (8 HOLES). MASK PER
N.K. INSPECT POWER TERMINAL PER E1880.
APPROPRIATE MANUFACTURING WORK INSTRUCTIONS. TO BE CENTERED WITHIN 0.100"
(DO NOT GET ON MATING SURFACES).
N.L. ELECTRONIC MODULES ON A COMMON P.C. BOARD ASSEMBLY TO
HAVE VGE (TH) AND VCE (SAT) IN SAME SORT CODE (0.1 VSPAN) AND THE SAME
N.C. MOLEX CAVITIES AND AREA AROUND LOCKING TAB TO BE FREE OF ENCAPSULANT
VENDOR CODE.
MATERIAL. MASK PER APPROPRIATE MANUFACTURING WORK INSTRUCTIONS.
e.g. M16100-46 X XX XXX......
N.D. FEMALE EYELET TO BE AGAINST THE OPPOSITE COMPONENT
SIDE AS SHOWN. EYELET MUST NOT SPIN AFTER CLINCHING. VENDOR CODE
VCE (SAT)
N.E. SOLDER EYELET SO THAT SOLDER COVERS ENTIRE EYELET AND
ALL AROUND EYELET ON OPPOSITE COMPONENT SIDE ONLY. NO
ICICLES OR SOLDER BLOBS PERMITTED.
N.M. DO NOT COAT WITH ENCAPSULATION MATERIAL. TOP AND BOTTOM, FOR 0.80" MIN. DIA. AND
0.85" MAX. DIA. MASK PER APPROPRIATE MANUFACTURING WORK INSTRUCTIONS.
N.F. BAR MUST BE FREE OF ENCAPSULATION MATERIAL ON BOTH
TO BE CENTERED WITHIN 0.100" (DO NOT GET ON THE MATING SURFACES).
SURFACES AROUND MOUNTING HOLES AND ENTIRE LENGTH OF
MOUNTING SURFACES. ENCAPSULATION MATERIAL MUST NOT
N.N. ENCAPSULATE COMPONENT SIDE OF P.C. BOARD TO A THICKNESS OF .30 +.12/-.00 IN AREA SHOWN.
EXTEND BEYOND THE MOUNTING SURFACE PLANE (4 PLACES).
N.P. ENCAPSULATE OPPOSITE COMPONENT SIDE OF P.C. BOARD TO A THICKNESS OF .25 +.12/-.00.
N.G. DO NOT COAT THE TOP SURFACES OR THREADS WITH ENCAPSULANT MATERIAL
(4 TERMINALS). MASK PER APPROPRIATE MANUFACTURING WORK INSTRUCTIONS.
8
N.J.
(4 PLACES)
N.E., N.M.
(4 PLACES)
2.50
N.S. 7
+.12
1.32
-.00
10.75 ±.04
PW-655 SH1
R71 R72
SWIT CH
FR SH1
G3501- R74
1
C33 X1
C3
3
R47
C32 R77
R46
R69
R1 R77
N.B.
DZ1
C29
C2
DZ3
9
DZ2 R45
A A
C1
R2
D
7
A1
C C1
B B
D7
5 7
D1
6 A2
C1
D16
C5 6
C D C1
8 D8 C16
6 8
D1 C1
D15 5 5
C6
R44
C D C1 D1
9 D9 C15 9
7 9
D1
D14 4
C7
D1
C
0 D10 C14
8
D1 C1
D13 3 4
C8
D1 C2 D2
C
1 D11 C13 0 1
9
C1
D1
D12 2 3
C9
C2
1
1 C12
C1
2
R43
1.15 2.25 2.25
R41 R42
R41 R42
DO NOTOPERAT E WIT H PANELSREM OVED. DISCONNECTINPUTPOWER AND DISCHARGE
1
N.K.
3
N.G.
DANGER
OR
1
8
B4 B5
5
HIGH VOLT AGE CAN KILL
B1
B2 B3
11 OR 16
2 1
0
9
0
0
Lincoln Electric assumes no responsibility for liablilities resulting from board level troubleshooting. PC Board repairs will invalidate your factory warranty.
vided for reference only. Lincoln Electric discourages board level troubleshooting and repair since it may compromise the quality of the design and may result in danger to the Machine Operator or Technician. Improper PC board repairs could result in damage to the
machine.
N.R. ENCAPSULATION MATERIAL MUST EXTEND BEYOND EDGES OF P.C. BOARD .12 +.12/-.00.
N.S. ENCAPSULATE OPPOSITE COMPONENT SIDE OF P.C. BOARD IN AREAS SHOWN TO A MAXIMUM
THICKNESS OF .20.
N.T. ITEM 8 MOUNTS AND SOLDERS TO SAME HOLES AS ITEM 7 . ITEM 8 IS MOUNTED ON
NON-COMPONENT SIDE OF P.C. BOARD.
VGE (TH)
N.T.
2
N.F.
B
N.D.
4
OPPOSITE
COMPONENT
SIDE
5.90
N.T.
+.12
N.C. 1.32
-.00
3
T 1
D D
DZ10
J40 EYELET DETAIL
R31
+.12
1.36
J40/J5 J40/J5 -.00
R78
0 0 C C
DZ13 C3
T1
R22
DZ9
DZ8
C4
R32
N.S.
D1
7 R21
A3 DZ12
DZ7
D17 DZ11
D2 MAKE PER E1911
6 A4
POT PER E1911-E
C2
D26
C17 8 TEST PER E3826-SW
D1 MANUFACTURED AS:
8 D18 C28
D2 C2 G3501-1F0
D25 5
C18 7
D19 C27
IDENTIFICATION CODE
D2 C2
N.N.,N.P.,N.R.
D24 4
C19 6
D2
0 D20 C26
D2
C2
D23 3
5
C20
D21 C25
D2
C2
D22 2
4
C21
C24
R63
R67
R63 R67
2.25
R64 R65 R66
R64 R65 R66
1
2 INPUT CAPACIT ORSBEFORE
OR
1
SERVICING. DO NOTT OUCH
5
ELECTRICALLY LIVE PARTS.
2.70 ±.12
B8
B6 B7
14 OR 17
2 2
2
1
9.00 ±.04
P.C. BOARD BLANK REFERENCE IN FO RMATION
BUY BLANK COMPLETE AS G3501-F
(4 LAYER BOARD PER E3281)
(MAKES 2 BOARDS PER PANEL, SEE ELECTRONIC FILE FO R ADDITIONAL INFORMATION)
PANEL SIZE PER E1911
OPPOSITE COMPONENT
SIDE ENCAPSULATION
N.S.
P.C. BOARD
COMPONENT SIDE
ENCAPSULATION
.285
.275
.116 MAX. CRIMP HEIGHT
R .045
PROPRIETARY & CONFIDENTIAL:
UNLESS OTHERWISE SPECIFIED TOLERANCE
MANUFACTURING TOLERANCE PER E2056
ON 2 PLACE DECIMALS IS ± .02
ON 3 PLACE DECIMALS IS ± .002
ON ALL ANGLES IS ± .5 OF A DEGREE
MATERIAL TOLERANCE (" ") TO AGREE t
WITH PUBLISHED STANDARDS.
DO NOT SCALE THIS DRAWING
ITEM QTY PART NO. DESCRIPTION
X1 1 M13552-3 IC, CONVERTER, V/F, 654
T1 1 S13000-46 TRANSFORMER, PCB;
C29 1 S13490-93 CAPACITOR, TAEL, 27, 35V, 10%
OC11 1 S15000-22 OPTOCOUPLER, PHOTO-Q, 70V, CNY17-3/VDE
X2 1 S15128-10 VOLTAGE REF, ADJ, PERCISION, 431I
R77 1 S16296-5 TRIMMER, MT, 1/2W, 10K, 10% , LINEAR
C30 1 S16668-5 CAPACITOR, CEMO, .022, 50V, 20%
C1,C2,C3,C4,C31 5 S16668-6 CAPACITOR, CEMO, 4700p, 50V, 10%
C32 1 S16668-11 CAPACITOR, CEMO, 0.1, 50V, 10%
R1,R6,R7,R8,R9,R10,R11,R16,
R17,R18,R19,R20,R21,R26,
25 S19400-10R0 RESISTOR, MF, 1/4W, 10.0, 1%
R27,R28,R29,R30,R31,R36,
R37,R38,R39,R40,R69
R78 1 S19400-1000 RESISTOR, MF, 1/4W, 100, 1%
R2,R12,R22,R32 4 S19400-1001 RESISTOR, MF, 1/4W, 1.00K, 1%
R46,R74 2 S19400-1002 RESISTOR, MF, 1/4W, 10.0K, 1%
R70,R71,R72 3 S19400-1003 RESISTOR, MF, 1/4W, 100K, 1%
R47,R75 2 S19400-2001 RESISTOR, MF, 1/4W, 2.00K, 1%
R79 1 S19400-2213 RESISTOR, MF, 1/4W, 221K, 1%
R73 1 S19400-6191 RESISTOR, MF, 1/4W, 6.19K, 1%
R76 1 S19400-6811 RESISTOR, MF, 1/4W, 6.81K, 1%
C5,C6,C7,C8,C9,C12,C13,C14,
C15,C16,C17,C18,C19,C20, 20 S20500-1 CAPACITOR, PPMF, 0.1, 1000V, 10% , BOX
C21,C24,C25,C26,C27,C28
C33 1 S20500-14 CAPACITOR, PPMF, .022, 100V, BOX, 5%
J40 1 S24020-6 CONNECTOR, MOLEX, MINI,PCB, 6-PIN, TIN
L1,L2,L3,L4,L5,L6,L7,L8,L9,
L10,L11,L12,L13,L14,L15,L16, 20 T12218-15 CHOKE, RF, FERRITE BEAD, 180 OHM
L17,L18,L19,L20
DZ13 1 T12702-4 ZENER DIODE, 1W, 20V, 5% IN4747A
DZ2,DZ3,DZ5,DZ6,DZ8,DZ9,
8 T12702-29 ZENER DIODE, 1W, 15V, 5% IN4744A
DZ11,DZ12
DZ1,DZ4,DZ7,DZ10 4 T12702-40 ZENER DIODE, 1W, 6.2V, 5% IN4735A
D7,D8,D9,D10,D11,D12,D13,
D14,D15,D16,D17,D18,D19, 20 T12705-32 DIODE, T220, 15A, 600V, FR, MUR1560
D20,D21,D22,D23,D24,D25,D26
D1,D2,D3,D4 4 T12705-44 DIODE, AXLDS, 1A, 1000V, FR, 818
R41,R42,R43,R44,R45,R63,
10 T14648-9
R64,R65,R66,67 RESISTOR, WW, 5W, 2.5K, 5% , SQ.
CAPACITORS = MFD/VOLTS
RESISTORS = OHMS
ITEM QTY PART NO. DESCRIPTION
1 1 SEE ABOVE P.C. BOARD BLANK
2 4 M16100-46 ELECTRONIC MODULE (A1,A2,A3,A4) (SS)
N.A., N.H., N.L.
3 4 T9147-15 EYELETS (MALE) (B2,B3,B6,B7)
4 4 T9147-11 EYELETS (FEMALE)
5 4 S23006 POWER TERMINAL (B1,B4,B5,B8)
6 430g E2527 EPOXY ENCAPSULATING RESIN
7 1 S24869-1 PC BOARD SHIELD
8 1 S24869-2 PC BOARD SHIELD
SCHEMATIC REFERENCE: L11016-1F0
FOR PARTS ORDERS OR SUBSIDIARY ORDERS:
INCLUDE (1) S25254PRINT, (1) S25191-1PRINT,
(1) T12837-1 AND (4) S25347-2.
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION OWNED BY LINCOLN GLOBAL, INC. AND MAY NOT BE DUPLICATED, COMMUNICATED
TO OTHER PARTIES OR USED FOR ANY PURPOSE WITHOUT THE EXPRESS WRITTEN PERMISSION OF LINCOLN GLOBAL, INC.
REFERENCE: INVERTER WELDERS
DESIGN INFORMATION EQUIPMENT TYPE: 1
PAGE ___ OF ___
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DRAWN BY: lwimbley
SWITCH P.C. BD. AS'BLY DOCUMENT
SUBJECT:
NUMBER:
ENGINEER: TK SCALE:
G3501-1
MATERIAL APPROVAL PROJECT
UF 3/10/2005 CRM35906
- 1:1
APPROVED: DISPOSITION: DATE: NUMBER:
This information is pro-
1
DOCUMENT
REVISION:
B
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