Diagrams - Sony STR-DA5300ES Service Manual

STR-DA5300ES
2.

DIAGRAMS

• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: internal component.
f
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• DSP board is multi-layer printed board.
However, the patterns of intermediate-layers have not been
included in this diagrams.
• Indication of transistor
C
Q
These are omitted.
B E
Q
B C E
These are omitted.
• Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
STR-DA5300ES
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
•
: internal component.
f
• C : panel designation.
• A : B+ Line.
• B : B– Line.
• Voltages are dc with respect to ground under no-signal
(detuned) conditions.
no mark : TUNER
• Voltages are taken with a VOM (Input impedance 10 MW).
Voltage variations may be noted due to normal produc-
tion tolerances.
F : AUDIO (ANALOG)
J
: AUDIO (DIGITAL)
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
• Abbreviation
CND : Canadian model
ECE : Russian and Ukrainian models
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