I.
II.
III. MMI...........................................................................................................3
Front side..................................................................................................3
Back side ..................................................................................................5
V.
1.
Precaution .........................................................................................7
2.
Suggest Tools ....................................................................................8
3.
3.1 Stand Subsystem................................................................................10
3.2 Board Subsystem ............................................................................... 11
3.3 Panel Subsystem................................................................................16
3.4 Bezel Subsystem ................................................................................18
4.
Assemble Procedure .......................................................................20
4.1 Bezel Subsystem ................................................................................21
4.2 Panel Subsystem ................................................................................23
4.3 Board Subsystem ................................................................................25
4.4 Stand Subsystem ................................................................................30
9.
HW Block Diagram .................................................................................31
Index
3