Samsung WC-M15i Series Service Manual page 10

INSTALLING
1. Clean the area where the new part is to be
mounted.
2. Apply a water soluble flux.
3. Set part correctly into position and prevent is from
shifting.
4. Use a sharp soldering iron tip. Bring close to the
part contact without actually touching it. Melt thin
(0.3mm) solder between the tip and part so that it
flows into the part contact.
3-2-6 Chip ICs
TYPES
The types of chip ICs are as follows:
1. SOP (Small Outline Package) IC
2. SSOP (Shrink Small Outline Package) IC
3. VSOP (Very Small Outline Package) IC
4. QFP (Quad Flat Package) IC
5. VQFP (Very Quad Flat Package) IC
6. PLCC (Plastic Leaded Chip Carrier) IC
7. TSOP (Thin Small Outline Package) IC
REMOVING
1. Using special desoldering iron:
a. Select the tip according to the size shape of the
IC.
b."Tin" the tip with a small amount of the IC leads.
c. Set the tip squarely over the IC leads.
d. When the solder melts, carefully twist the iron.
e. Raise and remove the IC.
2. Using a shaped air-blower unit:
a. Select the correct nozzle.
b. Select the temperature and air-blow
(suggested : temperature : 7, air-blow:4)
c. Engage the IC removing tool.
d. Use the air-blow the preheat the IC for about 5
seconds, then heat with the nozzle until the IC
remove lifts the part from the board.
Samsung Electronics
INSTALLING
1. Use desoldering wire to remove the previous solder
2. Clean the location.
3. Apply water soluble flux.
4. Position the IC and solder two pins at opposite
sides.
5. Use a sharp tipped soldering iron and carefully
solder each pin. (After gaining experience, a thicker
tip can be used for better work efficiency)
6. Remove any solder bridges with desoldering wire.
7. Inspect the work with a magnifying lens.
Reference Information
IC
3-5