Table of Contents
Advertisement
1.6.2 IBM C4-CQFP Package Description
The following sections provide the package parameters and mechanical dimensions for the IBM C4-CQFP
package.
1.6.2.1 Package Parameters
The package parameters are as provided in the following list. The package type is 32 mm x 32 mm, 240-pin
ceramic quad flat pack.
Package outline
Interconnects
Pitch
Lead plating
Solder joint
Lead encapsulation
Solder-bump encapsulation Epoxy
Maximum module height
Co-planarity specification
Note: No solvent can be used with the C4-CQFP package. See Appendix A, "General Handling
Recommendations for the IBM Package," for details.
603 Hardware Specifications, REV 2
32 mm x 32 mm
240
0.5 mm
Ni Au
Sn/PB (10/90)
Epoxy
3.1 mm
0.08 mm
Preliminary—Subject to Change without Notice
19
Advertisement
Table of Contents
