Circuit Boards Location - Sony HCD-M100 Service Manual

6-2. CIRCUIT BOARDS LOCATION

FRONT SP TERM board
REAR SP TERM board (M300AV)
TRANS board
REAR AMP board (M300AV)
SUB TRANS board
CD LED board
DOOR SW board
PHONES board
LEAF SW board
(not supplied)
CASSETE board
DOOR LED
board
FRONT AMP board
DISC SENSOR (S) board
PANEL board
PANEL (L) board
TABLE
SENSOR board
PANEL (R) board
DISC SENSOR (R) board
MAIN board
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this necessary note is printed in each
block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
4
specified.
• % : indicates tolerance.
• : internal component.
f
• 2 : nonflammable resistor.
• 1 : fusible resistor.
• C : panel designation.
Note:
Note:
Les composants identifiés par
The components identi-
fied by mark 0 or dotted une marque 0 sont critiques
line with mark 0 are criti-
pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part piéce por tant le numéro
number specified. spécifié.
• U : B+ Line.
• V : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
• Circled numbers refer to waveforms.
BD board
• Signal path.
F : FM
g : VIDEO/MD
E : PB (DECK A)
d : PB (DECK B)
G
: REC (DECK B)
J
: CD
c : CD DIGITAL
SW board
CD MOTOR board
27 27
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• : internal component.
f
• b : Pattern from the side which enables seeing.
W or less unless otherwise
C
Q
B E
B
These are omitted.
C E
These are omitted.