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Amplifier section
DIN power output
30 W + 30 W
(6 ohms at 1 kHz, DIN)
Continuous RMS power output
US, Canadian model :
30 W + 30 W
(6 ohms at 40Hz-16kHz, 1.0% THD)
35 W + 35 W
(6 ohms at 1kHz, 5% THD)
POPO 350W
Except US, Canadian model :
40 W + 40 W
(6 ohms at 1 kHz, lO% THD)
Music power output
70W+70W
(6 ohms at 1 kHz. lO% THD)
Inputs
TAPE (phono jacks):
voltage 250 mV
impedance 47 kilohms
Outputs
TAPE (phono jacks):
voltage 250 mV
impedance 1 kilohms
PHONES (stereo phone jack):
accepts headphones of 8 ohms
or more.
Supplied accessories
Sony RM-SMJI Remote (1)
Sony lithium battery. CR2025 (1 )
FM lead aerial (1)
AM loop aerial (1)
Speaker cords (2)
General
Power requirements
Destination
Power
requirements
US, Canadian model 120V AC,60Hz
AEP, UK, German
220-230V AC, 50/60Hz
Italian model
110-120V/ 220-240V AC,
E, Singapore,
50/60Hz Adjustable with
Hong Kong model
the Voltage Selector
Dimensions
Approx. 430 x 95 x 290 mm
3
1
(17 x 3
/
x 11
/
inches) (w/h/d)
4
2
incl. projecting parts and controls
Mass
Approx. 7.0 kg (15 Ib 7 oz)
Design and specifications are subject to
change without notice.
Specifications ............................................................................... 1
1.
2.
3.
4.
5.
6.
7.
8.
Power
consumption
95W
95W
95W
9.
10. ELECTRICAL PARTS LIST ............................................ 86
- 2 -
TABLE OF CONTENTS
SERVICING NOTES ..................................................
GENERAL
Index to parts and Controls .................................................... 5
Plate (T back) Ornamentel Removal ............................... 8
Digital board Removal .................................................... 9
ON THE POWER SUPPLY IS OFF .......................
TEST MODE .............................................................
ELECTRICAL ADJUSTMENTS ..................................... 14
DIAGRAMS
8-1. Block Diagram -Main Section- ................................. 30
8-2. Block Diagram -MD Section- ................................... 33
8-3. Circuit Boards Location .............................................. 37
8-4. Printed Wiring Boards -Main Section- ...................... 38
8-5. Schematic Diagram -Main Section- .......................... 41
8-6. Schematic Diagram -Digital Section- ....................... 46
8-7. Printed Wiring Boards -Digital Section- ................... 51
8-8. Printed Wiring Boards -BD : MD Section- ............... 54
8-9. Schematic Diagram -BD : MD Section- ................... 57
8-10. Schematic Diagram -Display Section- ...................... 61
8-11. Printed Wiring Boards -Display Section- .................. 65
8-12. Schematic Diagram -BD : CD Section- .................... 70
8-13. Printed Wiring Boards -BD : CD Section- ................ 73
8-14. IC Block Diagram ....................................................... 75
9-1. Cabinet Section ............................................................. 79
9-2. Chassis Section-1 .......................................................... 80
9-3. Chassis Section-2 .......................................................... 81
9-4. MD Mechanism Section (MDM-2ER) ......................... 82
9-5. Base Unit Section (MD) (MBU-2) ............................... 83
9-6. CD Mechanism Section-1 (CMD-5BD19) ................... 84
9-7. CD Mechanism Section-1 (CMD-5BD19) ................... 85
4
10
11
...................... 22
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