INTRODUCTION .......................................................................................................................................................................3
FEATURES............................................................................................................................................................................3~4
SPECIFICATIONS.................................................................................................................................................................5~8
LOCATION OF CUSTOMER CONTROLS .........................................................................................................................9~10
DISASSEMBLY .................................................................................................................................................................11~12
1-1. Bottom Chassis ..........................................................................................................................................................11
1-2. Front Bezel Assy ........................................................................................................................................................11
2. MECHANISM ASSY DISASSEMBLY..............................................................................................................................11
2-1. Pick-up Unit................................................................................................................................................................11
2-2. Pick-up ......................................................................................................................................................................12
GLOSSARY .............................................................................................................................................................................16
EXPLODED VIEW .............................................................................................................................................................13~14
MECHANICAL REPLACEMENT PARTS LIST ......................................................................................................................15
1. Recording Layer ..............................................................................................................................................................17
2. Disc Specification ............................................................................................................................................................17
3. Disc Materials ..................................................................................................................................................................18
4. Reading Process of Optical Disc .....................................................................................................................................19
5. Writing Process of CD-R Disc .........................................................................................................................................20
6. Writing Process of CD-RW Disc ......................................................................................................................................20
8. Function of PCA and PMA area ......................................................................................................................................22
9. OPC and ROPC ..............................................................................................................................................................22
10. Writing Process of DISC................................................................................................................................................23
1. Recording Layer ..............................................................................................................................................................24
2. Disc Specification ............................................................................................................................................................25
3. Disc Materials ..................................................................................................................................................................25
5. Writing Pulse Waveform DVD+RW .................................................................................................................................30
DVD & CD DATA PROCESSING......................................................................................................................................33~36
1. Data Processing Flow......................................................................................................................................................33
2. Pick up Pin Assignment...................................................................................................................................................38
3. Signal detection of the P/U ..............................................................................................................................................39
DESCRIPTION OF CIRCUIT.............................................................................................................................................40~47
1. ALPC Circuit ....................................................................................................................................................................40
2. Focus Circuit....................................................................................................................................................................42
3. Tracking & Sled Circuit ....................................................................................................................................................43
4. Spindle Circuit .................................................................................................................................................................43
TROUBLESHOOTING GUIDE ..........................................................................................................................................74~90
BLOCK DIAGRAM ..................................................................................................................................................................92
PRINTED CIRCUIT BOARD DIAGRAM ...........................................................................................................................93~96
ELECTRICAL REPLACEMENT PARTS LIST ........................................................................................................................97
CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM.
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