Reliability; Thermal Considerations For Components - Intel D810E2CA3 Specification

Intel Desktop Board D810E2CA3 Technical Product Specification
Table 51 provides maximum component case temperatures for board components that could be
sensitive to thermal changes. Case temperatures could be affected by the operating temperature,
current load, or operating frequency. Maximum case temperatures are important when considering
proper airflow to cool the board.
Table 51.

Thermal Considerations for Components

Component
Intel Pentium III processor
Intel Celeron processor
Intel 82810E DC-133 GMCH
Intel 82801BA ICH2
For information about
Intel Pentium III processor datasheets and specification updates
Intel Celeron processor datasheets and specification updates

2.13 Reliability

The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is for estimating
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 35 ºC.
Board MTBF: 377,018 hours
74
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
70 C (under bias)
o
109 C (under bias)
Refer to
Section 1.2, page 16
Section 1.2, page 16