Reliability; Thermal Considerations; High Temperature Zones - Intel D845GRG Specification

Desktop board product supplement document

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Product Supplement Document for the Intel Desktop Board D845GRG

2.7 Reliability

The mean time between failures (MTBF) prediction is calculated using component and

subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction

Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate

repair rates and spare parts requirements.

The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board D845GRG MTBF

is 112,977.7547 hours.

CAUTION

Ensure that the ambient temperature does not exceed the Desktop Board's maximum operating

temperature. Failure to do so could cause components to exceed their maximum case temperature

and malfunction. For information about the maximum operating temperature, see the

Environmental specifications section in the Technical Product Specification for Intel Desktop

Boards using the Intel 845G Chipset.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do

so may result in damage to the voltage regulator circuit. The processor voltage regulator area

(item A in Figure 10) can reach a temperature of up to 85

C in an open chassis.

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