JETWAY 920BFR3A User Manual page 11

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2-7-3 Intel Pentium
The FC-PGA package has the processor's silicon die directly mounted to a pinned interposer substrate.
The pin grid array is partially populated and there may be surface mount components in the unpopulated
central area of the pin field.
Fillet Epoxy
(Not to scale)
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Intel Pentium III Processor in the FC-PGA form factor: Mechanical Features
C4 Solder bumps
Surface mounted pins
Reference Design: Heatsink
FC-PGA with the reference
design heatsink
White Dot
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III Processor (256K) in the FC-PGA form factor: Mechanical Features
Pins
Flip-Chip Si Core
(Not to scale)
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Blank
Lever
CPU ZIF Socket 370
Flip Chip Die
Substrate
Fillet Epoxy
Multi-layer substrate
Intel's reference design thermal solution is an
active heatsink; an extruded aluminum heatsink
base and a fan attached to the top on the fin
array.
Heatsinks for the PPGA will not work with the
FC-PGA. A pedestal is required on the
underside of the heatsink to clear the socket
cam box
Recommended thermal interface
material: Chomerics* XTS454.
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Lock