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TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up
This user's guide describes the characteristics, operation, and use of the TPS6125xEVM-766 evaluation
module (EVM). This EVM enables test and evaluation of the Texas Instruments' TPS61253, TPS61258,
and TPS61259 devices, a series of 3.5-MHz, up to 5.1-V, step-up dc-dc converters. This user's guide
includes EVM specifications, the schematic diagram, bill of materials, and board layout.
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TPS6125xEVM-766 Schematic
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TPS61253 in Power Save Mode Operation with 40-mA load
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PS6125xEVM-766 Inner Layer 2 (Viewed from Top)
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Table 1. TPS6125xEVM-766 Output and Input Voltage Options and Ordering Information
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SLVU744 - August 2012
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TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip
Copyright © 2012, Texas Instruments Incorporated
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List of Tables
User's Guide
SLVU744 - August 2012
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Scale Packaging EVM
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Table of Contents
Related Manuals for Texas Instruments TPS61253EVM-766
Summary of Contents for Texas Instruments TPS61253EVM-766
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Page 1: Table Of Contents
This user's guide describes the characteristics, operation, and use of the TPS6125xEVM-766 evaluation module (EVM). This EVM enables test and evaluation of the Texas Instruments' TPS61253, TPS61258, and TPS61259 devices, a series of 3.5-MHz, up to 5.1-V, step-up dc-dc converters. This user's guide includes EVM specifications, the schematic diagram, bill of materials, and board layout. -
Page 2: Introduction
Double-sided, two-active-layer printed circuit board (PCB) with all components on top side • Active converter area of approximately 25 mm TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip SLVU744 – August 2012 Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 3: Tps6125Xevm-766 Schematic
Up to 1000 mA peak output current. TPS6125xEVM-766 Schematic Figure 1. TPS6125xEVM-766 Schematic SLVU744 – August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 4: Connector And Test Point
By default, J8 is not assembled on the EVM. TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip SLVU744 – August 2012 Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 5: Test Results
Figure 2. TPS61253 in Power Save Mode Operation with 40-mA load SLVU744 – August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 6: Tps61253 In Pwm Operation With 260-Ma Load
PWM Operation Figure 3. TPS61253 in PWM Operation with 260-mA Load TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip SLVU744 – August 2012 Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 7: Tps61253 Load Transient From 100 Ma To 300 Ma
Figure 5. TPS61253 Load Transient from 100 mA to 500 mA SLVU744 – August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 8: Tps6125Xevm-766 Assembly Drawing And Layout
EXAS NSTRUMENTS Figure 6. TPS6125xEVM-766 Component Placement (Viewed TOP) TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip SLVU744 – August 2012 Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 9: Tps6125Xevm-766 Top Copper (Viewed From Top)
TPS6125xEVM-766 Assembly Drawing and Layout www.ti.com Figure 7. TPS6125xEVM-766 Top Copper (Viewed from Top) SLVU744 – August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 10: Tps6125Xevm-766 Inner Layer 1 (Viewed From Top)
Figure 8. TPS6125xEVM-766 Inner Layer 1 (Viewed from Top) TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip SLVU744 – August 2012 Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... - Page 11 Figure 9. PS6125xEVM-766 Inner Layer 2 (Viewed from Top) SLVU744 – August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor...
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Page 12: Tps6125Xevm-766 Bottom Copper (Viewed From Bottom)
TPS6125xEVM-766 Assembly Drawing and Layout www.ti.com Figure 10. TPS6125xEVM-766 Bottom Copper (Viewed from Bottom) TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip SLVU744 – August 2012 Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 13: Bill Of Materials
5. Install label in silkscreened box after final wash. Text shall be 8 pt font. Text shall be per Table 1. SLVU744 – August 2012 TPS6125xEVM-766, 3.5-MHz High Efficiency Step-Up Converter In Chip Scale Packaging EVM Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com electronic components distributor... -
Page 14: Regulatory Compliance Information
Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization. - Page 15 FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
- Page 16 Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp...
- Page 17 FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com...
- Page 18 Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.
- Page 19 FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
- Page 20 Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp...
- Page 21 FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated Downloaded from Elcodis.com...
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Page 22: Important Notice
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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