Related Manuals for entegris A198-80MB-47C02
Summarization of Contents
General Terminology and Definitions
Dimensions Overview
Describes various dimensional specifications and their meanings with diagrams for wafer carrier components.
Key Definitions
Provides definitions for terms related to wafer carrier components, interface, and operations.
Wafer Plane
Specification Purpose and Benefits
Explains the purpose of wafer plane specification and its advantages for wafer transfer.
General Definitions
Clarifies concepts like wafer plane, zone, pocket center plane, and datums for predictable wafer positioning.
Specification Description and Values
Details offset dimension, tolerance, and typical specification values for wafer plane.
Use with Automated Equipment
Discusses the importance of wafer plane for automated wafer transfer systems.
Four Point Contact
Contact Location and Benefits
Describes the placement and advantages of the four-point contact system for carrier stability.
Equipment Interface and Carrier Types
Guides equipment design and lists carriers with/without four-point contact features.
General Interface Information
Interface Design Recommendations
Emphasizes using recommended points, print-based design, and tolerances for reliable interfaces.
Reducing Particle Generation
Suggests design features for interface plates to minimize particle generation.
Interface Points: Wafers Horizontal
Recommendations and Plate Design
Advises on contact points and interface plate design for horizontal wafer handling.
Contact Areas A, B, and C Details
Provides specific dimensions and interface locations for contact areas A, B, and C.
Interface Points: Wafers Vertical
Recommendations and Contact Areas
Guides interface design for vertical wafer handling using specific contact points.
Center Notch Location
Details the positioning of center notches for accurate wafer carrier registration.
Interface Points: Robotic Handling
General Recommendations
Advises referencing specific carrier specs and lists robotic handling feature categories.
Endwall Flanges
Describes endwall flanges, including inboard and outboard types, for robotic interaction.
Endwall Handle and Track Contact
Details endwall handles and track contact for robotic positioning and carrier orientation.
H-bar End Flanges and Top Flanges
Describes H-bar end flanges and top flanges for robotic movement and placement.
Material Information
Key Material Properties
Explains dimensional stability, static protection, and moisture absorption affecting equipment interface.
Carrier Applications and Materials
Differentiates wafer transport and process carriers and lists their material properties.
Process Wafer Carrier Materials
Details properties of PFA material for process wafer carriers requiring chemical resistance.
Detailed Material Properties Data
Presents specific data on static protection, moisture absorption, temperature, and flammability.
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