HPE Apollo 2000 Gen10 Plus System Manual

Also See for Apollo 2000 Gen10 Plus System:

Product end-of-life disassembly instructions (9 pages)

Table of Contents

Contents

1 Purpose
2 Items Requiring Selective Treatment
3 Tools Required
4 Product Disassembly Process
5 Documents / Resources
- 5.1 Download manual

HPE Apollo 2000 Gen10 Plus System Manual

Purpose

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment (WEEE).

Product End-of-Life Disassembly Instructions

Product Category: Servers

Marketing Name / Model [List multiple models if applicable.]
HPE Apollo 2000 Gen10 Plus System
HPE Apollo n2400 Gen10 Plus SFF CTO Chassis
HPE Apollo n2600 Gen10 Plus SFF CTO Chassis
HPE Apollo n2800 Gen10 Plus SFF CTO Chassis

Items Requiring Selective Treatment

Items listed below are classified as requiring selective treatment.
Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description	Notes	Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)	With a surface greater than 10 sq cm	15
Batteries	All types including standard alkaline and lithium coin or button style batteries	1
Mercury-containing components	For example, mercury in lamps, display backlights, scanner lamps, switches, batteries	0
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm	Includes background illuminated displays with gas discharge lamps	0
Cathode Ray Tubes (CRT)		0
Capacitors / condensers (Containing PCB/PCT)		0
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height	Depending on Power Supply	7
External electrical cables and cords		0
Gas Discharge Lamps		0
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)	There's no containing Brominated Flame Retardants	0
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner	Include the cartridges, print heads, tubes, vent chambers, and service stations.	0
Components and waste containing asbestos		0
Components, parts and materials containing refractory ceramic fibers		0
Components, parts and materials containing radioactive substances		0

Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description	Tool Size (if applicable)
Screwdriver	T10/T15

Product Disassembly Process

List the basic steps

List the basic steps that should typically be followed to remove components and materials requiring selective treatment

PCA-Remove all of PCAs with screwdriver
Megacell Module– Remove the top cover and locate the megacell on the system. Remove the megacell and dispose of properly.
Capacitors>2.5 cm-Removing the Node module from chassis, removing the node cover by pressing down cover latch, locate the capacitors and use a medium flat head screwdriver to remove them and dispose of properly.

Optional Graphic

If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1-15 - PCA Pictures
Attachment 16 – Megacell Module Location
Attachment 17-20 – Super Cap Location in PSU