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Global Intelligent Platform
Product
Manual
Version: 1.0.0
1 Product Overview
BTFM-G01 is a low-power embedded Bluetooth module developed by Tuya Smart that
supports Apple's Find My function. It consists of a highly integrated radio frequency chip, a
three-axis acceleration sensor chip and peripheral devices, and has a built-in Bluetooth
network communication protocol stack and rich library functions.
BTFM-G01 includes low-power ARM Cortex CPU, Bluetooth 5.1 protocol stack, 512KB
Flash, 128KB RAM and 10 I/O ports with specific functions.
1.1 Features
Built-in low-power ARM Cortex microprocessor, supporting floating-point operations
Main frequency up to 64MHz
Power Consumption 30uA/MHz
Working voltage: 2.2V-3.6V
Peripherals: 6×GPIOs, 1×Data UART, 1×Log UART and 1×ADC
BLE RF features
Compatible with BLE 5.1
Up to 2 Mbit/s RF data rate
TX power: +7 dBm
RX sensitivity: –97 dBm at BLE 1 Mbit/s
TX transmit current: 3.05mA @0dBm,1Mbps
RX receive current: 3.9mA @1Mbps
Onboard PCB antenna with 1.61 dBi gain
Working temperature: –20°C to +65°C
Tuya BTFM-G01 BLE Module
Date: 2013-01-14
No.: 0000000001
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Summary of Contents for TUYA BTFM-G01
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Page 1: Product Overview
No.: 0000000001 1 Product Overview BTFM-G01 is a low-power embedded Bluetooth module developed by Tuya Smart that supports Apple's Find My function. It consists of a highly integrated radio frequency chip, a three-axis acceleration sensor chip and peripheral devices, and has a built-in Bluetooth network communication protocol stack and rich library functions. -
Page 2: Applications
BTFM-G01 Datasheet 1.2 Applications Smart Outdoor Products Consumer products requiring anti-lost functionalitySmart households... -
Page 3: Change History
BTFM-G01 Datasheet Change History Version After Date Change Description Change 2023-0114 This is the first release. 1.0.0... -
Page 4: Table Of Contents
BTFM-G01 Datasheet Contents 1 Product Overview .......................1 1.1 Features ........................1 1.2 Applications ......................2 Change History ........................3 2 Module Interfaces ......................5 2.1 Dimensions and Footprint ..................5 2.2 Interface Pin Definition .................... 6 3 Electrical Parameters ......................8 3.1 Absolute Electrical Parameters ................8 3.2 Electrical Conditions ....................8... -
Page 5: Module Interfaces
BTFM-G01 Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint BTFM-G01 has two rows of pins with a 1.5mm pin spacing. The BTFM-G01 dimensions are 15mm±0.35 (W)×21mm±0.35 (L)×2.85mm(H). Figure 2-1 shows the BTFM-G01 pins. Figure 2-1 BTFM-G01 pins... -
Page 6: Interface Pin Definition
BTFM-G01 Datasheet 2.2 Interface Pin Definition Table 2-1 BTFM-G01 interface pins Symbol Function Type Output Serial port UART1_TX, corresponding to P11 of IC, for log printout IO31 Output Audio square wave signal output, frequency is, corresponding to P34 of IC... - Page 7 BTFM-G01 Datasheet Symbol Function Type detection, corresponding to P24 of IC Hardware reset pin (active low), corresponding to Input IC's CHIPEN Power supply reference ground pin Note: P indicates power supply pins, I/O indicates input/output pins.
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Page 8: Electrical Parameters
BTFM-G01 Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Minimum Maximum Parameter Description Unit Value Value Storage –20 °C temperature Power supply V BAT –0.3 voltage Static electricity voltage Tamb - 25°C (human body model) Static electricity voltage Tamb - 25°C... - Page 9 BTFM-G01 Datasheet Minimum Typical Maximum Parameter Description Unit Value Value Value input high-level 0.7×VBAT VBAT input low-level VSS+0.4 output high-level VBAT-0.4 VBAT output IO drive Imax current...
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Page 10: Rf Features
BTFM-G01 Datasheet 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.4 GHz ISM band Wireless standard BLE 5.1 Data transmission rate 1 Mbps,2 Mbps,500 kbps,125 kbps Antenna type Onboard PCB antenna 4.2 RF Output Power... - Page 11 BTFM-G01 Datasheet Minimum Typical Maximum Parameter Unit Value Value Value 2 Mbit/s –93...
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Page 12: Antenna Information
If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance. Because BTFM-G01 is inserted to the PCB, sufficient space needs to be reserved for the antenna. - Page 13 BTFM-G01 Datasheet...
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Page 14: Packaging Information And Production Instructions
Datasheet 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions Figure 6-1 BTFM-G01 mechanical dimensions Note: The default dimensional tolerance is ±0.35 mm, and the tolerance for some measurements is ±0.1 mm. If a customer has other requirements, clearly specify them in... -
Page 15: Production Instructions
Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module. - Page 16 Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
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Page 17: Recommended Oven Temperature Curve
BTFM-G01 Datasheet Before SMT placement, take electrostatic discharge (ESD) protective measures. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. -
Page 18: Storage Conditions
BTFM-G01 Datasheet 6.4 Storage Conditions... -
Page 19: Appendix: Statement
8 Appendix: Statement 7 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. The module is limited to installation in mobile or fixed applications. This device complies with Part 15 of the FCC Rules. - Page 20 Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
- Page 21 8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
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