Zeiss EVO Series Instruction Manual
  1. Manuals
  2. Brands
  3. Zeiss Manuals
  4. Microscope
  5. EVO Series
  6. Instruction manual
Zeiss EVO Series Instruction Manual

Zeiss EVO Series Instruction Manual

Scanning electron microscope
Hide thumbs
Table of Contents

Advertisement

Quick Links

Download this manual
Instruction Manual
EVO
series
®
Scanning Electron Microscope

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the EVO Series and is the answer not in the manual?

Questions and answers

Related Manuals for Zeiss EVO Series

Summary of Contents for Zeiss EVO Series

  • Page 1 Instruction Manual series ® Scanning Electron Microscope...
  • Page 2 Software programs will fully remain the property of Carl Zeiss Microscopy. No program, documentation or subsequent upgrade thereof may be disclosed to any third party, unless prior written consent of Carl Zeiss Microscopy has been procured to do so, nor may they be copied or otherwise duplicated, even for the customer’s internal needs apart from a single back-up copy for safety purposes Due to an ongoing process of improvement Carl Zeiss Microscopy reserves the right to make modifications of this document without notice.

  • Page 3: Table Of Contents

    Contents Table of contents 1. About this manual ..................9 1.1. Safety instructions in this manual ..............10 1.2. Typographical conventions ................11 1.3. Definition of terms ..................12 2. Safety ......................13 2.1. Intended use ....................13 2.2. Prevention of accidents and of improper use ..........13 2.3.
  • Page 4 Contents 3.3.5. Signal detection ..................... 43 3.3.5.1. Principles of detection ....................44 3.3.5.2. ET-SE detector (SE detector) ..................46 3.3.5.3. VPSE G3 detector (optional)..................51 3.3.5.4. (HD)BSD detector (optional) ..................53 3.3.5.5. CL detector (optional)....................54 3.3.5.6. STEM detector (optional) ....................55 3.4.
  • Page 5 Contents 6.4.7.2. Using the auto gun alignment function ................92 6.4.7.3. Using the auto aperture alignment function..............93 6.4.7.4. Using the drift correction function.................. 94 6.4.7.5. Using the sample type selection function ..............96 6.4.7.6. Using the image navigation function ................98 6.4.7.7.
  • Page 6 7.2.7. Cleaning the firing unit ..................220 7.2.7.1. Cleaning the filament holder ..................223 7.2.7.2. Cleaning the Anode..................... 224 7.3. Preventive maintenance performed by a ZEISS service representative .227 7.4. Repair ......................228 7.4.1. Replacing the chamber door O-ring ..............228 7.4.2.
  • Page 7 Contents 10. Parts and tools ..................235 10.1. Important consumables ................235 10.2. Important spare parts ................236 10.3. Optional software licences ................ 236 10.4. Tools and accessories ................236 11. Abbreviations ..................237 12. Glossary ....................239 13. Declaration of conformity ..............241 14.
  • Page 8 Contents ® VIII Instruction Manual EVO en03...

  • Page 9: About This Manual

    This instruction manual is designed for users who have been trained to operate the SEM by an authorised ZEISS service representative. Operators of the SEM must not deviate from the in- structions provided in this document.

  • Page 10: Safety Instructions In This Manual

    1. About this manual Safety instructions in this manual 1.1. Safety instructions in this manual The safety instructions in this manual follow a system of risk levels, that are defined as follows: DANGER This safety symbol and signal word indicates an imminently hazardous situation. Disregarding this warning WILL result in death or serious injury.

  • Page 11: Typographical Conventions

    1. About this manual Typographical conventions 1.2. Typographical conventions For the description of software, the following typographical conventions are used: Typography Meaning Push <ENTER>. Push the ENTER key on the keyboard. Type <key1, key2> Type key 1 first, then type key 2 on the keyboard. Type <Ctrl + Alt + Del>.

  • Page 12: Definition Of Terms

    SEM. ® Operating software for ZEISS scanning electron microscopes. SmartSEM Specially trained service expert, either ZEISS staff or authorised serv- ZEISS service representative ice partner of ZEISS. Operator A trained person, who is assigned to operate the SEM.

  • Page 13: Safety

    SEM. You will find the user documentation in a plastic bag. Within the scope of initial start-up the ZEISS service representative will deliver a basic operator Operator training. The basic operator training consists of fundamental operation procedures including safe- training ty instructions.

  • Page 14: Safety Summary

    2.3.1. Hazards related to personal injury Service tasks DANGER Danger to life: Hazardous voltage inside the SEM. Only service engineers trained and authorised by ZEISS service representative are al- lowed to service the SEM. WARNING Magnetic fields can interfere with medical implants.
  • Page 15 WARNING Radiation hazard: X-rays are generated inside the SEM during operation. Only authorised ZEISS service representatives are allowed to service the SEM. Do not remove any parts. Do not disable any parts of the interlock system. Use genuine ZEISS parts exclusively.
  • Page 16 2. Safety Safety summary Electrical connections CAUTION High leakage current Ensure proper grounding. Do not operate the SEM without separate ground connection. Gaseous dry nitrogen is used to vent the specimen chamber during specimen exchange. Gases Compressed air is used to operate several valves and the auto levelling system. CAUTION Suffocation hazard due to lack of oxygen, since the specimen chamber is vented with gaseous nitrogen.

  • Page 17: Hazards Not Related To Personal Injury

    Some parts inside the SEM will get hot during the bakeout procedure. Do not place any combustible objects on the top of the electron optical column. Only authorised ZEISS service representatives is allowed to service the equipment. Dis- connect power and let surfaces cool before opening.
  • Page 18 2. Safety Safety summary CAUTION Risk of property damage Connect ZEISS-approved equipment only. Ensure the total load connected to the SEM does not exceed 10 A. IMPORTANT Fingerprints can cause vacuum leaks. Always wear lint-free gloves when touching the specimen or inner parts of the specimen chamber.

  • Page 19: Fire Risk Summary

    2. Safety Safety summary 2.3.3. Fire risk summary In case of fire, small amounts of fumes may be emitted from various materials within the SEM. In summary, it can be stated that there is only a low probability of fire originating from the SEM. ®...

  • Page 20: Safety Equipment

    2. Safety Safety equipment 2.4. Safety equipment 2.4.1. Safety devices In order to prevent any risk of hazard to human health or of property damage, the SEM is equipped with several safety and protective devices. 2.4.1.1. Protective cover panels Plinth, electron optical column and specimen chamber are secured with protective cover panels. WARNING Hazardous voltage inside the SEM.

  • Page 21: Beam Deceleration Kit Interlock System

    Do not remove labels from the SEM. If damage occurs to any label(s) so that you cannot read it fully, contact ZEISS to request a new label. Fit the new label in place of the damaged label. ®...

  • Page 22: At The Rear Of The Electron Optical Column (With Optional Ion Pump System Only)

    2. Safety Safety equipment 2.4.2.1. At the rear of the electron optical column (with optional Ion Pump system only) Position Subject Label Safety information CAUTION Hot Surface Skin burns under contact. Do not touch. This area may get hot. Safety WARNING information Hazardous voltage inside...

  • Page 23: At The Rear Of The Instrument

    2. Safety Safety equipment 2.4.2.2. At the rear of the instrument Position Subject Label Legal information Safety information CAUTION X rays produced when energized The microscope should be approved by the national regulations. Do not remove any parts. ® 23 of 246 Instruction Manual EVO en03...

  • Page 24: Inside Sem

    Safety equipment 2.4.2.3. Inside SEM Underneath the cover panels of the SEM there are some more safety labels, which are addressed to authorised ZEISS service representatives. These safety labels are described in the documents for ZEISS service representative. ® 24 of 246...

  • Page 25: Description

    3. Description Overview 3. Description 3.1. Overview ® ON/STANDBY/OFF button Electron optical column, EVO column Plinth Monitors Specimen chamber SEM control computer ® Fig. 3.1: EVO system overview ® 25 of 246 Instruction Manual EVO en03...

  • Page 26: Evo ® Ma And Ls

    10 times brighter than a standard LaB6 source. This is achieved with a factory pre-aligned firing unit that is supplied by ZEISS. The operation of a HD gun is almost identical to tungsten and LaB6, any user familiar with the ®...

  • Page 27: Control Elements

    3. Description Control elements 3.2. Control elements ® 3.2.1. SmartSEM user interface ® The SEM is controlled by the SmartSEM software. The software is operated via a graphical user interface. checkbox toolbar navigation radio button panel icon menu bar drop-down list caption bar slider Panel Configuration bar...

  • Page 28: Dual Joystick

    3. Description Control elements 3.2.2. Dual joystick The dual joystick is used for stage control and specimen navigation. The large joystick on the right is used to drive X- and Y-axis. The stage rotation is controlled by turning the upper knob to the left or to the right.

  • Page 29: Optional Control Panel

    3. Description Control elements 3.2.3. Optional control panel The control panel is optionally available. It integrates a full sized keyboard and allows direct ac- cess to 14 of the most frequently used functions on the SEM. The following functions are available through: Knobs Push buttons •...

  • Page 30: Principle Of Operation

    3. Description Principle of operation 3.3. Principle of operation The SEM uses a beam of electrons to generate an image or to analyse the specimen. The electron beam scans the specimen surface. 3.3.1. Vacuum system For operation of the SEM, gun head (1), column and specimen chamber have to be under vacu- um.
  • Page 31 3. Description Principle of operation An ion getter pump is used to keep the gun area under high vacuum (2). Gun vacuum The vacuum in the gun head is called ’Gun vacuum’. It should be well below 5 x 10 mbar.

  • Page 32: High Vacuum Mode

    3. Description Principle of operation 3.3.1.1. High Vacuum mode The 20 µm or 30 µm mid-column apertures are used for the beam profile control in High Vacuum ® configured EVO systems (no pressure limiting aperture is fitted under the SEM pole piece). ®...

  • Page 33: Variable Pressure Mode

    3. Description Principle of operation 3.3.1.2. Variable Pressure mode The Variable Pressure (VP) mode enables imaging specimens that are non-conducting, strongly outgassing, or humid, without the need for vapour deposition or other preparation procedures. This is made possible by using a differential pumping system which allows partial pressures above 10 Pa to be set in the specimen chamber while maintaining high vacuum in the gun area.
  • Page 34 3. Description Principle of operation The residual gas atmosphere in the specimen chamber creates an interaction region of electrons Operating and residual gas molecules between the final lens and the specimen. In this region, high-energy principle electrons in the primary electron beam hit the residual gas molecules and ionise them. The ions generated in these collisions contribute to the compensation of negative charge on the specimen.

  • Page 35: Extended Pressure Mode

    3. Description Principle of operation 3.3.1.3. Extended Pressure mode Extended Pressure (EP) mode is required for imaging hydrated specimens. This will enable the study of hydrated specimens in their native state with little or no loss of water in the SEM (the specimen is kept fully hydrated during the pump down).

  • Page 36: Pressure Ranges And Apertures

    3. Description Principle of operation 3.3.1.4. Pressure ranges and apertures Min/Max Application Hardware Filament pressure* MA 10 Charge compen- 10-400 Pa MA 15 sation MA 25 VP aperture Charge compen- 10-273 Pa LaB6 sation + EasyVP VP aperture Charge compen- 10-400 Pa W + LaB6 sation +...
  • Page 37 3. Description Principle of operation Min/Max Application Hardware Filament pressure* LS 10 Hydrated speci- 10 – 1000 Pa W + LaB6 LS 15 men imaging (1000 µm) LS 25 10 – 3000 Pa EP aperture 500 µm 500 µm (500 µm) or 1000 µm or 1000 µm Table 3.4: LS: Hydrated specimen imaging...

  • Page 38: Specimen Stage

    3. Description Principle of operation 3.3.2. Specimen stage Standard specimen stage is a 5-axes motorised Cartesian stage that is controlled by the Smart- ® software. The stage can be operated by the dual joystick controller or by using the soft ®...

  • Page 39: Electron Optics

    3. Description Principle of operation 3.3.3. Electron optics ® The EVO column is the area of the SEM, where electrons are emitted, accelerated, deflected, ® focused, and scanned. Main characteristics of the EVO optics are the condensor and objective lenses. W or LaB cathode Scanning and stigmator coils...
  • Page 40 3. Description Principle of operation A double condenser system (3) allows the continuous regulation of the probe current. Condensers The electron beam passes through the currently selected aperture in the mechanical mid-column Apertures aperture changer (4) to ensure optimum quality of beam is maintained. The scanning coils (5) move the electron beam in a point-by-point scan over the specimen Scanning and surface.

  • Page 41: Evo Column Optibeam Modes

    3. Description Principle of operation ® 3.3.4. EVO column Optibeam modes ® The EVO column offers the following Optibeam modes: Optibeam Characteristics Beam path modes The specimen remains in focus for any change in probe Analysis mode current. A larger field of view for navigation and a large depth of field. Field mode ®...
  • Page 42 3. Description Principle of operation Optibeam Characteristics Beam path modes Smallest probe diameter for a chosen probe current at any Resolution mode working distance or keV. Largest depth of field for a chosen probe current, at any Depth mode working distance or keV. Largest field of view for navigation and a very large depth of Fisheye mode field.

  • Page 43: Signal Detection

    3. Description Principle of operation 3.3.5. Signal detection The interaction products most frequently used for the generation of images in scanning electron microscopy are secondary electrons (SE) and backscattered electrons (BSE). Detected Standard detectors Typical application signals Topography and surface structure. SE detector (Everhart-Thornley) Variable pressure applications.

  • Page 44: Principles Of Detection

    3. Description Principle of operation 3.3.5.1. Principles of detection When a primary electron (PE) beam hits a specimen, certain electron beam interaction processes occur. Secondary electrons (SEs) and backscattered electrons (BSEs) are then generated. Specific types of detectors are able to detect the SEs and BSEs, and the detector signals can be used to create images and produce information about the properties of the specimen.
  • Page 45 3. Description Principle of operation All electrons with energy higher than 50 eV are known as backscattered electrons (BSEs). Backscatter electrons BSEs are generated by elastic scattering in a much deeper range of the interaction volume and carry depth information. The backscatter coefficient increases with increasing atomic number of the elements within the specimen.

  • Page 46: Se Detector (Se Detector)

    3. Description Principle of operation 3.3.5.2. ET-SE detector (SE detector) The ET-SE-, or the Everhart-Thornley-, detector is mounted on the wall of the specimen cham- ber-, and is therefore classed as a ‘chamber detector’. Due to its position in the chamber, the SE detector views the specimen laterally.
  • Page 47 3. Description Principle of operation When the high energy electrons hit the scintillator layer (2), photons are generated inside the Operating scintillator.These photons are directed towards the light pipe (3) and are transferred to the pho- principle tomultiplier (5). The photomultiplier multiplies the flashes of light and outputs a signal that can be used for imaging.
  • Page 48 3. Description Principle of operation • When using a positive collector bias voltage, surfaces that are tilted in the direction of the- detector are emphasised, but there are no shadowing effects. +300 V collector bias voltage • When using a negative collector bias voltage, the image shows enhanced topographical contrast, which arises mainly from the extreme shadowing effects.
  • Page 49 3. Description Principle of operation Parameter Value Recommended conditions 100 V to 30 kV In principle suitable for the entire Acceleration voltage high-voltage range. 1 kV to 5 kV Low-voltage applications for the compensation of charges and for surface-sensitive imaging. 5 kV to 20 kV Average voltage range.
  • Page 50 3. Description Principle of operation Parameter Value Recommended conditions Tilting the sample towards the Specimen tilt detector increases collection efficiency. Only suitable in high vacuum. Operation mode Table 3.6: Recommended settings for imaging with the SE detector ® 50 of 246 Instruction Manual EVO en03...

  • Page 51: Vpse G3 Detector (Optional)

    3. Description Principle of operation 3.3.5.3. VPSE G3 detector (optional) The variable-pressure secondary electron (VPSE G3) detector is designed to generate images that are similar to those produced by SE detectors, but in the variable pressure (VP) mode. The secondary electrons generated on the specimen are attracted to the VPSE G3 detector (voltage applied by the VPSE G3 collector bias).
  • Page 52 3. Description Principle of operation Another key parameter is the length of time that the primary electron beam dwells on the Dwell time specimen. If this dwell time is too short at a fast scan rate, there is not sufficient time for an ion cascade to develop or for the residual gas molecules to generate the imaging photons.

  • Page 53: Hd)Bsd Detector (Optional)

    3. Description Principle of operation 3.3.5.4. (HD)BSD detector (optional) The BSD/HDBSD is a semiconductor detector that has four or five silicon diode segments. When high energy backscattered electrons hit the different segments, electron-hole pairs are generated in these segments. The separation of charges and the current in each segment can be measured and used to generate an image.

  • Page 54: Cl Detector (Optional)

    The detector can be used during EDS and wavelength-dispersive spectrometer (WDS) measurements, at any valid magnification. IMPORTANT For detailed information on EVO applications please search for Electron & Ion Beam Microscopy on www.zeiss.com/microscopy and select Applications. ® 54 of 246 Instruction Manual EVO...

  • Page 55: Stem Detector (Optional)

    3. Description Principle of operation 3.3.5.6. STEM detector (optional) The STEM unit consists of a diode electron detector positioned under an electron transparent thin specimen in a pre-aligned holder which fits directly on the specimen stage. The STEM unit enables positioning of the thin specimen close to the objective lens which improves resolution. The collected signals are equivalent to bright field imaging.

  • Page 56: Specification

    3. Description Specification 3.4. Specification ® 3.4.1. EVO ® ® ® Essential specifications MA 10 and LS 10 MA 15 and LS 15 MA 25 and LS 25 3 nm (2 nm) @ 30 kV - SE and W (LaB 3.5 nm @ 30 kV - SE VP mode with W 15 nm @ 30 kV - 1nA, LaB Resolution...

  • Page 57: Evo ® Hd

    3. Description Specification ® 3.4.2. EVO ® ® Essential specifications HD MA 15 HD MA 25 1.9 nm @ 30 kV SE 3 nm @ 30 kV SE VP mode 10 nm @ 30 kV 1 nA Resolution 5 nm @ 3 kV SE 8 nm @ 1 kV SE <...

  • Page 58: Technical Data

    3. Description Technical data 3.5. Technical data 3.5.1. Layout and connections Static vibration damper A Mains power supply 208...230V/25A, 1/N(L2)/PE II Pre-vacuum pump B Equipotential bonding bar III Computer workplace C Pressure reducer (water, nitrogen, compressed air) IV Emergency Off (EMO) button (optional) D Main shut-off valves E Nitrogen supply F Exhaust line...

  • Page 59: System Layout

    3. Description Technical data 3.5.2. System layout Size (mm) Weight (kg) Distribution approx. Description Footprints approx. of load length x width x height Plinth + column 822 x 980 x 1783 4 x 220 kg 4 x Ø 80 mm Table + PC 1148 x 980 x 1250 4 x 24.3 kg...

  • Page 60: Installation Requirements

    3. Description Technical data 3.5.3. Installation requirements Location requirements Installation site Exclusively inside buildings Room size min 3.0 m x 4.0 m x 2.3 m (LxWxH) Service area min 1.0 m at each side Installation category Electrical supplies Nominal AC voltage 100-240V 50/60 Hz Single Phase Protection class Nominal frequency...
  • Page 61 3. Description Technical data Environmental requirements Ambient Temperature approx. 23°C +/-1°C Stability 0.5°C/h Relative humidity Less than 65 % Altitude Maximum 2000 m above sea level Pollution degree IMPORTANT ® Also refer to the documents Product Specification EVO and Installation ®...

  • Page 62: Options

    Software add-ins and enhancements • Column maintenance kit, O-ring kit For full details of the available options and accessories, please contact your local ZEISS service representative or sales representative. 3.7. Customer service For customer service, please contact your local ZEISS service representative.

  • Page 63: Transport And Storage

    4. Transport and storage Transport 4. Transport and storage 4.1. Transport CAUTION Crushing hazard while load is being moved or lowered. Maintain a safe distance. Do not walk or place your hands or feet under the load while it is being lowered.

  • Page 64: Storage

    4. Transport and storage Storage 4.2. Storage The packed SEM has to be stored in a dry place. Temperature during storage has to be between -10° C and +70° C. ® 64 of 246 Instruction Manual EVO en03...

  • Page 65: Installation

    5. Installation 5. Installation Unpacking, installation and first start-up are carried out by an authorised ZEISS service repre- sentative. ® 65 of 246 Instruction Manual EVO en03...
  • Page 66 5. Installation ® 66 of 246 Instruction Manual EVO en03...

  • Page 67: Operation

    6. Operation Switching on the SEM 6. Operation This chapter contains information about: At a glance • Switching on the SEM ® • Starting the SmartSEM user interface ® • Finding your way in the SmartSEM user interface • Obtaining a first image •...

  • Page 68: Starting The Smartsem ® User Interface

    6. Operation ® Starting the SmartSEM user interface ® 6.2. Starting the SmartSEM user interface Preconditions: • The SEM is switched on. ® • The Windows operating system has been loaded. ® Select Start/All Programs/SmartSEM/SmartSEM User Interface or click the SmartSEM icon on the desktop, if available.
  • Page 69 6. Operation ® Starting the SmartSEM user interface ® The EM Server is minimised to a small element (icon) on the right side of the Windows task bar. ® Now, the SmartSEM software is ready to operate the SEM. ® 69 of 246 Instruction Manual EVO en03...

  • Page 70: Finding Your Way In The Smartsem ® User Interface

    6. Operation ® Finding your way in the SmartSEM user interface ® 6.3. Finding your way in the SmartSEM user interface 6.3.1. Showing or hiding toolbars Several toolbars such as user toolbar, status bar, and annotation bar are available for easy ®...

  • Page 71: Showing Or Hiding The Data Zone

    6. Operation ® Finding your way in the SmartSEM user interface 6.3.2. Showing or hiding the data zone The data zone is used to display current parameters. You can also include a micron marker to show the base magnification. The default toolbar is shown below. Select View/Data Zone/Show Data Zone from the menu.

  • Page 72: Using Docking Panels

    6. Operation ® Finding your way in the SmartSEM user interface 6.3.4. Using Docking panels It is possible to dock various control panels onto the main window. The purpose of the docking panel is to keep the area of the image completely clear, as the docking panel is outside the main image display.
  • Page 73 6. Operation ® Finding your way in the SmartSEM user interface To stick a control panel to the docking panel, click the title bar of the control panel and drag it to the docking panel. The panel becomes integrated into the docking panel. You can place several control panels in the docking panel.

  • Page 74: Opening The Panel Configuration Bar

    6. Operation ® Finding your way in the SmartSEM user interface To hide the docking panel, select View/Toolbars from the menu. untick the Docking Panel checkbox. The docking panel is hidden. 6.3.5. Opening the Panel Configuration bar From the menu bar, select Tools/Goto Panel. Alternatively, click the arrow button at the side of the image area.

  • Page 75: Obtaining A First Image

    6. Operation Obtaining a first image 6.4. Obtaining a first image The following section summarises basic sequences to quickly obtain an image using the SE de- tector. To simplify the procedure, the method described mainly uses SEM Controls panel and status bar functions.

  • Page 76: Preparing The Specimen Holder

    6. Operation Obtaining a first image 6.4.1. Preparing the specimen holder IMPORTANT Contamination caused by fingerprints can lead to vacuum deterioration or prolonged pumping times. Always wear lint-free gloves when touching specimen, specimen holder or stage. Attach the specimen to the stub by using con- ductive carbon, adhesive metal or carbon tape.

  • Page 77: Loading The Specimen Chamber

    6. Operation Obtaining a first image 6.4.2. Loading the specimen chamber Click the ChamberScope icon in the toolbar. This can also be achieved by pressing the Camera button on the hard front panel (optional). A TV view inside the specimen chamber is shown.
  • Page 78 6. Operation Obtaining a first image On the SEM Controls panel on the right hand side of the user interface, select the Vacuum tab. Click Vent to vent the specimen chamber. A message appears asking: ’Are you sure you want to vent?’. Confirm by clicking Yes.
  • Page 79 6. Operation Obtaining a first image Slowly open the chamber door. IMPORTANT Contamination caused by fingerprints can lead to vacuum deterioration or prolonged pumping times. Always wear lint-free gloves when touching specimen, specimen holder or stage. Keep the chamber door open as short as possible. All specimen holders are fitted with a dovetail fitting so that the position of the specimen holder is exactly defined.
  • Page 80 6. Operation Obtaining a first image CAUTION Pinch hazard when closing the chamber door. Use the recessed grip to close the chamber door. Ensure not to get your fingers caught in the chamber door gap. Carefully close the chamber door. 10 Click Pump in the SEM Control panel.

  • Page 81: Locating The Specimen

    6. Operation Obtaining a first image 6.4.3. Locating the specimen In TV mode (ChamberScope), look into the specimen chamber. CAUTION Risk of damaging the objective lens and/or your specimen. Ensure not to hit the objective lens while driving the stage. Watch the moving stage in TV mode.

  • Page 82: Switching On The Gun

    6. Operation Obtaining a first image 6.4.4. Switching on the gun In the Vacuum tab: Check that EHT Vac ready=Yes is indicated. Alternatively, check that there is a green tick alongside Vac: in the status bar. Click Gun in the status bar. Select Beam On from the pop-up menu.

  • Page 83: Switching On The Eht

    6. Operation Obtaining a first image 6.4.5. Switching on the EHT ’EHT’ stands for Extra High Tension. This voltage has to be applied to the gun in order to make it emit electrons. Watch the vacuum status messages on the Vacuum tab of the SEM Controls panel.
  • Page 84 6. Operation Obtaining a first image Switch on the EHT: Click EHT in the status bar. Select EHT On from the pop-up menu. The EHT will run up to the target value. The EHT is running up to 10 kV. The status bar buttons are merged and the All: button appears.

  • Page 85: Generating, Optimising And Saving Images

    6. Operation Obtaining a first image 6.4.6. Generating, optimising and saving images The following workflow describes how to obtain images with the SEM. To make it more compre- hensive, the workflow is separated into generating, optimising and saving images. IMPORTANT The following procedures describe how to manually perform the necessary steps.
  • Page 86 6. Operation Obtaining a first image Turn on the beam. Select the Detectors tab. From the Signal A = drop-down list, select SE2. Selecting the SE detector is recommended to obtain the first image, as this detector pro- vides a good signal-to-noise ratio even at large working distances.

  • Page 87: Optimising The Image

    6. Operation Obtaining a first image The current working distance (WD) is indicat- ed in the status bar. 14 If necessary change the stage Z position to set the WD to 8.5 mm. 15 Select the Detectors tab. 16 To adjust the contrast and brightness, use the Brightness and Contrast sliders.
  • Page 88 6. Operation Obtaining a first image The intensity of the wobble can be adjusted by using the Wobble Amplitude slider (2). Set the Wobble Amplitude between 60% and 70%. Wobble speed can be accelerated by activating the Wobble Fast checkbox (3). From the Panel Configuration bar, select Aperture Align.
  • Page 89 6. Operation Obtaining a first image 14 Use the mouse to change size, shape and po- sition of the reduced raster area. 15 Focus the image in the reduced raster. 16 Select the Apertures tab and click Stigma- tion (1). Alternatively use the control panel stigmation knobs or click STIG on the toolbar.

  • Page 90: Saving The Image

    6. Operation Obtaining a first image 6.4.6.3. Saving the image To save the image, click SAVE on the toolbar (2). Alternatively, select File/Save Image. To unfreeze the image, middle-click PHOTO on the toolbar (1). It is now possible to change the EHT, Iprobe and working distance to any value without changing the position of the X and Y micrometer gauges on the mid-column click aperture.

  • Page 91: Using Automated Or Semi-Automated Functions

    6. Operation Obtaining a first image 6.4.7. Using automated or semi-automated functions 6.4.7.1. Using the auto saturation function Auto saturation is used to automatically set the correct currents for tungsten filaments. The fila- ment current can vary depending on gun parameters such as the beam current and the acceler- ating voltage.

  • Page 92: Using The Auto Gun Alignment Function

    6. Operation Obtaining a first image 6.4.7.2. Using the auto gun alignment function Auto gun align is used to automatically align the shift and/or the tilt of the beam, to the centre of the column, using the emission image. From the Panel Configuration bar, select Gun Alignment. The Gun Alignment dialog opens.

  • Page 93: Using The Auto Aperture Alignment Function

    6. Operation Obtaining a first image 6.4.7.3. Using the auto aperture alignment function Auto aperture align is used to improve the quality of the images. When the aperture align is se- lected the software automatically aligns the beam with respect to the Easy VP aperture. IMPORTANT The feature is only available when the Easy VP aperture is fitted.

  • Page 94: Using The Drift Correction Function

    6. Operation Obtaining a first image 6.4.7.4. Using the drift correction function Drift correction allows you to rectify any image drift. Drift of features, in the site of interest, can occasionally occur when an area is imaged over a prolonged period of time, the stage is moved, or when reloading the specimen under investigation.
  • Page 95 6. Operation Obtaining a first image 1024x768. To save the reference image, click Create Reference. Change the store resolution to the standard value (1024x768). The drift correction process will use the imaging conditions set when the reference was cre- ated and when it is complete the imaging settings will be restored. Once the reference rectangle is selected and the reference image has been saved, click Hide Rectangle to continue working on the specimen.

  • Page 96: Using The Sample Type Selection Function

    6. Operation Obtaining a first image 6.4.7.5. Using the sample type selection function the sample type selection functionality enables the user to obtain an image from any specimen quickly, i.e. a reference image, without putting any effort in selecting the operating parameters (vacuum mode, accelerating voltage probe current and detector).
  • Page 97 6. Operation Obtaining a first image Editing or It is possible to edit or add new sample types to the Sample Type Selection menu. adding new sample types In order to add a new sample type to the menu obtain an image from the desired specimen. From the Panel Configuration bar, select Sample Type Save.

  • Page 98: Using The Image Navigation Function

    6. Operation Obtaining a first image 6.4.7.6. Using the image navigation function Image navigation enables easy navigation of the specimen. The sites of interest on the speci- mens can simply be moved under the beam by double clicking on the preferred stub. Load a few specimens on a specimen holder and take a picture.

  • Page 99: Using The Automated Image Acquisition Function

    6. Operation Obtaining a first image Preferably, this should be the same location as the saved image. 6.4.7.7. Using the automated image acquisition function Prerequisites: • You have completed the manual registration as described in the previous section. • The automated image acquisition function requires one of the following specimen holders: - Single - Carousel8 - Single30...
  • Page 100 6. Operation Obtaining a first image The Automated Imaging dialog opens. To choose a folder for saving images, click Image Directory. Select the Define tab (1). Click Drag (2). To select an area, left click and drag the mouse on the specimen. The fields of view at the selected imaging con- ditions (accelerating voltage, magnification and working distance) determine the size of...
  • Page 101 6. Operation Obtaining a first image The list of regions of interests, the stub num- bers and the FOV are continuously updated and can be viewed on the left side of the dia- log (1). If any points or regions of interests need to be changed, click Edit (2).
  • Page 102 6. Operation Obtaining a first image 11 To be able to zoom in/out using the mouse wheel, activate the Zoom checkbox. Right clicking on a stub in combination with the zoom function will display the magnified image of the whole stub in the centre of the viewing area.
  • Page 103 6. Operation Obtaining a first image When the analysis is completed the software displays a new message box: Acquisition Completed. ® 103 of 246 Instruction Manual EVO en03...

  • Page 104: Setting Sem Conditions

    6. Operation Setting SEM conditions 6.5. Setting SEM conditions 6.5.1. Consider the properties of the specimen Specimens that are studied in the SEM can be divided into two main categories, namely conductors and non-conductors and these will be discussed in greater detail later. However there are several factors to consider during all specimen preparation and these are given below.

  • Page 105: Guide To Sem Operating Parameters

    6. Operation Setting SEM conditions 6.5.1.1. Guide to SEM operating parameters Optimum beam alignment is necessary for obtaining high quality images. It is therefore important Selecting the to select the appropriate mid-column aperture prior to specimen imaging. mid-column apertures and aligning the electron beam Imaging conductive specimens:...
  • Page 106 6. Operation Setting SEM conditions • MC = 30 μm • Cycle time to reduce noise = 20 • EHT = 20 kV for metals and minerals • EHT = = 8 to 10 kV for semiconductors and organic materials •...

  • Page 107: Selecting The Operation Mode

    6. Operation Setting SEM conditions Extended pressure mode for cooled hydrated specimens • EHT = 30 kV Iprobe = 300 pA WD = 8.5 mm • Filament I set to second peak • MC = 750 μm • PLA = 100 μm upper EP aperture ®...
  • Page 108 6. Operation Setting SEM conditions Select the Apertures tab in the SEM Control panel. Use the drop-down selection and the checkboxes to select the operation mode. These modes are accessible in HV mode (when no aperture is fitted) or when the EasyVP aperture is fitted: •...

  • Page 109: Changing The Pressure Mode

    6. Operation Setting SEM conditions 6.5.3. Changing the pressure mode 6.5.3.1. Changing to HV mode Select the Vacuum tab. Click Go To HV. After selecting HV the system will pump the chamber and open the turbo isolation valve. The chamber pressure and the system pressure will then reach the same pressure and display the same value.

  • Page 110: Changing To Variable Pressure Configuration From High Vacuum Configuration

    6. Operation Setting SEM conditions 6.5.3.2. Changing to Variable Pressure configuration from High Vacuum configu- ration Vent the chamber and remove the lens Changing to EasyVP mode mounted BSD (if fitted) and place it in the parked position. Retract all retractable detec- tors.
  • Page 111 6. Operation Setting SEM conditions Vent the chamber and remove the lens Changing to VP mode mounted BSD (if fitted) and place it in the parked position. Retract all retractable detec- tors. Fit the VP aperture (part no. 35070-0070-0000). Refit the lens mounted BSD detector if fitted. Select the Apertures tab.

  • Page 112: Changing To Extended Pressure Mode

    6. Operation Setting SEM conditions 6.5.3.3. Changing to Extended Pressure mode Vent the chamber and remove the lens mounted BSD (if fitted) and place it in the parked position. Retract all retractable detec- tors. ® Fit EP apertures and BeamSleeves appropriate.

  • Page 113: Aligning Easy Vp

    6. Operation Setting SEM conditions 6.5.3.4. Aligning Easy VP This alignment step is required to satisfactory align the beam through the 20 μm mid-column aperture. Select Tools/User Preferences... Check that Auto Calibration and User Align are set to Yes. After manually fitting the EasyVP aperture, select the Apertures tab and click Select Aperture.
  • Page 114 6. Operation Setting SEM conditions Select the Gun tab and set EHT target to 20 kV. Select OptiBeam Resolution from the drop-down menu. Select the Gun tab and set IProbe to 100 pA. Double-click WD in the data zone and set the working distance to 8.5 mm.
  • Page 115 6. Operation Setting SEM conditions Select the 20 micron mid-column click aper- ture. 10 Select the Detectors tab and select SE1 from the Signal drop-down list. 11 Select the Scanning tab and select Normal from the Operating Mode drop-down list. 12 Select the Apertures tab and select the 20.00 µm aperture from the Aperture Size drop-down list.
  • Page 116 6. Operation Setting SEM conditions 16 Click Aperture Align and click 0 to zero the aperture alignment. 17 Make sure that the filament is saturated and set the brightness and the contrast to 50%. 18 Adjust contrast to make the outer region of the emission image visible around the brighter, central part of the Emission Image.
  • Page 117 6. Operation Setting SEM conditions It is recommended to use the arrow buttons instead of the sliders for easier adjustment. Before alignment After alignment 21 Select the Scanning tab and select Normal from the Operating Mode drop-down list. 22 Focus on a feature on the specimen and still keep the WD to 8.5 mm. 23 Select a fast scan speed e.g.

  • Page 118: Changing From Easyvp To Variable Pressure Mode

    6. Operation Setting SEM conditions 6.5.3.5. Changing from EasyVP to Variable Pressure mode Vent the system If fitted, remove the lens mounted BSD detector and retract all retractable detectors. Remove the 750 µm EasyVP aperture. Insert the 100 µm VP-aperture. Refit the lens mounted BSD detector.

  • Page 119: Changing From Vp Mode / Ep Mode To Easyvp

    6. Operation Setting SEM conditions 6.5.3.7. Changing from VP mode / EP mode to EasyVP Vent the system If fitted, remove the lens mounted BSD detector and retract all retractable detectors. If present, remove existing VP or EP apertures. Fit the 750 μm EasyVP aperture. Refit the lens mounted BSD detector.
  • Page 120 6. Operation Setting SEM conditions Double-click Specimen Current Monitor. Tick the Spot checkbox. Activate the SCM On checkbox. The specimen current is measured permanently. The measured value is displayed in the field Specimen I =. ® 120 of 246 Instruction Manual EVO en03...

  • Page 121: Setting Detection Parameters

    6. Operation Setting SEM conditions 6.5.4. Setting detection parameters 6.5.4.1. Selecting a detector Select the Detectors tab. Select the detector from the Detectors drop- down list. ® 121 of 246 Instruction Manual EVO en03...

  • Page 122: Using The Se Detector

    6. Operation Setting SEM conditions 6.5.4.2. Using the SE detector Select the SE detector. If required, set the collector bias by moving the Collector Bias slider. The default value is 300 V. 6.5.4.3. Using the BSD detector (optional) Check that the lens mounted BSD detector is fitted. If it is in the parked position, Remove the BSD detector from the parked position.
  • Page 123 6. Operation Setting SEM conditions Set the mode of the quadrants: 4-segment BSD Click a quadrant symbol to change its sta- tus: normal (+), inverted (-) or disabled. To select compositional mode, click BSD: COMPO. To select topography mode, click BSD: TOPO.
  • Page 124 6. Operation Setting SEM conditions Stage biasing (beam deceleration) is a method used for decelerating the electron beam’s landing BSD Imaging energy by applying a negative potential to a specimen. The lower landing energy of the primary with Stage electrons provides the possibility to obtain more specimen surface detail especially at low mag- Biasing nifications.
  • Page 125 6. Operation Setting SEM conditions The HDBSD images below show the effect of applying a bias to an aluminium fracture spec- imen. The images are taken at 5 kV accelerating voltage, in HV and at a working distance of 8.5 mm. Fig.
  • Page 126 6. Operation Setting SEM conditions Preconditions: Using Beam deceleration • Stage has been initialised before fitting the beam deceleration carousel • HV mode is active • Beam deceleration carousel is fitted Procedure: From the Panel Configuration bar, select Stage Navigation. The Stage Navigation dialog opens.
  • Page 127 6. Operation Setting SEM conditions Activate the Beam deceleration checkbox. This enables adjustments of the Beam decel- eration volts slider.This enables the stage bias functionality as long as all the precondi- tions are met. The messages „Stage bias HV is ON“ and „Warning: Touch alarm not enabled“...
  • Page 128 6. Operation Setting SEM conditions Activate the Beam deceleration carousel checkbox. This enables the stage bias functionality as long as all the preconditions are met. Activate the Stage bias low voltage checkbox. This enables adjustments of the Stage bias Low Volts slider. CAUTION Risk of stage collision If you choose a voltage between -5 V and +5 V, a warning is displayed saying that touch...

  • Page 129: Other Optional Detectors

    6. Operation Setting SEM conditions 6.5.4.4. Other optional detectors There are several other optional detectors. They can be used as follows: • VPSE: Change to Variable Pressure mode as described in section 6.5.3.2. • EPSE: Change to Extended Pressure mode as described in section 6.5.3.3. •...

  • Page 130: Imaging Wet Specimens With The Peltier Coolstage

    6. Operation Setting SEM conditions 6.5.5. Imaging wet specimens with the Peltier coolstage A Peltier cooling stage and an Extended Pressure (EP) EVO system is required for imaging hy- drated specimens. This will enable to study hydrated specimen in their native state with little or no loss of water in the SEM (the sample is kept fully hydrated during the pump down).
  • Page 131 6. Operation Setting SEM conditions Using the red aperture insertion tool insert the 100 µm upper aperture in the final lens. This should be finger tight only. Using the black aperture insertion tool insert the 500 µm lower aperture. This should be finger tight only.
  • Page 132 6. Operation Setting SEM conditions Select the Apertures tab and click Select Aperture. Select the EP aperture, the panel will then expand. ® Select the 500µm Beam Sleeve ® 132 of 246 Instruction Manual EVO en03...
  • Page 133 6. Operation Setting SEM conditions Remove the round right hand blanking plate from the stage door using an Allen key SW 3. ® 133 of 246 Instruction Manual EVO en03...
  • Page 134 6. Operation Setting SEM conditions 10 Detach the Peltier-Coolstage assembly from its holder plate by undoing the cable ties. 11 Feed the Peltier-Coolstage holder through the hole in the stage door and carefully rest it with its pipe work on the stage. 12 Attach the Peltier head to the stage via the dovetail fitting used for all other sample holder types.
  • Page 135 6. Operation Setting SEM conditions 13 To ensure the Peltier cable is not too bent, twisted or strained it will be necessary to ad- just the stage using stage rotation to a suitable position. 14 Attach the Peltier-Coolstage holder to the SEM stage using an Allen key SW 2.5.
  • Page 136 6. Operation Setting SEM conditions 16 Place the plain stub onto the Peltier-Cool- stage sample holder using the stub tool. Ensure that the stub is positioned horizontally (is not tilted) for obtaining good contact to the cooling area. Maintaining a constant cooling temperature on the stub is essential for wet imaging of hydrated samples.
  • Page 137 6. Operation Setting SEM conditions 20 Switch on the Peltier Coolstage power supply. 21 Select the Gun Vacuum tab. 22 Click Pump. 23 Wait until Vac Status = Ready and EHT Vac ready = Yes are indicated. This can take some time. 24 Select Stage/Navigation from the menu bar.
  • Page 138 6. Operation Setting SEM conditions 25 Select CoolStage MK3 from the drop-down menu. If it is not in the list: Select Settings/Show Gallery. Select CoolStage MK3 from the catalogue. ® 138 of 246 Instruction Manual EVO en03...
  • Page 139 6. Operation Setting SEM conditions Tick the Is Available checkbox. CAUTION Risk of damaging the Peltier stage pipe by using stage rotation. Only move the stage in X and Y. 26 Select Tools/Administrator and log in with your username and password. 27 Select Other and tick the Peltier Fitted checkbox.
  • Page 140 6. Operation Setting SEM conditions 29 Select the Vacuum tab and select Go to EP. 30 Set EP Target to 10 Pa. ® 140 of 246 Instruction Manual EVO en03...

  • Page 141: Purging The Chamber

    6. Operation Setting SEM conditions 6.5.5.2. Purging the chamber From the Panel Configuration bar, select Ex- tended Pressure. The Extended Pressure window opens. Tick the Peltier checkbox Click Purge Settings..Check that EP Gas = Air is selected. The aim of purging is to remove air from the water bottle and to fill the chamber with just water vapour.
  • Page 142 6. Operation Setting SEM conditions • If the water kit has recently been fitted, filled with water, or has not been used for a while, con- How to tinue with procedure 1. continue • If the system has recently been used in the wet mode, continue with procedure 2. Set Purge cycles to 10.
  • Page 143 6. Operation Setting SEM conditions Set Purge cycles to 7. Procedure 2 Set Purge Max to 1000 Pa. Set Purge Min to 10 Pa. Click EP Gas = Air. This will then change the vacuum status to EP Gas = Water Vapour. Click Manual Purge H2O to start purging.

  • Page 144: Obtaining An Image In Ep Mode

    6. Operation Setting SEM conditions 6.5.5.3. Obtaining an image in EP mode In the Extended Pressure window set the Peltier Target to 1 °C and suitably adjust the Humidity Target. Adjusting the position of the green cross on the phase diagram will change the environ- ment of the sample;...
  • Page 145 6. Operation Setting SEM conditions Select a pressure around 100 Pa higher than the Purge Min value and enter that as Purge Max value. The Purge Cycle can now be changed to 3. Vent the chamber without changing any of the parameters. Remove the plain stub and dry the area underneath the stub on the Peltier coolstage.

  • Page 146: Using The Help Functions

    6. Operation Using the help functions 6.6. Using the help functions ® The SmartSEM user interface offers a multitude of help texts containing information on the operation of the SEM, the optimization of the images and the handling of accessory options.

  • Page 147: Calling The Context-Sensitive Help

    6. Operation Using the help functions 6.6.2. Calling the context-sensitive help Press <SHIFT+F1>. Alternatively, select Help/What’s This from the menu. The mouse cursor is equipped with a question mark. Move the cursor to the area of interest on the screen. Left-click with the mouse.

  • Page 148: Using The Step-By-Step Guides

    6. Operation Using the help functions 6.6.4. Using the step-by-step guides The step-by-step guides provide quick information on important operation sequences. 6.6.4.1. Getting started Select Help/Getting started from the menu. Click the topic of interest. 6.6.4.2. Frequently used operation sequences Select Help/How To from the menu.

  • Page 149: Calling The Short Cuts Help

    6. Operation Using the help functions 6.6.5. Calling the short cuts help ® Many functions and menus which are often used in the SmartSEM user interface can also be opened using the keyboard. A list of short cuts (key combinations) can be displayed in the Smart- ®...

  • Page 150: Showing Information About Smartsem

    6. Operation Using the help functions ® 6.6.6. Showing information about SmartSEM 6.6.6.1. Version history The Release Notes summarise important information about the software version history. New functions, bug fixes and special features of the different versions are explained. Select Help/Release Notes from the menu. ®...

  • Page 151: Finishing The Work Session

    6. Operation Finishing the work session 6.7. Finishing the work session To finish your work session, switch off the EHT: Click the All: button in the status bar. Select EHT Off from the pop-up menu. 6.7.1. Tungsten Emitter It is recommended that when using a Tungsten filament the gun is turned off when the system is not being used for any significant period of time.

  • Page 152: Closing The Smartsem ® User Interface

    6. Operation ® Closing the SmartSEM user interface ® 6.8. Closing the SmartSEM user interface 6.8.1. Logging off Select File/Log Off from the menu. A window appears asking for confirmation to close the session. Confirm by clicking on the Yes button. The electron-optical parameters are filed in a macro in the individual user directory.

  • Page 153: Switching Off The Sem As A Matter Of Routine

    6. Operation Switching off the SEM as a matter of routine 6.9. Switching off the SEM as a matter of routine 6.9.1. Changing to STANDBY mode Change to STANDBY mode when the SEM is not operated, even for longer periods. The filament will continue to be heated, and the vacuum in electron optical column and specimen chamber will be maintained.

  • Page 154: Changing To Off Mode

    6. Operation Switching off the SEM as a matter of routine 6.9.2. Changing to OFF mode Switch off the EHT. Switch off the gun. ® Close SmartSEM Select File/Exit from the menu. A window appears asking for confirmation to close the session.

  • Page 155: Switching Off In An Emergency

    6. Operation Switching off in an emergency 6.10. Switching off in an emergency Push down the circuit breakers at the back of the plinth. 6.10.1. Switching on again after an emergency off IMPORTANT Before switching on the SEM, ensure that the reason for the emergency off does not exist any more and that it is safe to switch on the SEM.

  • Page 156: Switching Off The Sem Completely

    6. Operation Switching off the SEM completely 6.11. Switching off the SEM completely This procedure completely cuts off the SEM from the electrical main supply. Switch off the EHT. Switch off the gun. ® Close SmartSEM Select File/Exit from the menu. ®...
  • Page 157 6. Operation Switching off the SEM completely ® 157 of 246 Instruction Manual EVO en03...
  • Page 158 6. Operation Switching off the SEM completely ® 158 of 246 Instruction Manual EVO en03...

  • Page 159: Maintenance And Repair

    Perform only such tasks described in this instruction manual. All pursuing tasks of maintenance, service, and repair not described in this instruction manual have to be performed by authorised ZEISS service representatives. IMPORTANT To maintain best possible performance of the SEM it is essential to perform preventive maintenance on a regular basis.

  • Page 160: Change Of Consumables And Chemicals

    Pre-vacuum pump Replace the tip seal. Refer to pump manufacturer’s documenta- tion. Yearly ETSE detector Contact the local ZEISS service representa- tive in order to have the detectors checked and scintillators replaced if required. ® 160 of 246 Instruction Manual EVO...

  • Page 161: Adjusting The Isolation Mounts

    7. Maintenance and repair Change of Consumables and Chemicals 7.1.1. Adjusting the isolation mounts The isolation mounts lose air over time. Therefore it is necessary to adjust them from time to time. CAUTION Crushing hazard. The gap between isolated table and plinth is designed to allow the specimen chamber to swing freely.

  • Page 162: Replacing The Tip Seal Of The Pre-Vacuum Pump

    7. Maintenance and repair Change of Consumables and Chemicals 7.1.2. Replacing the tip seal of the pre-vacuum pump Refer to the instruction manual of the pre-vacuum pump provided by the pump manufacturer. You will find this documentation in the SEM document folder. ®...

  • Page 163: Replacing Filaments

    7. Maintenance and repair Change of Consumables and Chemicals 7.1.3. Replacing filaments Possible reasons: • Filament has come to the end of its normal service life IMPORTANT You can display the operating hours of the filament by selecting View/SEM Status/ Select/Filament Age.

  • Page 164: Replacing Pre-Aligned Tungsten Filaments

    7. Maintenance and repair Change of Consumables and Chemicals 7.1.3.1. Replacing pre-aligned tungsten filaments CAUTION Risk of contamination. Dust particles and skin grease can cause bad vacuum and flashovers. Always wear gloves when changing the filament. Parts/special tools required part no. Pack of 10 pre-centred 354720-9919-000 tungsten filament cartridges...
  • Page 165 7. Maintenance and repair Change of Consumables and Chemicals Shutdown Gun. Select the Gun Vacuum tab. Click Vent Gun. The Vent Gun dialogue is displayed. Click Yes and allow system to fully vent before carrying out further steps in the procedure. ®...
  • Page 166 7. Maintenance and repair Change of Consumables and Chemicals Tick the New Filament checkbox. Vent the specimen chamber. Switch off the SEM as described in section 6.11. Remove the top cover. CAUTION Burning hazard The EO column gets hot during operation. After switching off the SEM, wait for fifteen minutes before opening the top section of the EO column.
  • Page 167 7. Maintenance and repair Change of Consumables and Chemicals Open the gun. 10 Unscrew the firing unit with an Allen key SW 1.5 (3 screws). The screws should remain in their holes if possible. ® 167 of 246 Instruction Manual EVO en03...
  • Page 168 7. Maintenance and repair Change of Consumables and Chemicals 11 Carefully remove the firing unit. 12 Put the firing unit on a clean surface. 13 Fit the filament tool into the slots in the brass retaining washer. ® 168 of 246 Instruction Manual EVO en03...
  • Page 169 7. Maintenance and repair Change of Consumables and Chemicals 14 To unscrew the brass retaining washer, care- fully turn the filament tool anticlockwise. 15 Remove the brass retaining washer. 16 Put the brass retaining washer on a clean surface. 17 Put your hand closely underneath the firing unit and turn it upside down.
  • Page 170 The tungsten filament deposits tungsten on the firing unit over time. These deposits have to be removed after every filament exchange. ZEISS encourages customers to keep a record on filament changes. This simplifies maintenance. 19 Take a new pre-aligned filament holder from the box.
  • Page 171 7. Maintenance and repair Change of Consumables and Chemicals 22 Put the new filament into the firing unit. 23 Reinstall the brass retaining washer and fix it with the filament tool. 24 Ensure the brass retaining washer is secure. If it makes any sound when shaking it, tighten the brass retaining washer a bit more.
  • Page 172 7. Maintenance and repair Change of Consumables and Chemicals 25 Align the slot at the side of the firing unit (1) with the pin inside the firing unit holder (2). 26 Carefully push in the firing unit. 27 Fix the screw with an Allen key SW 1.5. 28 Check the column O-ring (3).
  • Page 173 7. Maintenance and repair Change of Consumables and Chemicals 30 Close the gun. 31 Reinstall the top cover. 32 Switch on the SEM as described in section 6.1. ® 173 of 246 Instruction Manual EVO en03...

  • Page 174: Replacing Tungsten Filaments (Not Pre-Aligned) - Cleaning, Maintenance & Alignment

    7. Maintenance and repair Change of Consumables and Chemicals 7.1.3.2. Replacing tungsten filaments (not pre-aligned) - cleaning, maintenance & alignment This section describes how to replace regular tungsten filaments. These filaments are not pre- aligned. CAUTION Risk of contamination. Dust particles and skin grease can cause bad vacuum and flashovers. Always wear gloves when changing the filament.
  • Page 175 7. Maintenance and repair Change of Consumables and Chemicals Remove firing unit from SEM as described in section 7.1.3.1. Put the firing unit on a clean surface. Fit the filament tool into the slots in the brass retaining washer. To unscrew the brass retaining washer, care- fully turn the filament tool anticlockwise.
  • Page 176 7. Maintenance and repair Change of Consumables and Chemicals Put the brass retaining washer on a clean surface. Put your hand closely underneath the firing unit and turn it upside down. The filament holder and the tensator spring wash- er will slide out and drop into your hand. Disassemble the filament holder: Unscrew the four screws with an Allen key SW 1.5.
  • Page 177 The tungsten filament deposits tungsten on the filament holder over time. These deposits have to be removed after every fifth filament exchange. This also applies to the anode (refer to section 7.2.7.2.). ZEISS encourages customers to keep a record on filament changes. This simplifies maintenance. ®...
  • Page 178 7. Maintenance and repair Change of Consumables and Chemicals Take a new filament out of the box using the filament tool. 10 Insert the new filament in the top section of the filament holder using the filament tool. 11 Insert the four grub screws. 12 To centre the filament, equally screw all grub screws with an Allen key SW 1.5.
  • Page 179 7. Maintenance and repair Change of Consumables and Chemicals 13 Attach the top section of the filament holder to the top section. Pay attention to correct alignment of pin and hole. 14 Insert the tensator spring (1) into the firing unit. 15 Insert the filament holder.
  • Page 180 7. Maintenance and repair Change of Consumables and Chemicals 17 Reinstall the brass retaining washer and fix it using the filament tool. Choose the amount of turns according to table 7.1. ® 180 of 246 Instruction Manual EVO en03...
  • Page 181 7. Maintenance and repair Change of Consumables and Chemicals 18 Check that the filament is centred and flush with the top of the firing unit using a stereo light microscope. If the filament is not centred, centre the filament by turning the grub screws.
  • Page 182 7. Maintenance and repair Change of Consumables and Chemicals 19 Align the slot at the side of the firing unit (1) with the pin inside the firing unit holder (2). 20 Carefully push in the firing unit. 21 Fix the screw with an Allen key SW 1.5. 22 Check the column O-ring (1).
  • Page 183 7. Maintenance and repair Change of Consumables and Chemicals 24 Close the gun. 25 Reinstall the top cover. 26 Switch on the SEM as described in section 6.1. ® 183 of 246 Instruction Manual EVO en03...

  • Page 184: Replacing Lab6 Filaments

    7. Maintenance and repair Change of Consumables and Chemicals 7.1.3.3. Replacing LaB6 filaments CAUTION Risk of contamination. Dust particles and skin grease can cause bad vacuum and flashovers. Always wear gloves when changing the filament. Parts/special tools required part no. One LaB6 filament 350010-2180-000 IMPORTANT...
  • Page 185 7. Maintenance and repair Change of Consumables and Chemicals Remove firing unit from SEM as described in section 7.1.3.1. Put the firing unit on a clean surface. Fit the filament tool into the slots in the brass retaining washer. To unscrew the brass retaining washer, care- fully turn the filament tool anticlockwise.
  • Page 186 7. Maintenance and repair Change of Consumables and Chemicals Put your hand closely underneath the firing unit and turn it upside down. The filament holder and the tensator spring wash- er will slide out and drop into your hand. Disassemble the filament holder: Unscrew the four screws with an Allen key SW 1.5.
  • Page 187 The LaB6 filament deposits sublimed material on the filament holder over time. These deposits have to be removed after every filament exchange. ZEISS encourages customers to keep a record on filament changes. This simplifies maintenance. Unpack the new LaB6 filament.
  • Page 188 7. Maintenance and repair Change of Consumables and Chemicals Use the filament tweezers to remove the new LaB6 filament from the holder. 10 Insert the new filament in the top section of the filament holder using the filament tool. 11 Insert the four grub screws. 12 To centre the filament, equally screw all grub screws with an Allen key SW 1.5.
  • Page 189 7. Maintenance and repair Change of Consumables and Chemicals 15 Insert the filament holder. Pay attention to cor- rect alignment of pin and slot. Align the slot at the side of the filament holder (2) with the pin inside the firing unit (3). 16 Put the new filament into the firing unit.
  • Page 190 7. Maintenance and repair Change of Consumables and Chemicals 18 The LaB6 filament needs to be set 0.2 mm be- low the Wehnelt cap. This is achieved by ad- justing the filament height level to the top of the Wehnelt aperture by turning the retaining brass washer slowly clockwise and checking both height and centring with a microscope or hand lens.
  • Page 191 7. Maintenance and repair Change of Consumables and Chemicals 21 Align the slot at the side of the firing unit (1) with the pin inside the firing unit holder (2). 22 Carefully push in the firing unit. 23 Fix the screw with an Allen key SW 1.5. 24 Check the column O-ring (1).
  • Page 192 7. Maintenance and repair Change of Consumables and Chemicals 26 Close the gun. 27 Reinstall the top cover. 28 Switch on the SEM as described in section 6.1. ® 192 of 246 Instruction Manual EVO en03...
  • Page 193 7. Maintenance and repair Change of Consumables and Chemicals 29 Select the Gun Vacuum tab. 30 Click Pump. 31 Wait until Vac Status = Ready and EHT Vac ready = Yes are indicated. This can take some time. ® 193 of 246 Instruction Manual EVO en03...
  • Page 194 7. Maintenance and repair Change of Consumables and Chemicals 32 Make sure the Long Fil. Life checkbox is unticked. 33 Switch on the beam. 34 Set the following values: - EHT = 10 kV - Spot Size = 500 - Fil I Target = 1950 mA 35 Tick the New Filament checkbox.
  • Page 195 7. Maintenance and repair Change of Consumables and Chemicals 36 Select the Apertures tab. 37 Click Emission. The Emission button changes to Normal. ® 195 of 246 Instruction Manual EVO en03...
  • Page 196 7. Maintenance and repair Change of Consumables and Chemicals IMPORTANT The filament runup will take a while for the first few times when a new filament is installed. This is quite normal and is designed to minimise damage due to thermal shock when the filament is new.
  • Page 197 7. Maintenance and repair Change of Consumables and Chemicals 39 Continue to increase Fil I Target until the sec- ond (and final) emission peak is visible. Adjust Brightness and contrast levels to aid visualisation. IMPORTANT To achieve optimum performance, the emission image must be aligned to the centre on the image area.

  • Page 198: Replacing Lab6 Filaments With Tungsten Filaments

    7. Maintenance and repair Change of Consumables and Chemicals 7.1.3.4. Replacing LaB6 filaments with tungsten filaments CAUTION Risk of contamination. Dust particles and skin grease can cause bad vacuum and flashovers. Always wear gloves when changing the filament. Parts/special tools required part no.
  • Page 199 7. Maintenance and repair Change of Consumables and Chemicals Shutdown Gun. Select the Gun Vacuum tab. Click Vent Gun. The Vent Gun dialogue is displayed. Click Yes and allow system to fully vent before carrying out further steps in the procedure. ®...
  • Page 200 7. Maintenance and repair Change of Consumables and Chemicals While the system is vented, select the filament type from drop down menu. Tick the New Filament checkbox. Switch off the SEM as described in section 6.11. ® 200 of 246 Instruction Manual EVO en03...
  • Page 201 7. Maintenance and repair Change of Consumables and Chemicals CAUTION Burning hazard The gun at the top of the EO column gets hot during operation. After switching off the SEM, wait for fifteen minutes before opening the top section of the EO column.
  • Page 202 7. Maintenance and repair Change of Consumables and Chemicals 10 Unscrew the firing unit with an Allen key SW 1.5 (3 screws). The screws should remain in their holes if possible. 11 Put the firing unit on a clean surface. 12 Fit the filament tool into the slots in the brass retaining washer.
  • Page 203 7. Maintenance and repair Change of Consumables and Chemicals 13 To unscrew the brass retaining washer, care- fully turn the filament tool anticlockwise. 14 Remove the brass retaining washer. 15 Put the brass retaining washer on a clean surface. 16 Put your hand closely underneath the firing unit and turn it upside down.
  • Page 204 The tungsten filament deposits tungsten on the filament holder over time. These deposits have to be removed after every filament exchange. This also applies to the anode (refer to section 7.2.7.2.). ZEISS encourages customers to keep a record on filament changes. This simplifies maintenance. ®...
  • Page 205 7. Maintenance and repair Change of Consumables and Chemicals 18 Take a new filament out of the box using the filament tool. 19 Insert the new filament in the top section of the filament holder using the filament tool. 20 Insert the four grub screws. 21 To centre the filament, equally screw all grub screws with an Allen key SW 1.5.
  • Page 206 7. Maintenance and repair Change of Consumables and Chemicals 22 Attach the top section of the filament holder to the top section. Pay attention to correct alignment of pin and hole. 23 Insert the tensator spring (1) into the firing unit. 24 Insert the filament holder.
  • Page 207 7. Maintenance and repair Change of Consumables and Chemicals 26 Reinstall the brass retaining washer and fix it using the filament tool. Choose the amount of turns according to table 7.1. ® 207 of 246 Instruction Manual EVO en03...
  • Page 208 7. Maintenance and repair Change of Consumables and Chemicals 27 Check that the filament is centred and flush with the top of the firing unit using a stereo light microscope. If the filament is not centred, Centre the filament by turning the grub screws.
  • Page 209 7. Maintenance and repair Change of Consumables and Chemicals 28 Align the slot at the side of the firing unit (1) with the pin inside the firing unit holder (2). 29 Carefully push in the firing unit. 30 Fix the screw with an Allen key SW 1.5. 31 Check the column O-ring (1).
  • Page 210 7. Maintenance and repair Change of Consumables and Chemicals 33 Close the gun. 34 Reinstall the top cover. 35 Switch on the SEM as described in section 6.1. ® 210 of 246 Instruction Manual EVO en03...
  • Page 211 7. Maintenance and repair Change of Consumables and Chemicals 36 Select the Gun Vacuum tab. 37 Click Pump. 38 Wait until Vac Status = Ready and EHT Vac ready = Yes are indicated. This can take some time. If the gun vacuum is lower than 1 x 10 mbar, perform the bakeout procedure as described in section 7.2.5.
  • Page 212 7. Maintenance and repair Change of Consumables and Chemicals 41 Set the following values: - EHT = 10 kV - Spot Size = 500 - Fil I Target = 2000 mA 42 Select the Apertures tab. 43 Click Emission. ® 212 of 246 Instruction Manual EVO en03...
  • Page 213 7. Maintenance and repair Change of Consumables and Chemicals The Emission button changes to Normal. IMPORTANT The filament runup will take a while for the first few times when a new filament is installed. ® 213 of 246 Instruction Manual EVO en03...
  • Page 214 7. Maintenance and repair Change of Consumables and Chemicals 44 Slowly increase Fil I Target by 0.01 A incre- ments by clicking the right hand arrow of the Fil I Target slider until the first emission peak is visible . Adjust Brightness and contrast levels to aid visualisation.

  • Page 215: Basic Preventive Maintenance Performed By The Operator

    All large specimens and large specimen holders are removed. Procedure: Select Stage/Stage initialise from the menu. Confirm by clicking on Yes. IMPORTANT If initialisation of the stage does not solve the stage problem, contact your local ZEISS service representative. ® 215 of 246 Instruction Manual EVO en03...

  • Page 216: Servicing The Pre-Vacuum Pump

    7. Maintenance and repair Basic preventive maintenance performed by the operator 7.2.4. Servicing the pre-vacuum pump For maintenance of the pre-vacuum pump refer to the instruction manual of the pump provided by the pump manufacturer. You will find this documentation in the SEM document folder. 7.2.5.

  • Page 217: O-Ring Maintenance

    7. Maintenance and repair Basic preventive maintenance performed by the operator 7.2.6. O-ring maintenance O-rings are necessary to keep up the vacuum and protect the column and the chamber from dust particles and grease. The column and chamber door O-rings have to be checked and cleaned regularly.

  • Page 218: Checking The Chamber Door O-Ring

    7. Maintenance and repair Basic preventive maintenance performed by the operator 7.2.6.2. Checking the chamber door O-ring CAUTION Suffocation hazard due to lack of oxygen, since the specimen chamber is vented with nitrogen. Avoid inhaling the air from within the specimen chamber. Ensure the area around the SEM is sufficiently ventilated.
  • Page 219 7. Maintenance and repair Basic preventive maintenance performed by the operator Check visually if there are any dust particles or grease on the O-ring (1). Use a can of compressed air to remove any dust particles or grease. If any dust particles or grease remain, use a lens tissue to remove the dust particles or grease.

  • Page 220: Cleaning The Firing Unit

    7. Maintenance and repair Basic preventive maintenance performed by the operator 7.2.7. Cleaning the firing unit CAUTION Risk of damaging the aperture. The filament deposits material on the firing unit and the anode over time. This can damage the aperture and reduce the filament life time. Clean the firing unit after every filament change.
  • Page 221 7. Maintenance and repair Basic preventive maintenance performed by the operator Wrap a piece of cotton around the tip of a toothpick. To remove any deposits, polish the inside of the firing unit. Use the toothpick to clean the aperture of the firing unit.
  • Page 222 7. Maintenance and repair Basic preventive maintenance performed by the operator CAUTION Risk of property damage. Residual polishing compound can cause flashovers and bad vacuum. To remove residual polishing compound, grease and other hydro carbon contaminates it is essential to clean all the firing unit parts using a weak solvent such as isopropanol (propan–2–ol CAS No–67–63–5).

  • Page 223: Cleaning The Filament Holder

    7. Maintenance and repair Basic preventive maintenance performed by the operator 7.2.7.1. Cleaning the filament holder Disassemble the filament holder as described in section 7.1.3.2. Place the disassembled filament holder parts (including all grub screws) and all screws in a suitable metal mesh tray.

  • Page 224: Cleaning The Anode

    7. Maintenance and repair Basic preventive maintenance performed by the operator 7.2.7.2. Cleaning the Anode For optimum performance this procedure should be carried out each time a filament is changed. To reduce instrument down time it is recommended that a clean spare anode is purchased so that the dirty anode can be cleaned off line.
  • Page 225 7. Maintenance and repair Basic preventive maintenance performed by the operator Place a small amount of polish on a clean piece of paper and polish as shown. To clean the anode aperture use a cocktail stick with the polish ensuring both sides of the aperture are cleaned.
  • Page 226 7. Maintenance and repair Basic preventive maintenance performed by the operator IMPORTANT Contamination caused by fingerprints can lead to vacuum deterioration or prolonged pumping times. Always wear lint-free gloves when touching the cleaned anode and retaining screws. Remove all parts from the cleaning solvent and allow to dry. It is essential that the anode and retaining screws are handled using clean lint free gloves from this point of the procedure.

  • Page 227: Preventive Maintenance Performed By A Zeiss Service Representative

    7.3. Preventive maintenance performed by a ZEISS service representative Preventive maintenance is a scheduled downtime essential to achieve the maximum equipment performance level (i.e. 24 h of permanent operation). The annual preventive maintenance is performed by the local ZEISS service representative. It includes • Inspection •...

  • Page 228: Repair

    The repair tasks described in the following section can be performed by the operator. IMPORTANT All pursuing tasks of repair not described in this instruction manual have to be performed by authorised ZEISS service representatives only. 7.4.1. Replacing the chamber door O-ring Possible reasons: •...
  • Page 229 7. Maintenance and repair Repair CAUTION Danger of damaging the sealing surface when using metallic tools. If required, use a plastic or wooden tool to remove the chamber door O-ring. Clean the O-ring as described in section 7.2.6.2. If this does not resolve the problem: Remove the chamber door O-ring (1).

  • Page 230: Checking The Circuit Breakers

    PC, WDX, EDX, AUX 1 -4 If one of the circuit breakers is tripped, push upwards. If this does not solve the problem, contact your local ZEISS service representative for assistance. IMPORTANT Tripped circuit breakers may be a hint for an electrical problem in the SEM.

  • Page 231: Troubleshooting

    ZEISS service representative. DANGER Danger to life: Hazardous voltage inside the SEM. Only service engineers trained and authorised by ZEISS are allowed to service the SEM and to perform work on the electrical system of the SEM. Keyword...
  • Page 232 Reduce working distance to a (e.g.1 kV) maximum of 7 mm. SE2 image SE2 image is noisy Scintillator is used up. Call your local ZEISS service engineer to have the scintillator replaced. After emer- Stored stage position cannot be Stage needs to be initialised.

  • Page 233: Shutdown And Disposal

    If the SEM will not be used for an extended period of time e.g. several months, it should be put out of operation. Contact your local ZEISS service representative to have the SEM put out of operation. 9.2. Disposal 9.2.1. Disposing of solid waste (consumables) The operator must ensure that solid waste (consumables) are disposed of and recycled in a responsible manner.

  • Page 234: Disposing Of The Sem

    9. Shutdown and disposal Disposal 9.2.2. Disposing of the SEM The operator must ensure that waste products are disposed of and recycled in a responsible manner. Refer to EC directive 2002/96/EC on waste electrical and electronic equipment (WEEE). The SEM consists of several modules. Be careful to separate the materials properly when you dispose of the SEM.

  • Page 235: Parts And Tools

    Use genuine ZEISS parts only. Order parts and tools at your local ZEISS service organization. For customer service please contact your local ZEISS service representative. A list of ZEISS locations and authorised service partners can be found at: www.zeiss.de/microscopy 10.1. Important consumables Item Part no.

  • Page 236: Important Spare Parts

    10. Parts and tools Important spare parts 10.2. Important spare parts Item Part no. Chamber door o-ring 476-960 10.3. Optional software licences Item Part no. FISHEYE mode 348224-6080-000 10.4. Tools and accessories Item Part no. Faraday cup 348342-8055-000 1.5 mm Allen wrench 151-883 Small pliers specimen holders...

  • Page 237: Abbreviations

    11. Abbreviations 11. Abbreviations Ampere interrupting capacity Backscattered electron Charge coupled device Differential Pumping Aperture European community Extra High Tension EIGA European Industrial Gases Association Electromagnetic compatibility Emergency off Graphical User Interface Height ETSE Everhart Thornley Secondary Electron Detector Ion Getter Pump M-axis MSDS Material Safety Data Sheet...
  • Page 238 11. Abbreviations X-axis Y-axis Z-axis Z-Tilt-Rotate ® 238 of 246 Instruction Manual EVO en03...

  • Page 239: Glossary

    12. Glossary 12. Glossary Aperture Small opening in the beam path that forms and limits the electron or ion beam. Astigmatism Lens aberration that distorts the shape of the electron beam, compen- sated by the stigmator. Backscattered Electrons High energy electrons that are liberated from the specimen surface when the specimen is hit by the primary electron beam.
  • Page 240 12. Glossary X-ray Type of ionising radiation that is generated during the operation of elec- tron microscopes ® 240 of 246 Instruction Manual EVO en03...

  • Page 241: Declaration Of Conformity

    13. Declaration of conformity 13. Declaration of conformity Denomination: Scanning electron microscope (SEM) ® Model: ZEISS Ltd. 511 Coldhams Lane Manufacturer Cambridge CB1 3JS This is to declare that the machinery mentioned above fulfils all the relevant provisions of the •...
  • Page 242 13. Declaration of conformity ® 242 of 246 Instruction Manual EVO en03...

  • Page 243: Index

    14. Index 14. Index Fuses 230 Abbreviations 237 Acceleration voltage 39 Administrator 13 Gas ballast 231 Analysis mode 41 Gun vacuum 31 Anode 39 Apertures 39 Auomated image acquisition 99 Help 146 Auto aperture alignment 93 High leakage current 16 Auto gun alignment 92 Auto saturation 91 Automated functions 91...
  • Page 244 14. Index Safety instruction 10 Safety labels 21, 215 Sample type selection 96 Scintillator 160, 239 Seismic protection 21 Service 14 Shutdown 233 SmartSEM® 12 Software 27 Software Manual 9 Solid waste 233 Spare parts 236 Specimen chamber 25 Specimen stage 38 Stage bias low voltage 127 Stage biasing 124 Start-up 65...
  • Page 245 14. Index ® 245 of 246 Instruction Manual EVO en03...
  • Page 246 CB1 3JS microscopy@zeiss.com Carl Zeiss Microscopy, LLC One Zeiss Drive Thornwood, NY 10594 microscopy@zeiss.com Plus a worldwide network of distributors www.zeiss.com/microscopy Due to a policy of continuousdevelopment, we reserve the right to change specifications without notice. © Carl Zeiss Microscopy Ltd.

Table of Contents