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Quectel KG200Z Hardware Design

Quectel KG200Z Hardware Design

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KG200Z
Hardware Design
LoRa Module Series
Version: 1.0.0
Date: 2023-12-05
Status: Preliminary

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Summary of Contents for Quectel KG200Z

  • Page 1 KG200Z Hardware Design LoRa Module Series Version: 1.0.0 Date: 2023-12-05 Status: Preliminary...

  • Page 2: Legal Notices

    LoRa Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,...

  • Page 3: Third-Party Rights

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the terminal should notify users and operating personnel of the following safety precautions by incorporating them into all product manuals. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    LoRa Module Series About the Document Revision History Version Date Author Description 2023-12-05 Paul YU/ Quentin QIU Creation of the document 1.0.0 2023-12-05 Paul YU/Quentin QIU Preliminary KG200Z_Hardware_Design 4 / 50...

  • Page 6: Table Of Contents

    LoRa Module Series Contents Safety Information ............................3 About the Document ..........................4 Contents ..............................5 Table Index ..............................7 Figure Index ..............................8 1 Introduction ............................. 9 1.1. Special Marks..........................9 2 Product Overview ..........................10 2.1. Key Features ..........................11 3 Application Interfaces ..........................
  • Page 7 LoRa Module Series 6.3. LoRa Power Consumption ......................36 6.4. Digital I/O Characteristics ......................36 6.5. ESD Protection ..........................36 7 Mechanical Information ........................37 7.1. Mechanical Dimensions ....................... 37 7.2. Recommended Footprint ......................39 7.3. Top and Bottom Views ......................... 40 8 Storage, Manufacturing &...
  • Page 8 LoRa Module Series Table Index Table 1 : Special Marks ..........................9 Table 2 : Basic Information ........................10 Table 3 : Key Features ..........................11 Table 4 : Parameter Description ........................ 13 Table 5 : Pin Description ..........................13 Table 6 : GPIO Multiplexing ........................
  • Page 9 LoRa Module Series Figure Index Figure 2 : Pin Assignment (Top View) ....................... 12 Figure 3 : USART Connection ........................20 Figure 4 : Reference Design of USART Interfaces ..................21 Figure 5 : LPUART Connection ........................22 Figure 6 : SPI Connection (Master Mode) ....................23 Figure 7 : SPI Connection (Slave Mode) ....................

  • Page 10: Introduction

     Enhance product competitiveness and price-performance ratio ® This document defines KG200Z in QuecOpen solution and describes its air interfaces and hardware interfaces, which are connected with your applications. With this document, you can quickly understand module interface specifications, RF performance, electrical and mechanical details, as well as other related information of the module.

  • Page 11: Product Overview

    RF transceiver switch. The module provides multiple interfaces including UART, SPI*, I2C* and SWD for various applications. KG200Z is an SMD module with compact packaging. The general features of the module are as follow:  48 MHz and 32-bit MCU processor ...

  • Page 12: Key Features

    1.8–3.6 V  Typ.: 3.3 V Operating temperature : -40 to +85 °C Temperature Ranges Storage temperature: -45 to +95 °C TE-B Kit KG200Z-TE-B Antenna Interface  Pin antenna interface (ANT_LORA) Antenna Interface  50 Ω characteristic impedance Application Interfaces...

  • Page 13: Application Interfaces

    LoRa Module Series Application Interfaces 3.1. Pin Assignment Figure 1: Pin Assignment (Top View) KG200Z_Hardware_Design 12 / 50...

  • Page 14: Pin Description

    LoRa Module Series NOTE Keep all RESERVED and unused pins unconnected. All GND pins should be connected to ground. The module has 37 GPIO interfaces by default. In the case of multiplexing, it supports interfaces including UART, SPI*, I2C*, SWD. For more details, see Chapter 3.3 and Chapter 3.4. 3.2.
  • Page 15 LoRa Module Series External analog Vmin = 1.8V VDDA power supply for Vnom = 3.3 V A/D converters Vmax = 3.6 V Vmin = 1.45 V DC-DC switching VFBSMPS Vnom =1.55V power feedback Vmax = 1.62 V Vmin = 1.8 V DC-DC switching VDDSMPS Vnom = 3.3 V...
  • Page 16 LoRa Module Series input/output General-purpose GPIO17 input/output General-purpose GPIO18 input/output General-purpose GPIO19 input/output General-purpose GPIO33 input/output General-purpose GPIO21 input/output General-purpose GPIO32 input/output General-purpose GPIO22 input/output General-purpose GPIO20 input/output General-purpose GPIO31 input/output General-purpose GPIO30 input/output General-purpose GPIO35 input/output General-purpose GPIO34 input/output General-purpose GPIO36 input/output...
  • Page 17 LoRa Module Series General-purpose GPIO8 input/output General-purpose GPIO6 input/output General-purpose GPIO9 input/output General-purpose GPIO26 input/output General-purpose GPIO15 input/output General-purpose GPIO27 input/output General-purpose GPIO16 input/output General-purpose GPIO10 input/output General-purpose GPIO1 input/output General-purpose GPIO0 input/output General-purpose GPIO12 input/output General-purpose GPIO11 input/output Antenna Interface Pin Name Description Comment...

  • Page 18: Gpio Multiplexing

    LoRa Module Series 3.3. GPIO Multiplexing The module has 37 GPIO interfaces by default. In the case of multiplexing, it supports interfaces including UART, SPI*, I2C*, SWD. Pins are defined as follows: Table 6: GPIO Multiplexing Alternate Pin Name Pin No. Function 0 Alternate Function 1 Alternate Function 2...
  • Page 19 LoRa Module Series GPIO9 USART1_TXD I2C1_SCL SPI2_CS GPIO10 PA10 USART1_RXD I2C1_SDA SPI2_MOSI GPIO11 PA12 USART1_RTS I2C2_SCL SPI1_MOSI GPIO12 PA13 SWDIO I2C2_SMBA GPIO13 PA14 SWCLK I2C1_SMBA GPIO14 PA15 I2C2_SDA SPI1_CS GPIO15 GPIO16 I2C3_SMBA SPI1_CS GPIO17 USART1_RTS SPI1_CLK GPIO18 USART1_CTS I2C3_SDA SPI1_MISO GPIO19 I2C1_SMBA SPI1_MOSI...
  • Page 20 LoRa Module Series GPIO25 PB11 LPUART_TXD I2C3_SDA GPIO26 PB12 LPUART_RTS I2C3_SMBA SPI2_CS GPIO27 PB13 LPUART_CTS I2C3_SCL SPI2_CLK GPIO28 PB14 I2C3_SDA SPI2_MISO GPIO29 PB15 I2C2_SCL SPI2_MOSI GPIO30 LPUART_RXD I2C3_SCL GPIO31 LPUART_TXD I2C3_SDA GPIO32 SPI2_MISO GPIO33 SPI2_MOSI GPIO34 GPIO35 GPIO36 KG200Z_Hardware_Design 19 / 50...

  • Page 21: Interface Definition

    LoRa Module Series 3.4. Interface Definition 3.4.1. UART In the case of multiplexing, the module supports two USARTs (USART1 and USART2) and one LPUART. 3.4.1.1. USART Table 7: Pin Definition of USART Interfaces Pin Name Pin No. Alternate Function Description Comment GPIO2 USART2_TXD...

  • Page 22: Lpuart

    The reference design of USART interfaces is shown below : Figure 3: Reference Design of USART Interfaces 3.4.1.2. LPUART KG200Z has one low-power UART (LPUART) that enables asynchronous serial communication with minimum power consumption. The LPUART supports half-duplex single-wire communication and modem operations (CTS/RTS), allowing multiprocessor communication.

  • Page 23: Spi

    LoRa Module Series Figure 4: LPUART Connection 3.4.2. SPI* In the case of multiplexing, the module supports two SPIs (SPI1 and SPI2) which can operate in master or slave mode. The maximum clock frequency of the interface can reach 24 MHz.

  • Page 24: I2C Interface

    LoRa Module Series Figure 5: SPI Connection (Master Mode) Figure 6: SPI Connection (Slave Mode) 3.4.3. I2C Interface* In the case of multiplexing, the module supports three I2C interfaces (I2C1, I2C2, and I2C3) which can operate in master or slave mode, supporting SMBus/PMBus and I2C bus specifications. Table 10: Pin Definition of I2C Interface Pin name Pin No.

  • Page 25: Swd Interface

    LoRa Module Series GPIO30 I2C3_SCL I2C3 serial clock GPIO31 I2C3_SDA I2C3 serial data 3.4.4. SWD Interface In the case of multiplexing, the module supports one SWD interface for module debugging and testing. SWD serves as a serial download and debugging port, and only two pins need to be connected to the serial debugger during debugging.

  • Page 26: Operating Characteristics

    LoRa Module Series Operating Characteristics 4.1. Power Supply Power supply pin and ground pins of the module are defined in the following table. Table 12: Pin Definition of Power Supply and GND Pins (Unit: V) Pin Name Pin No. Description Min.

  • Page 27: Turn On

    LoRa Module Series improve the surge voltage bearing capacity of the module. In principle, the longer the VBAT trace is, the wider it should be. VBAT reference circuit is shown below: Figure 7: VBAT Reference Circuit 4.2. Turn On After the module is powered on, it can be automatically powered on. 4.3.
  • Page 28 LoRa Module Series restart due to abnormal interference, it is recommended to route the trace as short as possible and surround it with ground. Table 13: Pin Definition of RESET_N Pin Name Pin No. Description Comment Hardware reset; RESET_N Reset the module Internally pulled up to 3.3 V;...
  • Page 29 LoRa Module Series The module reset timing is illustrated in the following figure. Figure 10: Reset Timing KG200Z_Hardware_Design 28 / 50...

  • Page 30: Rf Performances

    LoRa Module Series RF Performances 5.1. LoRa Performances Table 14: LoRa Performances Operating Frequency 902–928 MHz Modulation LORA,DTS,FHSS, FSK Encryption Mode AES, RNG, PCROP, RDP, WRP, CRC, PKA Operating Mode  Class A  Class B  Class C Transmission Data Rate ...

  • Page 31: Antenna/Antenna Interfaces

    LoRa Module Series BR@ 250 kbps 5.2. Antenna/Antenna Interfaces Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

  • Page 32: Antenna Design Requirements

    LoRa Module Series 5.2.1.2. Antenna Design Requirements Table 16: Antenna Design Requirements Parameter Requirement Frequency Range (MHz) 863–928 MHz Cable Insertion Loss (dB) < 1 VSWR ≤ 2 Gain (dBi) 2.5 (Typ.) Max. input power (W) Input impedance (Ω) Polarization type Vertical 5.2.1.3.
  • Page 33 LoRa Module Series Figure 13: Coplanar Waveguide Design on a 2-layer PCB Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ...

  • Page 34: Rf Connector Recommendation

    LoRa Module Series around RF traces and the reference ground could help to improve RF performance. The distance between the ground vias and RF traces should be at least twice the width of RF signal traces (2 ×  Keep RF traces away from interference sources, and avoid intersection and paralleling between traces on adjacent layers.
  • Page 35 LoRa Module Series Figure 17: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 18: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. KG200Z_Hardware_Design 34 / 56...

  • Page 36: Electrical Characteristics & Reliability

    LoRa Module Series Electrical Characteristics & Reliability 6.1. Absolute Maximum Ratings Table 17: Absolute Maximum Ratings (Unit: V) Parameter Min. Max. VBAT -0.3 VDD_IO -0.3 6.2. Power Supply Ratings Table 18: Module Power Supply Ratings (Unit: V) Parameter Description Condition Min.

  • Page 37: Lora Power Consumption

    LoRa Module Series 6.3. LoRa Power Consumption Table 19: LoRa Power Consumption (Typ.; Unit: mA) Condition Tx @ 20 dBm 6.4. Digital I/O Characteristics Table 20: VDD_IO I/O Requirements (Unit: V) Parameter Description Min. Max. High-level input voltage 0.7 × VDD_IO VDD_IO + 0.3 Low-level input voltage -0.3...

  • Page 38: Mechanical Information

    LoRa Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeters (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 19: Top and Side Dimensions KG200Z_Hardware_Design 37 / 56...
  • Page 39 LoRa Module Series Figure 20: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module refers to the JEITA ED-7306 standard. KG200Z_Hardware_Design 38 / 56...

  • Page 40: Recommended Footprint

    LoRa Module Series 7.2. Recommended Footprint Figure 21: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. KG200Z_Hardware_Design 39 / 56...

  • Page 41: Top And Bottom Views

    7.3. Top and Bottom Views Figure 22: Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. KG200Z_Hardware_Design 40 / 56...

  • Page 42: Storage, Manufacturing & Packaging

    LoRa Module Series Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

  • Page 43: Manufacturing And Soldering

    LoRa Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
  • Page 44 RoHS compliant and their mercury content is below 1000 ppm (0.1 %). Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

  • Page 45: Packaging Specification

    LoRa Module Series 8.3. Packaging Specification This chapter outlines the key packaging parameters and processes. All figures below are for reference purposes only, as the actual appearance and structure of packaging materials may vary in delivery. The modules are packed in a tape and reel packaging as specified in the sub-chapters below. 8.3.1.

  • Page 46: Plastic Reel

    LoRa Module Series 8.3.2. Plastic Reel Plastic reel dimensions are illustrated in the following figure and table: Figure 25: Plastic Reel Dimension Drawing Table 24: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 24.5 8.3.3. Mounting Direction Figure 26: Mounting Direction KG200Z_Hardware_Design 45 / 56...

  • Page 47: Packaging Process

    LoRa Module Series 8.3.4. Packaging Process Place the modules onto the carrier tape cavity and cover them securely with cover tape. Wind the heat-sealed carrier tape onto a plastic reel and apply a protective tape for additional protection. 1 plastic reel can pack 500 modules.

  • Page 48: Appendix References

    LoRa Module Series Appendix References Table 25: Reference Documents Document Name [1] Quectel_KG200Z_TE-B_User_Guide [2] Quectel_RF_Layout_Application_Note [3] Quectel_Module_SMT_Application_Note Table 26: Terms and Abbreviations Abbreviation Description Analog-to-Digital Converter Advanced Encryption Standard BPSK Binary Phase Shift Keying Basic Rate Band Width Charged Device Model Cyclic Redundancy Check Clear To Send Digital-to-Analog Converter...
  • Page 49 LoRa Module Series GFSK Gauss Frequency Shift Keying GMSK Gaussian Minimum Shift Keying Ground Human Body Model Input/Output Inter-Integrated Circuit kbps Kilobits Per Second Low-dropout Regulator Land Grid Array LoRa Long Range LPUART Low Power Universal Asynchronous Receiver/Transmitter Mbps Megabits per second Microcontroller Unit Minimum Shift Keying Moisture Sensitivity Level...
  • Page 50 LoRa Module Series Receive Data Spreading Factor SMBus System Management Bus Surface Mounted Devices SMPS Switched-Mode Power Supply Surface Mount Technology SPDT Single-Pole Double-Throw Serial Peripheral Interface Serial Wire Debug TCXO Temperature Compensate X’tal (crystal) Oscillator Transient Voltage Suppressor Transmit UART Universal Asynchronous Receiver/Transmitter USART...
  • Page 51 Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (XMR2024KG200Z) procedure followed by a Class II permissive change application.
  • Page 52 LoRa Module Series (dBi) (dBi) (dBi) Dipole 0.95 1.88 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product.
  • Page 53 LoRa Module Series any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
  • Page 54 LoRa Module Series Industry Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.
  • Page 55 LoRa Module Series 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité...

  • Page 56: Trace Design

    LoRa Module Series la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel. Label FCC ID: XMR2024KG200Z IC : 10224A-2024KG200Z...
  • Page 57 LoRa Module Series Dielectric constant, and Impedance KG200Z_Hardware_Design 56 / 56...

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