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4.1
Headers Description and Jumper Placement
4.2
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POWER-UP PROCEDURE
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1
Placement (Top Layer)
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Board Layout (Top Layer)
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Board Layout (Second Layer - Ground Plane)
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Board Layout (Third Layer - V
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Board Layout (Bottom Layer - Ground Plane)
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Headers Description and Jumper Placement
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SLVU770 - August 2012
Submit Documentation Feedback
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List of Figures
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and Signal Routing)
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Copyright © 2012, Texas Instruments Incorporated
TPS65281EVM User's Guide
Contents
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User's Guide
SLVU770 - August 2012
TPS65281EVM User's Guide
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Summary of Contents for Texas Instruments TPS65281EVM

  • Page 1: Table Of Contents

    Board Layout (Third Layer – V and Signal Routing) ................Board Layout (Bottom Layer – Ground Plane) ................Headers Description and Jumper Placement ....................TPS65281EVM Schematic SLVU770 – August 2012 TPS65281EVM User’s Guide Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated...
  • Page 2: Introduction

    Please contact TI Field Applications Group for advice on these matters. TPS65281EVM User’s Guide SLVU770 – August 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated...
  • Page 3: Board Layout

    BOARD LAYOUT www.ti.com BOARD LAYOUT Figure 1. Placement (Top Layer) SLVU770 – August 2012 TPS65281EVM User’s Guide Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated...
  • Page 4 BOARD LAYOUT www.ti.com Figure 2. Board Layout (Top Layer) Figure 3. Board Layout (Second Layer – Ground Plane) TPS65281EVM User’s Guide SLVU770 – August 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated...
  • Page 5 BOARD LAYOUT www.ti.com Figure 4. Board Layout (Third Layer – V and Signal Routing) Figure 5. Board Layout (Bottom Layer – Ground Plane) SLVU770 – August 2012 TPS65281EVM User’s Guide Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated...
  • Page 6: Bench Test Setup Conditions

    Headers Description and Jumper Placement Figure 6. Headers Description and Jumper Placement Test points: (A) LX of V (B) V OUT_BUCK (C) V SW_OUT TPS65281EVM User’s Guide SLVU770 – August 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated...
  • Page 7: Jumpers And Switches

    1. Apply 12 V to J1. 2. Toggle JP7 to enable V OUT1 3. Toggle JP5 to enable power switch. 4. Apply load to the connectors, J3 or J5. SLVU770 – August 2012 TPS65281EVM User’s Guide Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated...
  • Page 8: Schematic And Bill Of Materials

    SCHEMATIC AND BILL OF MATERIALS www.ti.com SCHEMATIC AND BILL OF MATERIALS Figure 7. TPS65281EVM Schematic TPS65281EVM User’s Guide SLVU770 – August 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated...
  • Page 9 SCHEMATIC AND BILL OF MATERIALS www.ti.com Table 4. TPS65281EVM Bill of Materials Item No. Designator Value Footprint Manufacturer Part No. Description Comment 100pF 0603 Do Not Install C2, C6 4.7nF 0603 Generic CAP 4700PF 50V CERAMIC X7R 0603 22nF 0603...
  • Page 10: Regulatory Compliance Information

    Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.
  • Page 11 FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
  • Page 12 Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp...
  • Page 13 FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated...
  • Page 14 Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.
  • Page 15 FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
  • Page 16 Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp...
  • Page 17 FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated...
  • Page 18: Important Notice

    IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.