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the heater and begin the reflow cycle. Heating time should not be less
than two minutes.
Once the RF PA reflows, raise the heat-focus head and wait
approximately two minute for the part to cool. Remove the circuit
board and inspect the solder joint between the slab and the ground
plane. No cleaning should be necessary. Use the soldering iron and add
solder to each of the RF PA leads and associated pads. Inspect the lead/
pad bond for opens and solder shorts.
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This manual also for:

Jt-1000, Mt-2000, Mts-2000

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