Area On The System Board Where Thermal Interface Materials Are Applied - Lenovo LOQ 15AHP9 Hardware Maintenance Manual

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For LOQ 15IAX9 and LOQ 15IRX9:
Area
Type
a
7958-SP
b
7958-SP
For LOQ 15IAX9I:
Area
Type
a
7958-SP
b
7958-SP
Figure 3. Areas on the thermal module where thermal interface materials should be applied
Note: The thermal module may differ from the looks of Intel and AMD modules. Illustrations are for reference
only.

Area on the system board where thermal interface materials are applied

The following figure shows the area on the system board where thermal interface materials are applied.
Weight
Size
15.98 mm × 15.72 mm × 0.25 mm
0.51 g (a+b)
24.89 mm × 12.28 mm × 0.25 mm
Weight
Size
26.44 mm × 12.22 mm × 0.25 mm
0.45 g (a+b)
21.89 mm × 11.7 mm × 0.25 mm
.
Chapter 4
Removing a FRU or CRU
29

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