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Revision History Version Revision History Date R1.0 First release 2022-05-19 Table 2-1: Update the description of V_BCKP pin; Chapter 3.3: Add requirement of V_BCKP; Chapter 1.3: Add the description of external interfaces; Add chapter 3.1: Recommended Minimal Design; R1.1 Table 2-4: Update the IO threshold; 2022-09-09 3.2 Antenna Feed Design: D1 and D4 should support high frequency signals (above 2000 MHz);...
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Information, such as product specifications, descriptions, features and user guide in this manual, are subject to change by Unicore at any time without prior notice, which may not be completely consistent with such information of the specific product you purchase.
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Foreword This document describes the information of the hardware, package, specification and the use of Unicore UM982 module. Target Readers This document applies to technicians who possess the expertise on GNSS receivers.
L1/L2/L5. The module is mainly used in UAVs, lawn mowers, precision agriculture, and intelligent driving. With the support of on-chip RTK positioning and dual-antenna heading solution, UM982 can be used as a rover or base station. UM982 is based on NebulasⅣ...
UM982 User Manual 1.1 Key Features 16 mm 21 mm mm, surface-mount device × × Supports all-constellation multi-frequency on-chip RTK positioning and dual- antenna heading solution Supports BDS B1I/B2I/B3I + GPS L1/L2/L5 + GLONASS G1/G2 + Galileo...
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Power Consumption 600 mW Performance Single Point Horizontal: 1.5 m Positioning Vertical: 2.5 m (RMS) Horizontal: 0.4 m + 1ppm Positioning Accuracy DGPS (RMS) Vertical: 0.8 m + 1ppm Horizontal: 0.8 cm + 1 ppm 3, 4 RTK (RMS) Vertical: 1.5 cm + 1 ppm Observation Accuracy (RMS) GLONASS Galileo...
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UM982 User Manual Initialization Time < 5 s (Typical) Initialization Reliability > 99.9% 20 Hz Positioning & Heading Data Update Rate 20 Hz Raw Data observation Differential Data RTCM 3.X Data Format NMEA-0183, Unicore Physical Characteristics Package 48 pin LGA Dimensions 21 mm ×...
It integrates a dual-core CPU, a high speed floating point processor and an RTK co-processor, which can fulfill the high precision baseband processing and RTK positioning/heading independently. External Interfaces The external interfaces of UM982 include UART, I , SPI , CAN , PPS, EVENT, RTK_STAT, PVT_STAT, ERR_STAT, RESET_N, etc.
UM982 User Manual 2 Hardware 2.1 Pin Definition TXD2 Top View RXD2 TXD1 RXD1 RTK_STAT PVT_STAT ERR_STAT Figure 2-1 UM982 Pin Definition Table 2-1 Pin Description Description — Ground ANT1_IN GNSS master antenna signal input — Ground — Ground When the main power supply VCC is cut off, V_BCKP supplies power to RTC and relevant register.
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Description ground or leave it floating. SPIS_CSN Chip select pin for SPI slave Master Out / Slave In. This pin is used to receive SPIS_MOSI data in slave mode. SPIS_CLK Clock input pin for SPI slave Master In / Slave Out. This pin is used to transmit SPIS_MISO data in slave mode.
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UM982 User Manual Description POWER Power supply (+3.3 V) Built-in function; recommended to add a through- hole testing point and a 10 kΩ pull-up resistor; — cannot connect ground or power supply, cannot input/output data, and cannot be floating Built-in function; recommended to add a through- hole testing point and a 10 kΩ...
UM982 User Manual 2.2.2 Operating Conditions Table 2-3 Operating Conditions Parameter Symbol Min. Typ. Max. Unit Condition Power Supply Voltage Maximum VCC Ripple Working Current VCC=3.3 V Operating Temperature ° C Power Consumption 2.2.3 IO Threshold Table 2-4 IO Threshold...
3.3 Power-on and Power-off The VCC initial level when power-on should be less than 0.4 V. The VCC ramp when power-on should be monotonic, without plateaus. The voltages of undershoot and ringing should be within 5% VCC. VCC power-on waveform: The time interval from 10% rising to 90% must be within ...
UM982 User Manual The 35 pads in the rectangle in Figure 3-3 are for grounding and heat dissipation. In the PCB design, the pads should be connected to a large sized ground to strengthen the heat dissipation. 3.5 Recommended PCB Package Design See the following figure for the recommended PCB package design.
4 Production Requirement Recommended soldering temperature curve is as follows: Rising Preheating Reflux Cooling ° C Peak 245 ° C 40~60s 60~120s Max. 4° C/s Max. 3° C/s Time (s) Figure 4-1 Soldering Temperature (Lead-free) Temperature Rising Stage Rising slope: Max. 3 ° C/s ...
Figure 5-1 Label Description 5.2 Product Packaging The UM982 module uses carrier tape and reel (suitable for mainstream surface mount devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant inside to prevent moisture. When using reflow soldering process to solder modules, please strictly comply with IPC standard to conduct temperature and humidity control.
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Figure 5-4 Normal Humidity Indication Figure 5-5 Abnormal Humidity Indication The UM982 is rated at MSL level 3. Please refer to the IPC/JEDEC J-STD-033 standards for the package and operation requirements. You may access to the website www.jedec.org to get more information.
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