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Chengdu Ebyte Electronic Technology Co., Ltd.
E220-900T30D User Manual
11. Soldering Operation Guidance
11.1 Reflow Soldering Temperature
Table 11-1 Register description
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
(Tsmin)
100°C
150°C
Preheat temperature max (Tsmax)
150°C
200°C
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3°C/second max
3°C/second max
Liquidous Temperature (TL)
183°C
217°C
Time (tL) Maintained Above
(TL)
60-90 sec
30-90 sec
Peak temperature
(Tp)
220-235°C
230-250°C
Aveage ramp-down rate
(Tp to Tsmax)
6°C/second max
6°C/second max
Time 25°C to peak temperature
6 minutes
max
8 minutes
max
11.2 Reflow Soldering Curve
Te
EE
EE
TE
ES
Critical Zone
Tito Te
FO
Q
TSmax
= SE
|
©
|
4
TSmin
€
-w
fi
is
Preheat
25
€
t 25°C to Peak
Time
—>
Copyright ©2012-2020, Chengdu Ebyte Electronic Technology Co.,Ltd.
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