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LE
Chengdu Ebyte Electronic Technology Co., Ltd
EO01C-MLOLS User Manual
7.1 Reflow soldering temperature
Lo.
Sn-Pb
Profile Feature
Curve characteristics
Pb-Free Assembly
Assembly
Solder Paste
Solder paste
Sn63/Pb37
S1n96.5/Ag3/Cu0.5
Preheat Temperature min
(Tsmin)
Min preheating temp.
100°C
150°C
Preheat temperature max (Tsmax)
Mx preheating temp.
150°C
200°C
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3°C/second max
3°C/second max
Liquidous Temperature (TL)
Liquid phase temp.
183°C
217°C
Time
(tL)
Maintained Above
(TL)
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature
(Tp)
Peak temp.
220-235°C
230-250°C
Aveage ramp-down rate (Tp to Tsmax)
Average ramp-down rate
6°C/second max
6°C/second max
Time 25°C to peak temperature
Time to peak temperature for
25°C
6 minutes max
8 minutes max
7.2 Reflow soldering curve
Te
RE
hhh
5s;
Critical Zone
TLto Te
|
o
TSmax
I I
|
©
a
g
L
3
BY
ee xeapuii tans
Preheat
25
t 257C to Peak
Time
=>
8 Packing method for bulk order
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