Dell VERLAND TANDBERG Titan T2000 Owner's Manual page 39

Table 21. Troubleshooting 2U alarm conditions (continued)
Status
Enclosure configuration error (VPD)
Low warning temperature alert
High warning temperature alert
Over-temperature alarm
2
I C bus failure
Ops panel communication error (I
RAID error
SBB interface module fault
SBB interface module removed
Drive power control fault
Drive power control fault
Drive removed
Insufficient power available
PCM faults
Table 22. PCM recommended actions
Symptom
Ops panel Module Fault LED is amber
Fan Fail LED is illuminated on PCM
Thermal monitoring and control
The storage enclosure system uses extensive thermal monitoring and takes a number of actions to ensure component
temperatures are kept low, and to also minimize acoustic noise. Air flow is from the front to the back of the enclosure.
Table 23. Thermal monitoring recommended actions
Symptom
If the ambient air is
below 25ºC (77ºF), and
the fans are observed to
increase in speed, then some
restriction on airflow may
be causing additional internal
temperature rise.
NOTE: This is not a fault
condition.
38 Troubleshooting and problem solving
Severity
Fault – critical
Warning
Warning
Fault – critical
Fault – loss of redundancy
2
C) Fault – critical
Fault – critical
Fault – critical
Warning
Warning – no loss of disk power
Fault – critical – loss of disk power
Warning
Warning
Cause
Any power fault
Fan failure
Cause
The first stage in the thermal
control process is for the fans
to automatically increase in speed
when a thermal threshold is
reached. This may be caused by
higher ambient temperatures in the
local environment, and may be
perfectly normal.
NOTE: This threshold changes
according to the number of
disks and power supplies
installed.
Recommended action
Verify AC mains connections to PCM are live
Replace PCM
Recommended action
1. Check the installation for any airflow restrictions at
either the front or back of the enclosure. A minimum
gap of 25 mm (1") at the front and 50 mm (2") at the
rear is recommended.
2. Check for restrictions due to dust build-up. Clean as
appropriate.
3. Check for excessive re-circulation of heated air from
rear to front. Use of the enclosure in a fully enclosed
rack is not recommended.
4. Verify that all blank modules are in place.
5. Reduce the ambient temperature.
Alarm
S1
S1
S1
S4
S1
S1
S1
S1
None
S1
S1
None
None