Table of Contents
1.0 Document Purpose ............................................................................................................... 4
2.0 Important Notice ................................................................................................................... 4
4.0 Related Documentation ........................................................................................................ 4
6.0 Acronyms ............................................................................................................................. 5
7.0 Product Identification ........................................................................................................... 7
7.0.1 HD400 DPE .......................................................................................................................... 7
8.0 Product Photos ..................................................................................................................... 8
9.0.2.3.1 HD400 PCBs ............................................................................................................... 15
11.2 Precious Metals ................................................................................................................ 27
11.3 Plastic Part Markings ....................................................................................................... 27
12.0 Disassembly Details ......................................................................................................... 28
12.0.2 Safety Precautions ........................................................................................................... 28
12.0.3.1
12.0.3.2
12.0.3.4
Removing the Suitcase .............................................................................................. 39
12.0.3.5
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
3
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