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UM10569
Store and transport requirements
Rev. 3.00 — 9 March 2015
Document information
Info
Content
Keywords
Storage, transport, shelf life, dry-baking, drying, dry-packing
Abstract
This document describes the store and transport requirements of final
commercial and semi-finished products of NXP Semiconductors
User manual
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Table of Contents
Related Manuals for NXP Semiconductors UM10569
Summary of Contents for NXP Semiconductors UM10569
- Page 1 Store and transport requirements Rev. 3.00 — 9 March 2015 User manual Document information Info Content Keywords Storage, transport, shelf life, dry-baking, drying, dry-packing Abstract This document describes the store and transport requirements of final commercial and semi-finished products of NXP Semiconductors...
- Page 2 For sales office addresses, please send an email to: salesaddresses@nxp.com UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 2 of 15...
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Page 3: Introduction
1. Introduction This specification describes the technical conditions of shelf life and transport of final commercial and semi-finished products of NXP Semiconductors. Other aspects like sales, warranty, legal and commercial issues are regulated by NXP’s “Terms and Conditions of commercial Sale“, see Ref. -
Page 4: Receiving Inspection
– In tropical conditions, the packing shall not be placed in direct sunlight. • Humidity UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 4 of 15... -
Page 5: Conditioned Air Transport
<60 % relative humidity) after diffusion process end (Fab. date code). UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 5 of 15... -
Page 6: Maximum Shelf Life Versus Humidity
MBB are safe. UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015... -
Page 7: Floor Life And Bake To Seal Time
Table 3 cover all versions except specifically mentioned versions UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 7 of 15... - Page 8 Remark: Baking deteriorates the solderability; do not bake for longer and not more often than required. UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 8 of 15...
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Page 9: Drying
UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 9 of 15... -
Page 10: Dry-Packing
Total units of desiccant required 48.3 125; 150 50.5 77.5 UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 10 of 15... -
Page 11: Humidity Indicator Card (Hic) Requirements
Remark: The Moisture Barrier Bag must not be folded or creased. Do not use any MBB that has been creased or crumpled. UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 11 of 15... -
Page 12: Sealing Requirements
UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 12 of 15... -
Page 13: References
Terms and conditions of commercial sale — http://www.nxp.com/about/sales-offices-distributors/general-terms-and-conditions-of -commercial-sale.html UM10569 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. User manual Rev. 3.00 — 9 March 2015 13 of 15... -
Page 14: Legal Information
NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance In no event shall NXP Semiconductors, its affiliates or their suppliers be liable with the Terms and conditions of commercial sale of NXP Semiconductors. -
Page 15: Table Of Contents
Contents ......15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com...
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