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3.2
Mounting Recommendation
NOTICE
The EE895 is not intended for reflow soldering and consequently it does not feature a moisture sensitivity
level rate (MSL). Nevertheless, for storage and handling it shall be regarded as compatible with MSL 1.
CAUTION
EE895 may only be soldered manually. A max. temperature of 360 °C may be applied for max. 10 s per
solder point.
ESD precautions shall be observed while manually soldering the EE895.
The EE895 can be mounted facing either upwards or downwards.
3.2.1.
Mounting via Solder Pads
The EE895 module can be mounted onto a pluggable female header or directly onto the electronics board by
using a pin-header with 2.54 mm (0.1 inch) pitch.
The minimum clearance of 2 mm (0.08 inch) shall be strictly observed. This is necessary for free air flow around
the CO
sensing cell and around the T/p sensor.
2
Air inlet through dust filter
towards CO sensing cell
Fig. 1
Mounting with soldered pin header
3.2.2.
Mounting via Side Plated Contacts
The EE895 can be mounted by manually soldering the plated half-holes onto the host board.
Air inlet through dust filter
towards CO sensing cell
Fig. 2
Mounting by soldering at the side plated contacts
Pluggable
male pins
female header
Soldered single pin header
male pins
Solder
Solder
T/p sensor
h>2 mm (0.08")
h>2 mm (0.08")
T/p sensor
T/p sensor
8 mm (0.32")
T/p sensor
Miniature Sensor Module for CO
User Manual EE895
, Temperature and Barometric Pressure | 7
2
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