Hardware Specification Of The Cpu Module; Performance Specification - Mitsubishi MELSEC- Q Q12PHCPU User Manual

4 HARDWARE SPECIFICATION OF THE CPU MODULE

4 HARDWARE SPECIFICATION OF THE CPU MODULE

4.1 Performance Specification

Item
Control method
I/O control mode
Sequence control
Programming dedicated language
language
Process control
language
4
Processing speed
(Sequence instruction)
Total number of instructions
Constant scan
(Function for setting the scan timer to fixed
settings)
Program 2 Program memory
capacity (Drive 0)
Memory card (RAM)
(Drive 1)
Memory card (ROM)
(Drive 2)
Memory
Standard RAM
capacity (Drive 3)
Standard ROM
(Drive 4)
CPU shared memory
3
Program memory
Memory card (RAM)
Memory
Maximum number
card
of stored files (ROM)
Standard RAM
Standard ROM
Standard ROM number of writings
1: 124 is the maximum number of programs that can be executed on Process CPU.
125 or more programs are not available.
2: The maximum number of sequence steps (for one program) for which the parameters are stored in another drive and executed with the
Process CPU can be calculated with the following expression.
(Program size) - (File header size (default: 34 steps))
Refer to the Process CPU User's Manual (Function Explanation, Program Fundamentals) for details on the program size and file.
3: The CPU shared memory is not latched. The CPU shared memory is cleared when the power is turned on to the PLC or when the
CPU module is reset.
4 - 1
The table below shows the performance specifications of the CPU module.
Performance Specifications
Q12PHCPU
Repetitive operation of stored program
Relay symbol language, logic symbolic language,
MELSAP3 (SFC), MELSAP-L, Function block
LD X0
MOV D0 D1
(excluding intelligent function module dedicated instructions)
0.5 to 2000 ms (configurable in increments of 0.5 ms)
124k step
Capacity of loading memory cards(2Mbyte max.)
(Flash card: 4 Mbyte max., ATA card: 32 Mbyte max.)
496 kbyte
124
Flash card
ATA card
124
Model
Q25PHCPU
Refresh mode
Process control FBD
0.034 s
0.102 s
415
252k step
Installed memory card capacity
256kbyte
1008 kbyte
8 kbyte
252
256
288
512
2
252
Max. 100000 times
MELSEC-Q
Remark
——
Direct I/O is possible by
direct I/O specification
(DX , DY )
——
Programming using PX
.
Developer
——
——
——
Set parameter values to
specify
——
For memory capacity,
see Section 7.1.
For memory capacity,
see Section 7.1.
——
——
——
——
1
——
——
——
Only one file register and
one local device
——
——
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