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Power Supplies
The WinLink E850-96Boards specification calls for three power rails to be present on the Low Speed Expansion Connector:
+1.8V
Max of 100mA
+5V Provide a minimum of 7.5W of power (2.5A).
SYS_DCIN
12-18V input with enough current to support all the board functions.
The WinLink E850 Development Board supports these requirements as follows:
+1.8V : Driven by PMIC S2MPU12 up to 450mA. It is the system IO power (VLDO14_PMIC), and it can supply power up to
450mA to the Low Speed Expansion Connector.
+5V
: Driven by a 8A System DC-DC buck converter (U4). It also provides the VBUS power to the two USB host
connectors (P2, P3) and the HDMI 5V power to the HDMI connector (CN3).The remaining capacity provides a max current
of 2A to the Low Speed Expansion Connector, for a total of 10W which meets the 96Boards requirements.
SYS_DCIN
Can serves as the board's main power source or can receive power from the board.
High Speed Expansion Connector
PIN 96Boards Signals
1
SD_DAT0/SPI1_DOUT
3
SD_DAT1
5
SD_DAT2
7
SD_DAT3/SPI1_CS
9
SD_SCLK/SPI1_SCL
11
SD_CMD/SPI1_DIN
13
GND
15
CLK0/CSI0_MCLK
17
CLK1/CSI1_MCLK
19
GND
21
DSI_CLK+
23
DSI_CLK-
25
GND
27
DSI_D0+
29
DSI_D0-
31
GND
33
DSI_D1+
35
DSI_D1-
37
GND
39
DSI_D2+
41
DSI_D2-
43
GND
45
DSI_D3+
47
DSI_D3-
49
GND
51
USB_D+
53
USB_D-
55
GND
57
HSIC_STR
59
HSIC_DATA
WinLink
E850-96Board
WinLink E850 Development Board Signals
SPI1_MO
NC
NC
SPI1_CS
SPI1_CK
SPI1_MI
GND
CAM_CLK0
CAM_CLK1
GND
TCP
TCN
GND
TDP0
TDN0
GND
TDP1
TDN1
GND
TDP2
TDN2
GND
TDP3
TDN3
GND
USB_DP_P1_EXP
USB_DM_P1_EXP
GND
NC
NC
Development Board Hardware User Guide
Note
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