Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH. TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it without special notification.
Handling and ESD tips General handling of your TQ-products The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations. A general rule is not to touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.
The TQMa93xxLA extends the TQ-Systems GmbH product range and offers an outstanding computing performance. All essential i.MX 93 signals are routed to the TQMa93xxLA LGA pads. There are therefore no restrictions for customers using the TQMa93xxLA with respect to an integrated customised design. All essential components like CPU, LPDDR4, eMMC, and PMIC are already integrated on the TQMa93xxLA.
The multiple pin configurations by different i.MX 93 internal function units must be taken note of. The pin assignment in Table 3 refers to a TQMa93xxLA with i.MX 93 CPU in combination with the carrier board MBa93xxLA. NXP provides a tool showing the multiplexing and simplifies the selection and configuration (i.MX Pins Tool NXP Tool).
3.1.1.1 Pinout TQMa93xxLA The TQMa93xxLA has a total of 281 LGA pads. The TQMa93xxLA is soldered and thus permanently connected to the carrier board. It is not trivial and it is not recommended to remove the TQMa93xxLA. The following table shows the TQMa93xxLA pad-out, top view through the TQMa93xxLA.
ROM and then loads the program image from the selected boot device. For example, the integrated eMMC or the optional QSPI NOR Flash can be selected as the default boot device. The following boot sources are supported by TQMa93xxLA: •...
Boot configuration This section provides information on boot mode configuration pads allocation and boot device interface allocation. The i.MX 93 uses four BOOT_MODE signals provided on the TQMa93xxLA's LGA pads. These require pull-up/pull-down (4.7 / 100 wiring to 3.3 V and Ground. However, the BOOT_MODE signals are not dedicated to this function, but have other functionalities in normal operation.
QSPI NOR Flash / NAND Flash QSPI NOR flash can optionally be assembled on the TQMa93xxLA. Because a separation of the signal paths is not possible, these LGA pads must not be wired when equipped with NOR Flash. With unpopulated NOR Flash the signals of the SD3 interface can be used outside the module.
EEPROM M24C64-D A 64 Kbit EEPROM is assembled by default on the TQMa93xxLA. The serial EEPROM is controlled by the I2C1 bus. The M24C64-D offers an additional page, named the Identification Page (32 Byte). The Identification Page can be used to store sensitive application parameters which can be (later) permanently locked in Read-only mode.
➢ The Accelerometer/Gyroscope has I C address 0x6A / 110 1010b 3.2.5 The TQMa93xxLA can use the internal Real Time Clock of the i.MX 93 or can be provided with an optional discrete RTC PCF85063A. 3.2.5.1 i.MX 93 internal RTC The i.MX 93 provides an internal RTC, which has its own power domain, supplied by the PMIC.
Overview Except for the internal interfaces, all functional pins of the i.MX 93 are routed to TQMa93xxLA LGA pads. Each customer must check the suitability of the multiplexing in the respective project and adapt it if necessary. The following table shows one...
For RGMII an IO voltage of 1.8 V and for RMII an IO voltage of either 1.8 V or 3.3 V is specified. Due to an operation of both modes with 1.8 V the rail NVCC_WAKEUP is set to 1.8 V. The signals are length matched on the TQMa93xxLA and routed with a The following table shows the signals used in RGMII mode.
Figure 10: Block diagram I I2C3 and I2C5 are provided as further buses, but without wiring on the TQMa93xxLA. Voltage levels and pull-up resistors are to be defined or placed outside the module. The PMIC PCA9451 additionally provides an integrated I2C level translator. It is connected to four LGA pads and can thus be used in customer designs.
MIPI-CSI represents a differential camera interface. Up to 1.5 Gbps are transmitted on two data pairs. A resolution of up to 2K is possible as image format. The differential signals are length matched on the TQMa93xxLA and routed with a differential...
The i.MX 93 has an LVDS controller with four differential lanes for data transmission. The LVDS PHY supports outputs up to 1366 x 768 pixels at 60 FPS. The differential signals are length matched on the TQMa93xxLA and routed with a differential impedance of...
The i.MX 93 has two USB 2.0 OTG controllers, each providing device, host or OTG ports at high speed (480 Mbps). The OTG signals are not available by default because their multiplexing overlaps with the ENET1 interface. already provided on the module. The differential signals are length matched on the TQMa93xxLA and routed with a d Figure 19: Block diagram USB interfaces...
Block diagram SD card interface Additionally the supply voltage V_SD2 is provided externally by the TQMa93xxLA. In customer designs this voltage can be used to connect the pull-up resistors of the SD card interface. Alternatively the use of CPU internal pull-up resistors is possible.
Reset and unspecific signals Two reset options are provided by the TQMa93xxLA. A reset is triggered by the signal PMIC_RST#. This signal is fed to the PMIC from outside, is low-active and has an internal pull-up. By default, the PMIC is configured so that activation triggers a cold reset.
Power supply The TQMa93xxLA requires a main supply voltage of 5 V ±5 %. All power supply and ground pads should be connected. Through V_LICELL the TQMa93xxLA has an input for the backup voltage supply of the optional discrete RTC PCF85063A. Please refer to chapter 3.2.5.2...
The TQMa93xxLA features a supervisor which monitors the input voltage (V If the input voltage drops below 4.38 V, a Reset (PMIC_ON_REQ) is triggered and the TQMa93xxLA is held in reset until the input voltage is in the permitted range again.
Power-Up sequence TQMa93xxLA / carrier board As the TQMa93xxLA operates with 5 V and the I/O voltages of the CPU signals are generated on the TQMa93xxLA, there are timing requirements for the carrier board design with respect to the voltages generated on the carrier board: After power up of the 5V supply for the TQMa93xxLA, the PMIC power-up sequence starts.
3.2.9 Impedances By default, all single- However, some interfaces on the TQMa93xxLA are routed with different impedances, depending on the signal requirements. The following table is taken from the Hardware Developer's Guide (3) and shows the respective interfaces: Table 30:...
Structural requirements The TQMa93xxLA has to be soldered on the carrier board. To ensure a high-quality connection of the LGA pads during reflow soldering of the TQMa93xxLA, the LGA pads must be free of grease and dirt.
Page 38 SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS The TQMa93xxLA was developed according to the requirements of electromagnetic compatibility (EMC). Depending on the target system, anti-interference measures may still be necessary to guarantee the adherence to the limits for the overall system.
Due to the occurring voltages (5 V DC), tests with respect to the operational and personal safety have not been carried out. Reliability and service life The MTBF calculated for the TQMa93xxLA is 1,113,855 hours with a constant error rate @ +40 °C, Ground Benign. The TQMa93xxLA is designed to be insensitive to shock and vibration.
By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. To be able to reuse the TQMa93xxLA, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled. The energy consumption of the TQMa93xxLA is minimised by suitable measures.
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