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connector supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is
provided in Appendix D.
The 3FF Micro-SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slot. The
routing can be selected in the BIOS and is set to the mPCIe slot by default. Please refer to the BIOS
user manual (Appendix B) for more information.
SO-DIMM1 & SO-DIMM2
Karbon 400 has two onboard DDR4 SO-DIMM slots:
Maximum Capacity: 32GB DDR4-3200 total using two 16GB SO-DIMM modules
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Channel configuration: 1 DIMM Per Channel (DPC) - 2 Channels
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In Band ECC Support (IBECC)
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RTC RESET
The snap dome tact switch behind the power button on the Karbon 400 motherboard may be used to
clear the CMOS settings in the BIOS. Remove external power to the system before clearing the CMOS.
Removing the RTC battery is not an accepted method for clearing BIOS settings.
BIOS EEPROM
If the BIOS needs to be updated, please refer to Appendix B for reflashing instructions.
Power Switch Header
The on-board power switch header can be used to control the power state of the Karbon 400 platform
in parallel with the front panel power button. Mating power switch cables should be a twisted-pair wire
with floating shield to assure proper immunity to EMI/RFI. The mating connector is a standard
2.54mm female header. It is recommended to keep wires at less than 3 meters in length. Switches
must be momentary contact type only.
RTC Battery Header
The RTC battery on the Karbon 400 platform is used to retain BIOS CMOS settings and maintain the
real-time clock for the system. If the RTC battery is low, CMOS settings will not be retained and you
may receive an alert in the operating system. Replacement batteries should be a UL listed type
CR2032 3V cell.
TPM header
Karbon 400 features an onboard TPM (Trusted Platform Module) header. It supports OnLogic' s
wide-temperature TPM 2.0 module (OnLogic TPM01). This gives the option to have a dedicated
secure module to secure the system through cryptographic keys.
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