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Onlogic K410 Product Manual

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K410 / K430 Product Manual

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Summary of Contents for Onlogic K410

  • Page 1 K410 / K430 Product Manual...

  • Page 2: Table Of Contents

    1.1 - System Introduction 1.2 - Accessories 1.3 - Product Specifications 1.4 - Exterior Dimensions 1.4.1 - Karbon 410 Dimensions (K410) 1.4.2 - Karbon 430 Dimensions (K430) 1.5 - System Block Diagram 2 - I/O Definitions 2.1 - Front I/O Definition...
  • Page 3 CAN Bus LAN 1 & 2 DisplayPort 2.3 - Top I/O Definition Antenna SMA Ports 2.4 - Motherboard Connectors M.2 B-Key M.2 E-Key mPCIe SO-DIMM1 & SO-DIMM2 RTC RESET BIOS EEPROM Power Switch Header RTC Battery Header TPM header Onboard Power Header High Speed Daughter Board B-Key 1 B-Key 2...
  • Page 4 4.2 - Protection Circuitry 5 - Regulatory Compliance 5.1 - FCC 5.2 - ISED 5.3 - CE 5.3.1 - EMC 5.3.2 - Safety 5.4 - UKCA 5.4.1 - EMC 5.4.2 - Safety 5.5 - Shock and Vibration 6 - Appendices 6.1 - Appendix A: Power Consumption 6.2 - Appendix B: BIOS Manual 6.3 - Appendix C: System Thermal Results...

  • Page 5: System Overview

    Sensitive internal components are protected from dust, debris, chemicals, and moisture with OnLogic's integrated Hardshell™ Fanless Technology. Its rugged design, -40° to 70°C operating temperature range, 9~48 V power input, and the absence of any moving parts dramatically improve the lifespan and reliability of the system.

  • Page 6: Product Specifications

    1.3 - Product Specifications Karbon K410 Karbon 430 Dimensions 180 x 123 x 50 mm 180 x 123 x 60 mm Intel Atom x6211E (2 core, 2 thread, 1.3~3.0 GHz, 6W) Intel Atom x6425E (4 core, 4 thread, 2.0~3.0 GHz, 12W)
  • Page 7 -40~85°C, Storage 10~95% non-condensing, Operating Humidity 0~95% non-condensing, Storage Shock Tested according to IEC 60068-2-27 and MIL-STD-810H Method 516.6 Vibration Tested according to IEC 60068-2-64 and MIL-STD-810H Method 514.6 FCC part 15b (Class A), CE, VCCI, RCM Meets requirements of CE Directives for I.T.E. (EMC 2014/30/EU, ErP 2009/125/EC, Low Voltage 2014/35/EU, Radio Equipment 2014/53/EU, RoHS 3 EU 2015/863, WEEE 2002/96/EC) Meets requirements of IEC 60601-1-2:2014 Medical Electrical Equipment...
  • Page 8 Version of Software Intel PROSet/Wireless WiFi Software firmware/soft 20..x and following versions for WIFI/BT ware PIFA Antenna (2dBi / 2dBi Gain for 2.4 and 5GHz) Specifications RP-SMA connector...

  • Page 9: Exterior Dimensions

    1.4 - Exterior Dimensions 1.4.1 - Karbon 410 Dimensions (K410) 1.4.2 - Karbon 430 Dimensions (K430)

  • Page 10: System Block Diagram

    1.5 - System Block Diagram...

  • Page 11: I/O Definitions

    S5 and deep sleep states. SIM Card A 3FF Micro-SIM card slot is present on the front panel of the Karbon 400 platform allowing native support for OnLogic Extrovert 4G LTE modules. The SIM signals can be connected to either the mPCIe...

  • Page 12: Usb 2.0

    10Gbps transfer rates. ModBay COM Expansion The K400 platform supports an optional COM DB9 add-in card (OnLogic MOD109). The serial port mode and voltage between Off/5V/12V on Pin 9 on K400 can be selected in the BIOS configuration.

  • Page 13: Led Functionality

    For a complete explanation of features, operating voltages, and safety information, please refer to the DIO expansion information on the OnLogic support site. https://www.onlogic.com/support/documentation/mod110-dio/ Definition Definition Power In0/QEP0A Out0/PWM0 In1/QEP0B Out1/PWM1 In2/QEP0I Out2/PWM2 In3/QEP1A Out3 In4/QEP1B Out4...

  • Page 14: Bottom I/O Definition

    2.2 - Bottom I/O Definition K410 Bottom I/O K430 Bottom I/O 3-Pin Terminal Power Connector Mainboard power is applied to the Karbon 400 platform by Dinkle 2EHDRM-03P (Mating part: Dinkle: 2ESDVM-03P or equivalent 5.08mm pitch terminal plug). The system is operational from 9V~48V. The maximum rated current of the connector is 15A per pin.

  • Page 15: Can Bus

    CAN device over HECI is provided, and applications can also interact with the HECI driver directly. For more information, please refer to our technical documentation on the OnLogic support site. The internal CAN signals are unterminated; the CAN device should be externally terminated. 3-pin CAN Bus ●...

  • Page 16: Displayport

    Color State Function LAN link not established LAN link Link established Green LAN activity Blinking occurring 10 Mb/s data rate 100 Mb/s Speed Green data rate 1000 Mb/s Yellow data rate LAN Activity Light Definition DisplayPort The Karbon 400 platform utilizes Intel’ s Integrated processor graphics that power the onboard DisplayPort with support for resolutions up to 4096x2304 at 60Hz.

  • Page 17: Top I/O Definition

    2.3 - Top I/O Definition Antenna SMA Ports The Karbon 410 and 430 both have four SMA ports for antennas on the top of the system. The Karbon 430 includes two additional SMA ports on the front of the system.

  • Page 18: Motherboard Connectors

    2.4 - Motherboard Connectors The motherboard is the same for K410 and K430. M.2 B-Key An M.2 B-Key slot on the Karbon 400 motherboard provides support for B-Key form-factor expansion cards. Supported cards include 3042, 2242, 2260, 2280 form-factors. The B-Key connector supports PCIe Gen 3 x2, USB 3.2 5Gbps, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen...

  • Page 19: So-Dimm1 & So-Dimm2

    CR2032 3V cell. TPM header Karbon 400 features an onboard TPM (Trusted Platform Module) header. It supports OnLogic’ s wide-temperature TPM 2.0 module (OnLogic TPM01). This gives the option to have a dedicated secure module to secure the system through cryptographic keys.

  • Page 20: Onboard Power Header

    Onboard Power Header An onboard connector is provided for power to internal expansion cards. The connector is a JST 2.0mm PH series connector (pn: B4B-PH-K-S). A suitable mating connector from the same series should be used. The Pinout is provided below. The maximum operating current per pin is 2A. The header is only powered while the system is in the S0 operating state.

  • Page 21: Sim 1

    There are two 3FF SIM slots on the daughter board to support networking capabilities. One SIM slot is externally accessible, with the other accessed on the bottom of the HSIO card. M.2 B-Key 2 The lower B-Key slot is provided to allow support for B-Key form-factor PCIe and USB expansion cards.

  • Page 22: Mounting Instructions

    3 - Mounting Instructions 3.1 - Wall Mounting (MTW101) Step 1: Attach wall mounting brackets to the chassis using the provided screws. To assemble, locate the four holes in the chassis that line up to the two countersunk holes in each wall mount bracket. Screw type: M3x0.5 FH 120 Degree Length: 4 mm Step 2: Take care to ensure that the brackets are oriented correctly and that the part of the brackets in...

  • Page 23: Din Rail Mounting - Edge (Mtd102)

    3.2 - DIN Rail Mounting - Edge (MTD102) Step 1: Attach DIN Clip to the back of the chassis using the provided screws. To assemble, locate the two holes in the back of the chassis that line up to the two countersunk holes on the DIN clip. Screw type: M3x0.5 FH 120 Degree Length: 6 mm Step 2: The orientation of the DIN clip is interchangeable between the two options.

  • Page 24: Din Rail Mounting - Bottom (Mtd103)

    3.3 - DIN Rail Mounting - Bottom (MTD103) Step 1: Attach wall mounting brackets to the chassis using the provided screws. To assemble, locate the four holes in the chassis that line up to the two countersunk holes in each wall mount bracket. Screw type: M3x0.5 FH 120 Degree Length: 4 mm Step 2: Take care to ensure that the brackets are oriented correctly and that the part of the brackets in...

  • Page 25: Vesa Mounting (Vmpl-1056)

    3.3 - VESA Mounting (VMPL-1056) Step 1: Attach VESA mounting plate to the chassis using the provided screws. Align the four holes on the VESA mounting plate with the corresponding holes on the chassis bottom. Screw type: M3x0.5 FH 120 Degree Length: 4 mm Step 2: Attach system to a corresponding VESA MIS-D 75 or MIS-D 100 mounting pattern using the supplied M4x0.7 slotted standoffs.

  • Page 26: Power Management

    4 - Power Management 4.1 - Wake-Up Events The Karbon 400 platform supports multiple power states. The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters. Wake-Up Event From ACPI State Comments...

  • Page 27: Regulatory Compliance

    5 - Regulatory Compliance The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the CE mark. Modification of the system may void the certifications. Testing included: EN 55032, EN 55035, EN 60601-1, EN 62368-1, EN 50121-3-2, and UN Regulation No.

  • Page 28: Appendices

    6 - Appendices 6.1 - Appendix A: Power Consumption The power consumption of the K410 and K430 was measured for various system configurations, workloads, and power states at both 9V and 48V system input voltages. Tests were performed using Burnintest v9.0 build 1012 to stress system components with and without graphics enabled. The build configurations and power consumption are listed in the tables below.
  • Page 29 Config 1 Low K410 Power Consumption 9V (avg W) 48V (avg W) Windows Idle CPU / system Stress 12.0 13.1 CPU / System & 12.3 13.3 Graphics Stress 1.58 1.87 1.05 1.36 Deep S5 0.04 0.19 Config 2 Mid K410...

  • Page 30: Appendix B: Bios Manual

    6.2 - Appendix B: BIOS Manual For a detailed overview of the BIOS screens and individual settings, please refer to the OnLogic support site. Instructions for updating the BIOS can also be found on the support site. Please refer to the link below for detailed instructions.

  • Page 31: Appendix C: System Thermal Results

    Samples of data collected during one of these thermal evaluations for this platform are shown below. The sample data was collected during a test of the K410 chassis with the x6425E processor, 64 GB of DDR4 RAM and an NVMe storage drive. Of note in these results is the fact that no significant drops (10% or more) were observed in core frequency or package power.

  • Page 32: Appendix D: Expansion Port Pinout

    6.4 - Appendix D: Expansion Port Pinout 6.4.1 - M.2 B-Key Function Function CONFIG_3 3.3V 3.3V FULL_CARD_POWER_OFF# USB 2.0 D+ W_DISABLE1# USB 2.0 D- CONFIG_0 GPIO_10/W_DISABLE2# PERn1/USB3.1-Rx- UIM-RESET PERp1/USB3.1-Rx+ UIM_CLK UIM_DATA PETn1/USB3.1-Tx- UIM_PWR PETp1/USB3.1-Tx+ PERn0/SATA-B+ PERp0/SATA-B- PETn0/SATA-A- PETp0/SATA-A+ PERST# CLKREQ# REFCLKn PEWAKE# REFCLKp...

  • Page 33: M.2 E-Key

    6.4.2 - M.2 E-Key Function Function 3.3 V USB_D+ 3.3 V USB_D- PCM_CLK RESERVED CNV_RF_RESET#_R RESERVED BT_PCMIN BT_PCMOUT RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED PETp0 RESERVED PETn0 RESERVED RESERVED PERp0 RESERVED PERn0 RESERVED RESERVED REFCLKp0 RESERVED REFCLKn0 SUSCLK(32kHz) PERST0# CLKREQ0# W_DISABLE2# PEWAKE0#...

  • Page 34: Mpcie

    6.4.4 - mPCIe Function Function WAKE# 3.3V 1.5V CLKREQ# UIM_PWR UIM_DATA REFCLK- UIM_CLK REFCLK+ UIM_RESET UIM_SPU W_DISABLE1# PERST# PERn0 3.3V PERp0 1.5V SMB_CLK PETn0 SMB_DATA PETp0 USB 2.0_D- USB 2.0_D+ 3.3V 3.3V 1.5V W_DISABLE2# 3.3V...

  • Page 35: Appendix F: Safety Information

    6.5 - Appendix F: Safety Information Do not open or modify the device. The device uses components that comply with FCC and CE regulations. Modification of the device may void these certifications. Ne pas ouvrir ni modifier l'appareil. L'appareil utilise des composants conformes aux réglementations FCC et CE.

  • Page 36: Précautions Et Guide D'installation

    6.5.2 - Précautions et guide d’installation 1. Installez l’appareil en toute sécurité. Soyez prudent lors de la manipulation de l'appareil pour éviter les blessures et ne pas faire tomber. 2. Pour vous protéger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF.

  • Page 37: Appendix G: Errata

    6.6 - Appendix G: Errata 6.6.1 FE-1: RS422 and RS485 Require SerCx2 Overview Category: Software / Drivers SKU(s) Affected: K410, K430 Revision(s) Affected: All release hardware Revision Resolved: Workaround Severity: Description Configuring the system to use RS422 or RS485 serial modes on Windows requires using the SerCx2.sys driver framework.
  • Page 38 Description For all PCB revisions (5R1-5R5), the SIM slot connects the digital and chassis ground planes, removing isolation between the two. Under normal operating conditions, the function of the motherboard should not be affected. Customers who rely on chassis ground isolation are recommended to isolate the chassis from earth ground externally.

This manual is also suitable for:

K430

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