*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the
arrow.
8.2.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering
iron as shown in the figure below.
8.3. TEST CHART
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