Huawei FusionServer G5500 Manual page 55

Inspur: NF5288M5(AGX-2)
www.huawei.com ▪ Huawei Confidential ▪
Parameter
Dimensions (H x W x D)
Architecture
CPU
Maximum CPU power
GPU
Maximum GPU power
CPU:GPU topology
Hard drive
RAID
PCIe expansion
On-board network adapter
Power supply
Fan
Temperature
Beating Points
• The integrated design of the chassis does not support independent evolution of the CPUs and GPUs.
• Scalable Processors are supported but only up to 165 W, which is difficult to expand in the future. (Note that Huawei
G5500 supports only v4 processors.)
• PCIe GPU model. Only the front panel supports 2*PCIe x16 LP cards, and the cards block air ventilation.
• The maximum power consumption of the power module is 3000 W. When NVLink GPUs are used, the full-load power
consumption exceeds 3000 W, which does not support 1+1 redundancy.
• The power modules locate at the front and are routed to the rear of the chassis.
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G5500-G560 Inspur NF5288M5(AGX-2)
4U (175*447*790) 2U (448*899.5*87.5)
Modular Integrated
2S + 24DIMM 2S + 16DIMM
145 W (the model can be expanded to 165 W
205 W)
8*P100/P40 8*P100/V100 NVLink or P100/P40 PCIe
350 W 300 W
1:8/1:4 flexible configuration 1:8
6*2.5'' NVMe SSD
8*2.5 NVMe/SAS/SATA SSD/HDD
2*2.5'' SAS/SATA HDD
8*3.5'' HDD
RAID 0/1/10/5/50/6/60 RAID 0/1/10/5/50/6/60
4*PCIe x16 LP
2*PCIe x16 LP (front panel) + 4*PCIe x16 LP (rear
panel in the case of NVLink)
4*10GE
4*2200 W hot swap, 2+2 2*3000 W hot swap, 1+1 (the power modules
locate at the front and are routed to the rear)
6 hot swap, 5+1 The built-in fans do not support hot swap. When
the fan fails, heat dissipation is affected.
5°C to 35°C 5°C to 35°C