Huawei FusionServer G5500 Manual page 29

HPE: Apollo 6500+Power Shelf
2S + 16DIMM
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Parameter
Dimensions (H x W x D)
Architecture
8*GPU
CPU
Maximum CPU power
GPU
Maximum GPU power
CPU:GPU topology
Hard drive
RAID
PCIe expansion
On-board network adapter
Power supply
Fan
Temperature
Beating Points
• The chassis uses a modular design. A power shelf is required.
• In the 1:8 and 1:4 topologies, P2P cannot be implemented between 8 cards and 4 cards.
• Only 16 DIMMs are supported, and the memory capacity is limited.
• NVMe SSD is not supported.
• When more than 5 P100 GPUs are configured, the maximum temperature supported is only
25°C, which restricts its application.
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28
G5500-G560 Apollo 6500
4U (175*447*790) 4U (177*448*960) +
Modular Modular, dual nodes
2S + 24DIMM Single node: 2S +
145 W 145 W
8*P100/P40/P4 Single node: 8*P100/P40
350 W 300 W
1:8/1:4 flexible configuration Single node: 1:8/1:4 (optional)
6*2.5'' NVMe SSD Single node: 8*2.5'' SAS/SATA SSD/HDD
2*2.5'' SAS/SATA HDD
8*3.5'' HDD
RAID 0/1/10/5/50/6/60 RAID 0/1/10/5/50/6/60
4*PCIe x16 Single node: 2*PCIe x16 LP + 1*PCIe x8 LP
(RAID controller card)
Single node: 2 x GE
4400 W hot swap, 2+2 External power shelf, 6*2650W hot swap, 3+3
6 hot swap, 5+1 8 hot swap
10°C to 35°C. The specifications lower
5°C to 35°C
when more than 5 GPUs
1.5U (65*448*784)
16DIMM
to 25°C
(P100) are configured.