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Huawei FusionServer G5500 Manual page 49

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Asus: ESC8000 G3
www.huawei.com ▪ Huawei Confidential ▪
Parameter
G5500-G560
4U (175*447*790)
Dimensions (H x W x D)
Architecture
Modular
CPU
2S + 24DIMM
Maximum CPU power
300 W
GPU
8*P100/P40
Maximum GPU power
350 W
CPU:GPU topology
Flexible 1:8/1:4 Configuration
Hard drive
6*2.5'' NVMe SSD
2*2.5'' SAS/SATA HDD
8*3.5'' HDD
RAID
RAID 0/1/10/5/50/6/60
PCIe expansion
4*PCIe x16
On-board network adapter
/
Power supply
4*2200 W hot swap, 2+2
Fan
6 hot swap, 5+1
Temperature
5°C to 35°C
Beating Points
The integrated design of the chassis does not support independent evolution of the CPUs and GPUs.
The CPU:GPU topology is fixed and cannot be flexibly configured.
NVMe SSD is not supported. When the SAS drive is used, it needs to occupy the extended PCIe slot.
The 14 fans are built-in, and there are two types of fans, which require opening the chassis for maintenance.
Three 1600 W power modules do not support N+N redundancy, and the capacity expansion is limited and cannot be
evolved.
A large number of cables are connected inside the chassis, which is inconvenient for maintenance.
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48
Asus ESC8000 G3
3U (130.6*447*759)
Integrated
2S + 24DIMM
145 W
8*P100/P40
300 W
1:8 (1:4)
6*2.5'' SATA SSD/HDD,
Supports SAS SSD/HH D when the PCIe RAID controller card is configured.
PCH: RAID 0/1/10/5
When the PCIe RAID card is used: RAID 0/1/10/5/50/6/60
1*PCIe x8 LP card. When the 8*dual-slot cards are not fully configured, 1*PCIe
x8 FHFL card can be configured.
2*GE
3*1600 W hot swap, 2+1
The built-in fans do not support hot swap. When the fan fails, heat dissipation is
affected.
10°C to 35°C

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